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SN74S479J4

Texas Instruments

SN74S479J4 by Texas Instruments

SN74S479J4 by Texas Instruments is a 1KX8 OTP ROM IC with 8192-bit memory density. Operating b/w 0°C to 70°C, it features TTL technology and a rectangular ceramic package with 24 terminals in an in-line style. Ideal for applications requiring non-volatile memory storage in commercial-grade environments.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 5,352 parts In-Stock

1+ parts

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5,352

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Digiode

USA . 4,916 parts In-Stock

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-

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4,916

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 1,093 parts In-Stock

1+ parts

$4.821

100+ parts

-

1k+ parts

$5.336

10k+ parts

-

1,093

$4.821

-

$5.336

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DigiPath Technology Company

USA . 1,148 parts In-Stock

1+ parts

$5.309

100+ parts

$4.884

1k+ parts

-

10k+ parts

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1,148

$5.309

$4.884

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ChromeModa Solutions

Germany . 5,325 parts In-Stock

1+ parts

$5.417

100+ parts

$4.442

1k+ parts

-

10k+ parts

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5,325

$5.417

$4.442

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IDEA Electronic Components Group

UK . 662 parts In-Stock

1+ parts

$5.417

100+ parts

-

1k+ parts

$4.875

10k+ parts

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662

$5.417

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$4.875

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One Stop Electronics

USA . 1,334 parts In-Stock

1+ parts

$9.000

100+ parts

-

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1,334

$9.000

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AZTECH Wire

Italy . 872 parts In-Stock

1+ parts

$14.182

100+ parts

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872

$14.182

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Corphita

USA . 3,055 parts In-Stock

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3,055

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Overview

Unlock the power of reliable data storage with the SN74S479J4 by Texas Instruments. As a trusted leader in the industry, Texas Instruments delivers top-quality OTP ROM products that offer unparalleled performance and durability. Ideal for a wide range of applications, this product provides customers with a cost-effective solution for storing critical information securely. Trust Texas Instruments to provide you with the cutting-edge technology you need to succeed in today's competitive market.

Feature Benefit Bullets

Package Body Material: CERAMIC

Ceramic material provides excellent durability and resistance to high temperatures, making it a reliable choice for long-term use in various environments.

No. of Terminals: 24

Having 24 terminals allows for efficient connectivity and integration with other components in a system.

Maximum Operating Temperature: 70 °C

With a high maximum operating temperature, this OTP ROM can withstand elevated temperatures without compromising performance.

Organization: 1KX8

The organization of 1Kx8 means that the OTP ROM can store 1024 words, each with a width of 8 bits, providing ample storage capacity for various data.

Technology: TTL

TTL technology offers fast response times and low power consumption, enhancing the overall efficiency and performance of the OTP ROM.

Technical Specifications

OTP ROM SN74S479J4 attributes and parameters. Explore more OTP ROM devices from Texas Instruments

Specs

JESD-30 Code:

R-XDIP-T24

Memory Density:

8192 bit

Memory IC Type:

Memory Width:

8

No. of Terminals:

24

No. of Words:

1024 words

No. of Words Code:

1K

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Organization:

1KX8

Package Body Material:

CERAMIC

Package Code:

DIP

Package Equivalence Code:

DIP24,.6

Package Shape:

Package Style (Meter):

IN-LINE

Peak Reflow Temperature (C):

NOT SPECIFIED

Sub-Category:

OTP ROMs

Surface Mount:

NO

Technology:

TTL

Temperature Grade:

Terminal Form:

THROUGH-HOLE

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Trade Compliance

SN74S479J4 Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.71

SB

8542.32.00.70

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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