Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
Discover essential electronic components for your devices, including CPU accelerators, system cache controllers, computer processors, motherboards, and graphics computing systems. Enhance device performance and connectivity with reliable components engineered for seamless integration and optimal functionality.
Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
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The Texas Instruments SNC54S188W is a 32x8 OTP ROM IC with 50ns access time, operating b/w -55°C to 125°C. It has a supply voltage of 5V and max current draw of 110mA. Ideal for military applications due to MIL-STD-883 Class B screening level.
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Corphita
Ceramic packages provide excellent protection for the internal components of the OTP ROM, ensuring durability and reliability in harsh operating environments.
Surface mount technology makes installation and assembly of the OTP ROM easier and more efficient, saving time and reducing production costs.
The modified MIL-STD-883 Class B screening ensures high quality and reliability of the OTP ROM, meeting stringent military standards for performance and durability.
The 5V supply voltage provides stable and consistent power to the OTP ROM, ensuring optimal performance and reliability.
The high maximum operating temperature of 125°C allows the OTP ROM to function reliably in extreme temperature conditions, making it suitable for a wide range of applications.
With a capacity for 32 words, the OTP ROM offers ample storage for data and program code, making it suitable for various applications requiring medium-sized memory storage.
The TTL technology used in the OTP ROM ensures fast and reliable data processing, making it ideal for applications that require high-speed operation.
OTP ROM SNC54S188W attributes and parameters. Explore more OTP ROM devices from Texas Instruments
Maximum Access Time:
JESD-30 Code:
Memory IC Type:
Memory Width:
No. of Terminals:
No. of Words:
No. of Words Code:
Maximum Operating Temperature:
Minimum Operating Temperature:
Organization:
Package Body Material:
Package Code:
Package Equivalence Code:
Package Shape:
Package Style (Meter):
Power Supplies (V):
Qualification:
Screening Level:
Sub-Category:
Maximum Supply Current:
Nominal Supply Voltage / Vsup (V):
Surface Mount:
Technology:
Temperature Grade:
Terminal Form:
Terminal Pitch:
Terminal Position:
SNC54S188W Memory ICs trade compliance attributes, and parameters.
ECCN
EAR99
ECCN Governance
EAR
HTS
8542.32.00.71
SB
8542.32.00.70
Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.
President, CEO
Haviv Ilan
Chairman
Richard K. Templeton
Senior VP, CFO
Rafael R. Lizardi
M - Fab
Fabrication
Fab Initiation
1997
USA
South Portland
Wafer Capacity
32,000
D - FAB
1966
Dallas
42,000
D MOS - 6
2002
25,000
D MOS - 5
1995
75,000
Miho - 8
1980
Japan
Inashiki
43,000
S FAB 1
Sherman
91,000
F - FAB
2001
Germany
Freising
37,000
R Fab 1
2010
Richardson
40,000
D HC Line
1999
2,000
JV3
Aizu Wakamatsu
45,000
C - FAB
2007
China
Chengdu
30,000
L - Fab
2015
Lehi
70,000
R - Fab 2
2022
S - FAB 2
2025
S - FAB 3
2028
SMMBT3904LT1G
Onsemi
SMMBT3904LT1G by Onsemi is a NPN BJT with 3 terminals, 0.3W power dissipation, and 40V max collector-emitter voltage. Ideal for small outline applications requiring a transistor with hFE of at least 30, it operates up to 150°C and has a transition frequency of 300MHz.
LM358N
Fairchild Semiconductor
OPERATIONAL AMPLIFIER; Temperature Grade: COMMERCIAL; Terminal Form: THROUGH-HOLE; No. of Terminals: 8; Package Code: DIP; Package Shape: RECTANGULAR;
LL4148
Secos
RECTIFIER DIODE; Terminal Position: END; Terminal Form: WRAP AROUND; No. of Terminals: 2; Surface Mount: YES; Package Shape: ROUND;
1N4148WS
Taiwan Semiconductor
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: FLAT; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
LM317T
Micro Commercial Components
ADJUSTABLE POSITIVE SINGLE OUTPUT STANDARD REGULATOR; No. of Terminals: 3; Terminal Form: THROUGH-HOLE; Moisture Sensitivity Level (MSL): 1; Maximum Output Current-1: 1.5 A; Operating Temperature (TJ-Min): 0 Cel;
LM107H
National Semiconductor
OPERATIONAL AMPLIFIER; Temperature Grade: MILITARY; Terminal Form: WIRE; No. of Terminals: 8; Package Code: TO-99; Package Shape: ROUND;
2N7002
Nexperia
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): .83 W; No. of Elements: 1; Transistor Application: SWITCHING;
ULN2803A
STMicroelectronics
NPN; Configuration: 8 BANKS, DARLINGTON WITH BUILT-IN DIODE AND RESISTOR; Surface Mount: NO; Maximum Collector Current (IC): .5 A; No. of Elements: 8; Minimum DC Current Gain (hFE): 1000;
SS14
Meritek Electronics
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
LAN8720A-CP-TR
Microchip Technology
LAN8720A-CP-TR by Microchip: Ethernet transceiver with 100 Mbps data rate, operates at 3.3V, and consumes 54mA max supply current. Ideal for network interfaces in commercial applications due to its small size (4x4mm) and low power consumption.
