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SN74S477NP3

Texas Instruments

SN74S477NP3 by Texas Instruments

SN74S477NP3 by Texas Instruments is a 1KX4 OTP ROM with 4096-bit memory density. It operates b/w 0-70°C, featuring TTL technology and an IN-LINE package style. Ideal for applications requiring non-volatile memory storage in commercial-grade environments.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 6,292 parts In-Stock

1+ parts

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6,292

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Digiode

USA . 1,972 parts In-Stock

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1,972

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 1,028 parts In-Stock

1+ parts

$1.865

100+ parts

-

1k+ parts

$2.412

10k+ parts

-

1,028

$1.865

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$2.412

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DigiPath Technology Company

USA . 1,435 parts In-Stock

1+ parts

$2.054

100+ parts

$1.890

1k+ parts

-

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1,435

$2.054

$1.890

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ChromeModa Solutions

Germany . 3,708 parts In-Stock

1+ parts

$2.096

100+ parts

$1.719

1k+ parts

-

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3,708

$2.096

$1.719

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IDEA Electronic Components Group

UK . 1,090 parts In-Stock

1+ parts

$2.096

100+ parts

-

1k+ parts

$1.886

10k+ parts

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1,090

$2.096

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$1.886

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AZTECH Wire

Italy . 497 parts In-Stock

1+ parts

$17.756

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497

$17.756

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One Stop Electronics

USA . 1,142 parts In-Stock

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$22.000

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1,142

$22.000

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Corphita

USA . 2,259 parts In-Stock

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2,259

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Overview

Unlock the power of reliable data storage with the Texas Instruments SN74S477NP3 OTP ROM. Manufactured by a trusted industry leader, this versatile product offers unmatched quality and performance. Ideal for a wide range of applications, this OTP ROM provides secure and efficient memory storage. Trust Texas Instruments to deliver superior technology that meets your needs. Upgrade your projects with the SN74S477NP3 and experience the value and benefits it brings to your work.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy as the package body material ensures durability and protection for the OTP ROM, making it suitable for various environments.

No. of Terminals: 18

Having 18 terminals allows for a sufficient number of connections, enabling seamless integration with other components in a circuit.

Maximum Operating Temperature: 70 °C

The OTP ROM can operate efficiently in temperatures up to 70°C, providing reliability under normal operating conditions.

Organization: 1KX4

With an organization of 1KX4, this OTP ROM offers a high memory density and efficient data organization, suitable for storing and accessing multiple words.

Technology: TTL

Based on TTL technology, this OTP ROM ensures fast and reliable data transfer, making it a suitable choice for applications requiring quick access to memory.

Technical Specifications

OTP ROM SN74S477NP3 attributes and parameters. Explore more OTP ROM devices from Texas Instruments

Specs

JESD-30 Code:

R-PDIP-T18

Memory Density:

4096 bit

Memory IC Type:

Memory Width:

4

No. of Terminals:

18

No. of Words:

1024 words

No. of Words Code:

1K

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Organization:

1KX4

Package Body Material:

PLASTIC/EPOXY

Package Code:

DIP

Package Equivalence Code:

DIP18,.3

Package Shape:

Package Style (Meter):

IN-LINE

Peak Reflow Temperature (C):

NOT SPECIFIED

Sub-Category:

OTP ROMs

Surface Mount:

NO

Technology:

TTL

Temperature Grade:

Terminal Form:

THROUGH-HOLE

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Trade Compliance

SN74S477NP3 Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.71

SB

8542.32.00.70

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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