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AT27LV020A-12JU

Microchip Technology

AT27LV020A-12JU by Microchip Technology

AT27LV020A-12JU by Microchip: 256KX8 OTP ROM with 3.3V/5V supplies, 120ns access time, and 85°C max temp. Ideal for industrial applications requiring reliable non-volatile memory storage in a compact chip carrier package.

Median Price

$5.160

Lifecycle Status

Suppliers In-Stock

10

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Arrow

USA . 10 parts In-Stock

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$1.180

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10

$1.180

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Mouser Electronics

USA . 545 parts In-Stock

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$5.160

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$4.810

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545

$5.160

$4.810

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DigiKey

USA . 69 parts In-Stock

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$5.160

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$4.980

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69

$5.160

$4.980

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Microchip Technology

USA . 15 parts In-Stock

1+ parts

$5.160

100+ parts

$4.780

1k+ parts

$4.520

10k+ parts

$4.260

15

$5.160

$4.780

$4.520

$4.260

Verical

USA . 10 parts In-Stock

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Digiode

USA . 129 parts In-Stock

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$3.147

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$3.147

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NAC Semi

USA . 448 parts In-Stock

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$5.310

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$4.810

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$4.400

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448

$5.310

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$4.400

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Vyrian

USA . 4,272 parts In-Stock

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VNN

France . 2,892 parts In-Stock

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Nova Conductors

Japan . 100 parts In-Stock

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Ampacity Inc.

Singapore . 204 parts In-Stock

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$2.820

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Corphita

USA . 923 parts In-Stock

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$2.982

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$2.982

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Corohmni

South Africa . 763 parts In-Stock

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$3.921

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Component Stockers USA

USA . 1 parts In-Stock

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$4.260

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QUARKTWIN TECHNOLOGY LTD

USA . 25,739 parts In-Stock

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Authorized Procurement Solutions

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Argo Parts USA

USA . 4,995 parts In-Stock

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LOOK Integrated Logistics

Peru . 4,473 parts In-Stock

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NIA Electronics

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Ledger Components

France . 3,666 parts In-Stock

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Montano Global Distributors

Canada . 3,620 parts In-Stock

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Supply Digital

USA . 1,998 parts In-Stock

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Continental Prestige Electronics

USA . 1,794 parts In-Stock

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Perfect Parts

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LMD Electronica

Estonia . 1,493 parts In-Stock

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Netroflash

USA . 1,000 parts In-Stock

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Overview

Upgrade your electronics with the AT27LV020A-12JU by Microchip Technology, a top-of-the-line OTP ROM that offers unparalleled quality and reliability. Perfect for a wide range of applications, this product provides customers with exceptional value and benefits, ensuring optimal performance and efficiency. Trust in Microchip Technology's expertise to deliver cutting-edge solutions for all your memory needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the internal components of the OTP ROM, ensuring a longer lifespan.

Surface Mount: YES

Allows for easy and convenient installation on circuit boards, saving time and effort during assembly.

Operating Mode: ASYNCHRONOUS

Enables independent operation without requiring synchronization with external clocks, increasing flexibility in system design.

Nominal Supply Voltage / Vsup (V): 3.3

Works efficiently at a commonly used voltage level, ensuring compatibility with a wide range of devices.

No. of Terminals: 32

Provides sufficient connectivity options for interfacing with other components in the system, enhancing versatility.

Maximum Operating Temperature: 85 °C

Ensures reliable performance even in high-temperature environments, making it suitable for industrial applications.

Technology: CMOS

Utilizes Complementary Metal-Oxide-Semiconductor technology for low power consumption and high noise immunity, optimizing efficiency.

Maximum Access Time: 120 ns

Offers fast access speeds for retrieving data, enhancing overall system performance.

Technical Specifications

OTP ROM AT27LV020A-12JU attributes and parameters. Explore more OTP ROM devices from Microchip Technology

Specs

Maximum Access Time:

120 ns

Additional Features:

ALSO OPERATES AT 5V SUPPLY

Input/Output Type:

COMMON

JESD-30 Code:

R-PQCC-J32

JESD-609 Code:

e3

Length:

13.97 mm

Memory Density:

2097152 bit

Memory IC Type:

Memory Width:

8

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Ports:

1

No. of Terminals:

32

No. of Words:

262144 words

No. of Words Code:

256K

Operating Mode:

ASYNCHRONOUS

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Organization:

256KX8

Output Characteristics:

3-STATE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LCC32,.45X.55

Package Shape:

Package Style (Meter):

CHIP CARRIER

Parallel or Serial:

PARALLEL

Peak Reflow Temperature (C):

245

Power Supplies (V):

3.3/5

Programming Voltage (V):

13

Qualification:

Not Qualified

Maximum Seated Height:

3.556 mm

Maximum Standby Current:

.00002 Amp

Sub-Category:

OTP ROMs

Maximum Supply Current:

8 mA

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

3 V

Nominal Supply Voltage / Vsup (V):

3.3

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

J BEND

Terminal Pitch:

1.27 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

40

Width:

11.43 mm

Trade Compliance

AT27LV020A-12JU Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Microchip Technology

Microchip Technology Incorporated is a leading provider of integrated circuit (IC) solutions for the global market. Founded in 1989, the company designs, manufactures, tests and markets state-of-the-art microcontrollers and analog devices for use in a wide array of electronics applications, such as the automotive industry, consumer electronics and industrial automation. Through its world-class production processes and technologies, Microchip Technology has become an innovator of semiconductor solutions that enable customers to maximize their performance while streamlining costs.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President and CEO

Ganesh Moorthy

Executive Chair

Steve Sanghi

CFO, Senior VP

J. Eric Bjornholt

Manufacturer fab locations 9

Fab name Location Fab Initiation Wafer Capacity

Fab 5 - Colorado

Fabrication

Fab Initiation

1995

USA

Colorado Springs

Wafer Capacity

70,000

1995

70,000

Santa Clara

Fabrication

Fab Initiation

1990

USA

Santa Clara

Wafer Capacity

1,290

1990

1,290

Lawrence

Fabrication

Fab Initiation

1989

USA

Lawrence

Wafer Capacity

5,000

1989

5,000

Fab 4 - Gresham

Fabrication

Fab Initiation

1988

USA

Gresham

Wafer Capacity

50,000

1988

50,000

Fab 2 - Tempe

Fabrication

Fab Initiation

1994

USA

Tempe

Wafer Capacity

30,000

1994

30,000

Beverly

Fabrication

Fab Initiation

1985

USA

Beverly

Wafer Capacity

2,000

1985

2,000

Lowell

Fabrication

Fab Initiation

1986

USA

Lowell

Wafer Capacity

15,000

1986

15,000

Garden Grove

Fabrication

Fab Initiation

1985

USA

Garden Grove

Wafer Capacity

12,000

1985

12,000

New Fab - Gresham

Fabrication

Fab Initiation

2024

USA

Gresham

Wafer Capacity

2024

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