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SN74S472JP4

Texas Instruments

SN74S472JP4 by Texas Instruments

SN74S472JP4 by Texas Instruments is a 512x8 OTP ROM with 4096-bit memory density and 75ns max access time. It operates at a nominal voltage of 5V, suitable for commercial-grade applications requiring reliable non-volatile memory storage in a ceramic rectangular package.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 8,883 parts In-Stock

1+ parts

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8,883

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Digiode

USA . 2,176 parts In-Stock

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2,176

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

One Stop Electronics

USA . 567 parts In-Stock

1+ parts

$1.000

100+ parts

-

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567

$1.000

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Parana Technologies

USA . 336 parts In-Stock

1+ parts

$4.270

100+ parts

-

1k+ parts

$4.701

10k+ parts

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336

$4.270

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$4.701

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DigiPath Technology Company

USA . 1,661 parts In-Stock

1+ parts

$4.702

100+ parts

$4.326

1k+ parts

-

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1,661

$4.702

$4.326

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ChromeModa Solutions

Germany . 3,149 parts In-Stock

1+ parts

$4.798

100+ parts

$3.934

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3,149

$4.798

$3.934

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IDEA Electronic Components Group

UK . 1,498 parts In-Stock

1+ parts

$4.798

100+ parts

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1k+ parts

$4.318

10k+ parts

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1,498

$4.798

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$4.318

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AZTECH Wire

Italy . 697 parts In-Stock

1+ parts

$5.922

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697

$5.922

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Corphita

USA . 137 parts In-Stock

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137

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Overview

Unlock the power of reliable data storage with the SN74S472JP4 by Texas Instruments. Manufactured with precision and quality in mind, this OTP ROM offers unmatched performance and durability for a wide range of applications. From industrial automation to consumer electronics, this product provides seamless integration and efficient data retrieval. Trust in Texas Instruments' reputation for excellence and invest in the future of technology with the SN74S472JP4. Experience the value and benefits of cutting-edge memory solutions with this innovative product.

Feature Benefit Bullets

Package Body Material: CERAMIC

The use of ceramic material enhances the durability and reliability of the OTP ROM, making it suitable for harsh operating conditions.

Nominal Supply Voltage / Vsup (V): 5

Operates at a standard 5V supply voltage, making it compatible with a wide range of systems and power sources.

No. of Terminals: 20

Provides ample connectivity options for interfacing with other components and systems.

Maximum Operating Temperature: 70 °C

Can withstand high temperatures, ensuring stable performance even in demanding environments.

Organization: 512X8

Offers a good balance between storage capacity and data output, suitable for various applications.

Technology: TTL

Utilizing TTL technology ensures fast and efficient data processing, enhancing the overall performance of the OTP ROM.

Technical Specifications

OTP ROM SN74S472JP4 attributes and parameters. Explore more OTP ROM devices from Texas Instruments

Specs

Maximum Access Time:

75 ns

JESD-30 Code:

R-XDIP-T20

Memory Density:

4096 bit

Memory IC Type:

Memory Width:

8

No. of Terminals:

20

No. of Words:

512 words

No. of Words Code:

512

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Organization:

512X8

Package Body Material:

CERAMIC

Package Code:

DIP

Package Equivalence Code:

DIP20,.3

Package Shape:

Package Style (Meter):

IN-LINE

Power Supplies (V):

5

Sub-Category:

OTP ROMs

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

NO

Technology:

TTL

Temperature Grade:

Terminal Form:

THROUGH-HOLE

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Trade Compliance

SN74S472JP4 Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.71

SB

8542.32.00.70

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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