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TBP24SA81-55N3

Texas Instruments

TBP24SA81-55N3 by Texas Instruments

TBP24SA81-55N3 by Texas Instruments is a 2KX4 OTP ROM with 8192-bit memory density and 55ns max access time. It features a rectangular package style, suitable for commercial temperature grade applications. Ideal for systems requiring fast data retrieval in a compact form factor.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,805 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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3,805

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-

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Vyrian

USA . 2,233 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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2,233

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

One Stop Electronics

USA . 1,561 parts In-Stock

1+ parts

$1.000

100+ parts

-

1k+ parts

-

10k+ parts

-

1,561

$1.000

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Parana Technologies

USA . 2,066 parts In-Stock

1+ parts

$2.526

100+ parts

-

1k+ parts

$3.015

10k+ parts

-

2,066

$2.526

-

$3.015

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IDEA Electronic Components Group

UK . 2,058 parts In-Stock

1+ parts

$2.838

100+ parts

-

1k+ parts

$2.554

10k+ parts

-

2,058

$2.838

-

$2.554

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ChromeModa Solutions

Germany . 1,418 parts In-Stock

1+ parts

$2.838

100+ parts

$2.327

1k+ parts

-

10k+ parts

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1,418

$2.838

$2.327

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AZTECH Wire

Italy . 193 parts In-Stock

1+ parts

$19.076

100+ parts

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193

$19.076

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Corphita

USA . 4,237 parts In-Stock

1+ parts

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4,237

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DigiPath Technology Company

USA . 2,152 parts In-Stock

1+ parts

-

100+ parts

$2.559

1k+ parts

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10k+ parts

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2,152

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$2.559

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Overview

Unlock endless possibilities with the TBP24SA81-55N3 by Texas Instruments. Crafted with precision and expertise, this OTP ROM offers unmatched quality and reliability. Ideal for a wide range of applications, this product provides seamless integration and superior performance. Experience the value and benefits of this innovative technology, delivering efficiency and convenience to our customers. Elevate your projects with the advantages that only Texas Instruments can offer.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material ensures durability and protection for the OTP ROM, making it suitable for various applications.

No. of Terminals: 18

With 18 terminals, this OTP ROM offers enough connectivity options for integration into different systems.

Maximum Operating Temperature: 70 °C

The high maximum operating temperature allows the OTP ROM to function reliably in a wide range of environmental conditions.

Organization: 2KX4

The organization of 2KX4 provides a balance between memory capacity and efficient data retrieval, making it a versatile choice.

Technology: TTL

The use of TTL technology ensures compatibility with a wide range of systems and peripheral devices, enhancing the versatility of this OTP ROM.

Memory Density: 8192 bit

The high memory density of 8192 bit allows for storing a significant amount of data in a compact form, making this OTP ROM efficient in space utilization.

Maximum Access Time: 55 ns

With a fast maximum access time of 55 ns, this OTP ROM can quickly retrieve data, ensuring efficient performance in demanding applications.

Technical Specifications

OTP ROM TBP24SA81-55N3 attributes and parameters. Explore more OTP ROM devices from Texas Instruments

Specs

Maximum Access Time:

55 ns

JESD-30 Code:

R-PDIP-T18

Memory Density:

8192 bit

Memory IC Type:

Memory Width:

4

No. of Terminals:

18

No. of Words:

2048 words

No. of Words Code:

2K

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Organization:

2KX4

Package Body Material:

PLASTIC/EPOXY

Package Code:

DIP

Package Equivalence Code:

DIP18,.3

Package Shape:

Package Style (Meter):

IN-LINE

Peak Reflow Temperature (C):

NOT SPECIFIED

Sub-Category:

OTP ROMs

Surface Mount:

NO

Technology:

TTL

Temperature Grade:

Terminal Form:

THROUGH-HOLE

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Trade Compliance

TBP24SA81-55N3 Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.71

SB

8542.32.00.70

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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