1N4148
First Components International
RECTIFIER DIODE; Surface Mount: NO; No. of Phases: 1; Maximum Operating Temperature: 200 Cel; Config: SINGLE; No. of Elements: 1;
Vishay Telefunken
RECTIFIER DIODE; Terminal Position: AXIAL; Terminal Form: WIRE; No. of Terminals: 2; Surface Mount: NO; Package Shape: ROUND;
OPA2277UA/2K5E4
Texas Instruments
OPA2277UA/2K5E4 by Texas Instruments is a dual operational amplifier with low-offset and micropower features. It has a max input offset voltage of 100uV, nominal common mode reject ratio of 140dB, and min slew rate of 0.8V/us. Ideal for industrial applications requiring precise signal amplification in compact designs.
Sangdest Microelectronics (Nanjing)
BSS138
Weitron Technology
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): .225 W; Terminal Form: GULL WING; Terminal Position: DUAL;
Rugao Dachang Electronic
LAN8720AI-CP-TR
Standard Microsystems
ETHERNET TRANSCEIVER; Temperature Grade: INDUSTRIAL; Terminal Form: NO LEAD; No. of Terminals: 24; Package Code: HVQCCN; Package Shape: SQUARE;
SN65HVD234DR
SN65HVD234DR by Texas Instruments is an 8-terminal interface circuit with a data rate of 1 Mbps. Operating temperature ranges from -40 to 125 °C, making it ideal for automotive applications. With a supply voltage of 3.3 V and low current draw of 6 mA, it's suitable for network interfaces in compact designs.
BAV99
Daco Semiconductor
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 3; Surface Mount: YES; Package Shape: RECTANGULAR;
Unitrode
DS2502P-E64
Dallas Semiconductor
OTP ROM; Temperature Grade: INDUSTRIAL; No. of Terminals: 6; Package Shape: RECTANGULAR; Terminal Position: DUAL; Maximum Operating Temperature: 85 Cel;
SMJ2516-45JM
SMJ2516-45JM by Texas Instruments is a 2KX8 OTP ROM with 16384 bit memory density. It operates at -55 to 125 °C, with 450 ns access time. Commonly used in military applications due to its MIL-38535 screening level and MOS technology.
5962-01-218-8478
Texas Instruments' 5962-01-218-8478 is a 512x8 OTP ROM with 4096-bit memory density. Operating at 5V, it offers a max access time of 75ns and operates in commercial temperature grades. This rectangular ceramic package with 20 terminals is ideal for applications requiring non-volatile memory storage in TTL technology.
TBP18SA030JP4
TBP18SA030JP4 by Texas Instruments is a 32x8 OTP ROM with 5V supply, 40ns access time, and 110mA max supply current. It features a ceramic rectangular package with 16 terminals in an in-line style. Ideal for commercial applications requiring reliable non-volatile memory storage.
AT27C1024-45PU
AT27C1024-45PU by Microchip Technology is a 64KX16 OTP ROM with 3-STATE output. It operates at 5V, has a programming voltage of 13V, and offers a max access time of 45ns. Ideal for industrial applications requiring non-volatile memory storage in a compact IN-LINE package style.
DS1982-F3
Maxim Integrated
DS1982-F3 by Maxim Integrated is a 1024-bit OTP ROM with a 1KX1 organization. Operating at an industrial temperature grade, it has a max access time of 15000 ns and operates in serial mode. This metal package with round shape and disk button style is suitable for applications requiring non-volatile memory storage in harsh environments.
TBP18SA42J
TBP18SA42J by Texas Instruments is a 512x8 OTP ROM with 4096-bit memory density and 75ns max access time. It features TTL technology, operates b/w 0-70°C, and has a rectangular ceramic package with 20 terminals. Ideal for commercial applications requiring non-volatile memory storage in electronic devices.
5962-01-159-2494
Texas Instruments' 5962-01-159-2494 is a MILITARY-grade OTP ROM with 1KX4 organization, 4096-bit memory density, and 75ns access time. It operates b/w -55 to 125 °C and has a rectangular ceramic package suitable for military applications.
BQ2022LPRE3
BQ2022LPRE3 by Texas Instruments is a 1KX1 OTP ROM memory IC with 1024-bit memory density. It operates asynchronously at a max clock frequency of 0.01667 MHz and has an open-drain output characteristic. This CMOS technology device is commonly used in applications requiring low power consumption and secure non-volatile data storage.
5962-01-218-8480
Texas Instruments' 5962-01-218-8480 is a 512x8 OTP ROM with memory density of 4096 bit. It operates at 5V, has a max access time of 75ns, and supports TTL technology. This rectangular ceramic package with 20 terminals is ideal for commercial applications requiring non-volatile memory storage.
TBP24S10J4
TBP24S10J4 by Texas Instruments is a 256x4 OTP ROM with 1024-bit memory density. It operates at a nominal voltage of 5V and has a max access time of 55ns. This IC, housed in a ceramic rectangular package, is ideal for commercial applications requiring reliable non-volatile memory storage.
JBP18S42MJ
JBP18S42MJ by Texas Instruments is a MILITARY-grade OTP ROM with 512x8 organization and 4096-bit memory density. It operates at temperatures ranging from -55 to 125 °C, with a max access time of 85 ns. Ideal for applications requiring reliable non-volatile memory storage in harsh environments.
TBP18SA22J
TBP18SA22J by Texas Instruments is a 256x8 OTP ROM with 2048-bit memory density. Operating at 5V, it has a max access time of 70ns and operates in commercial temperature grades. This rectangular ceramic package with 20 terminals is ideal for applications requiring non-volatile memory storage in TTL technology environments.
CBP18S030MJ
The Texas Instruments CBP18S030MJ is a MIL-STD-883 Class B OTP ROM with 32x8 organization, 50ns access time, and 16 terminals. It operates b/w -55 to 125°C and has a supply voltage of 5V. Ideal for military applications requiring reliable non-volatile memory storage in harsh environments.
SN74S478NP3
SN74S478NP3 by Texas Instruments is a 1KX8 OTP ROM with 8192-bit memory density and 70ns max access time. It operates at a nominal voltage of 5V, suitable for commercial-grade applications requiring reliable non-volatile memory storage in a rectangular plastic/epoxy package.
5962-01-165-3131
Texas Instruments' 5962-01-165-3131 is a 32X8 OTP ROM with 5V supply, 40ns access time, and 110mA max supply current. Ideal for commercial applications requiring fast memory access in a rectangular plastic package with through-hole terminals.
TBP28L166N3
TBP28L166N3 by Texas Instruments is a 2Kx8 OTP ROM with 16384-bit memory density. It operates at a nominal voltage of 5V and has a max access time of 125ns. This rectangular package with 24 terminals is ideal for commercial applications requiring reliable non-volatile memory storage.
TBP18SA42JP4
TBP18SA42JP4 by Texas Instruments is a 512x8 OTP ROM with 4096-bit memory density and 75ns max access time. It operates b/w 0-70°C, suitable for commercial applications requiring reliable non-volatile memory storage in a ceramic rectangular package with 20 terminals.
JBP18S030MJ
JBP18S030MJ by Texas Instruments is a 256-bit OTP ROM with 32x8 organization, operating at 5V. It features a max access time of 50ns and operates in MILITARY temperature grade. Suitable for applications requiring reliable non-volatile memory storage in harsh environments.
AT27C040-70PU
AT27C040-70PU by Microchip: 512KX8 OTP ROM with 70 ns access time, operates at 5V. Ideal for industrial applications requiring reliable non-volatile memory storage in a compact 32-terminal package.
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UCC27284DRCR
UCC27284DRCR by Texas Instruments is a MOSFET gate driver with 2 channels, capable of handling a max output current of 3.5A. It operates in automotive-grade temperatures (-40 to 125°C) and has a turn-on/off time of 30µs. This chip carrier package with very thin profile is suitable for high side driver applications requiring fast switching speeds.
DRV3255EPAPRQ1
DRV3255EPAPRQ1 by Texas Instruments is a Motion Control IC with 64 terminals, operating at -40 to 150°C. It is an AEC-Q100 compliant automotive-grade IC for Brushless DC Motor control, supporting supply voltages from 5V to 90V and output currents up to 3.5A. The package style includes a flatpack with heat sink/slug, suitable for surface mount applications in automotive systems.
LMR43610MSC3RPERQ1
LMR43610MSC3RPERQ1 by Texas Instruments is a 9-terminal switching regulator with a max output voltage of 32V and max output current of 1A. Ideal for automotive applications, it operates b/w -40 to 150°C, featuring a buck switcher config and PWM control mode at up to 2200kHz frequency.
DRV8316RRGFR
DRV8316RRGFR by Texas Instruments is a motion control IC with a rectangular package and a terminal form of gull wing. It has a max output current of 8A and can operate at temperatures ranging from -40 to 125°C. This IC is commonly used as a brushless DC motor controller in automotive applications.
TPS7A4301DGQR
TPS7A4301DGQR by Texas Instruments is an adjustable positive single output LDO regulator with a max output voltage of 14.5V and a dropout voltage of 0.6V. It operates in temperatures ranging from -40 to 125°C, making it suitable for various applications requiring precise voltage regulation in compact spaces.
DS160PT801ACBR
DS160PT801ACBR by Texas Instruments is a bus controller IC with 339 terminals, operating at -40 to 85°C. It supports PCI bus compatibility with a data transfer rate of 2000 MBps. This CMOS technology device has a thin profile and fine pitch package suitable for industrial applications.
CC2662R1FTWRGZRQ1
CC2662R1FTWRGZRQ1 by Texas Instruments is a 32-bit microcontroller with Cortex-M4F CPU, 48 MHz clock frequency, and 81920 bytes of RAM. Ideal for industrial applications, it features 8 ADC channels, 32 DMA channels, and peripherals like AES and PWM for efficient system integration.
SNC54186J
OTP ROM; Temperature Grade: MILITARY; No. of Terminals: 24; Package Code: DIP; Package Shape: RECTANGULAR; JESD-30 Code: R-XDIP-T24;
SNC54186W
OTP ROM; Temperature Grade: MILITARY; No. of Terminals: 24; Package Code: DFP; Package Shape: RECTANGULAR; Package Style (Meter): FLATPACK;
SNC54S188J
OTP ROM; Temperature Grade: MILITARY; No. of Terminals: 16; Package Code: DIP; Package Shape: RECTANGULAR; No. of Words: 32 words;
SNC54S2708J
OTP ROM; Temperature Grade: MILITARY; No. of Terminals: 24; Package Code: DIP; Package Shape: RECTANGULAR; Terminal Pitch: 2.54 mm;
SNC54S3708J
OTP ROM; Temperature Grade: MILITARY; No. of Terminals: 24; Package Code: DIP; Package Shape: RECTANGULAR; No. of Words Code: 1K;
SNC54S470J
OTP ROM; Temperature Grade: MILITARY; No. of Terminals: 20; Package Code: DIP; Package Shape: RECTANGULAR; Power Supplies (V): 5;
SNC54S471J
OTP ROM; Temperature Grade: MILITARY; No. of Terminals: 20; Package Code: DIP; Package Shape: RECTANGULAR; No. of Words Code: 256;
SNC54S472J
OTP ROM; Temperature Grade: MILITARY; No. of Terminals: 20; Package Code: DIP; Package Shape: RECTANGULAR; No. of Words: 512 words;
SNC54S473J
OTP ROM; Temperature Grade: MILITARY; No. of Terminals: 20; Package Code: DIP; Package Shape: RECTANGULAR; Technology: TTL;
SNC54S474J
SNC54S474W
OTP ROM; Temperature Grade: MILITARY; No. of Terminals: 24; Package Code: DFP; Package Shape: RECTANGULAR; Surface Mount: YES;
SNC54S475J
OTP ROM; Temperature Grade: MILITARY; No. of Terminals: 24; Package Code: DIP; Package Shape: RECTANGULAR; Organization: 512X8;
SNC54S475W
OTP ROM; Temperature Grade: MILITARY; No. of Terminals: 24; Package Code: DFP; Package Shape: RECTANGULAR; Maximum Access Time: 85 ns;
SNC54S476J
OTP ROM; Temperature Grade: MILITARY; No. of Terminals: 18; Package Code: DIP; Package Shape: RECTANGULAR; Terminal Pitch: 2.54 mm;
SNC54S477J
OTP ROM; Temperature Grade: MILITARY; No. of Terminals: 18; Package Code: DIP; Package Shape: RECTANGULAR; Package Body Material: CERAMIC;
SNC54S478J
OTP ROM; Temperature Grade: MILITARY; No. of Terminals: 24; Package Code: DIP; Package Shape: RECTANGULAR; Maximum Access Time: 70 ns;
SNC54S479J
OTP ROM; Temperature Grade: MILITARY; No. of Terminals: 24; Package Code: DIP; Package Shape: RECTANGULAR; Terminal Position: DUAL;
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