Loading...

SN74S474NP3

Texas Instruments

SN74S474NP3 by Texas Instruments

SN74S474NP3 by Texas Instruments is a 512x8 OTP ROM with 4096-bit memory density. It operates at a nominal voltage of 5V and has a max access time of 75ns. This IC, housed in a rectangular plastic/epoxy package, is ideal for commercial applications requiring reliable non-volatile memory storage.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 6,779 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

6,779

-

-

-

-

Digiode

USA . 4,525 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,525

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 1,976 parts In-Stock

1+ parts

$3.280

100+ parts

-

1k+ parts

$3.804

10k+ parts

-

1,976

$3.280

-

$3.804

-

DigiPath Technology Company

USA . 2,042 parts In-Stock

1+ parts

$3.611

100+ parts

$3.322

1k+ parts

-

10k+ parts

-

2,042

$3.611

$3.322

-

-

ChromeModa Solutions

Germany . 2,099 parts In-Stock

1+ parts

$3.685

100+ parts

$3.022

1k+ parts

-

10k+ parts

-

2,099

$3.685

$3.022

-

-

IDEA Electronic Components Group

UK . 1,385 parts In-Stock

1+ parts

$3.685

100+ parts

-

1k+ parts

$3.316

10k+ parts

-

1,385

$3.685

-

$3.316

-

AZTECH Wire

Italy . 341 parts In-Stock

1+ parts

$11.649

100+ parts

-

1k+ parts

-

10k+ parts

-

341

$11.649

-

-

-

One Stop Electronics

USA . 1,531 parts In-Stock

1+ parts

$21.000

100+ parts

-

1k+ parts

-

10k+ parts

-

1,531

$21.000

-

-

-

Corphita

USA . 2,208 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,208

-

-

-

-

Overview

Unlock the power of innovation with the SN74S474NP3 by Texas Instruments. As a leader in semiconductor technology, Texas Instruments offers unmatched quality and reliability in their products. The SN74S474NP3 is a versatile OTP ROM that provides essential memory storage solutions for a wide range of applications. With its high performance and low power consumption, this product delivers exceptional value to customers looking for reliable memory solutions. Experience the benefits of Texas Instruments' cutting-edge technology with the SN74S474NP3.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy as the package body material makes the product lightweight and durable.

Nominal Supply Voltage / Vsup (V): 5

Operates at a standard supply voltage of 5V, making it compatible with many systems.

No. of Terminals: 24

Sufficient number of terminals for connectivity, allowing for easy integration into circuit designs.

Maximum Operating Temperature: 70 °C

Can withstand high temperatures, ensuring reliable performance in various environments.

Organization: 512X8

Organized as 512 words of 8 bits each, providing ample memory storage capacity for data.

Technology: TTL

Uses TTL technology for fast and efficient data processing.

Memory IC Type: OTP ROM

Being OTP ROM means that the memory is programmable only once, ensuring data security.

Maximum Access Time: 75 ns

Offers fast access time, allowing for quick retrieval of data.

Technical Specifications

OTP ROM SN74S474NP3 attributes and parameters. Explore more OTP ROM devices from Texas Instruments

Specs

Maximum Access Time:

75 ns

JESD-30 Code:

R-PDIP-T24

Memory Density:

4096 bit

Memory IC Type:

Memory Width:

8

No. of Terminals:

24

No. of Words:

512 words

No. of Words Code:

512

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Organization:

512X8

Package Body Material:

PLASTIC/EPOXY

Package Code:

DIP

Package Equivalence Code:

DIP24,.6

Package Shape:

Package Style (Meter):

IN-LINE

Power Supplies (V):

5

Sub-Category:

OTP ROMs

Maximum Supply Current:

155 mA

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

NO

Technology:

TTL

Temperature Grade:

Terminal Form:

THROUGH-HOLE

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Trade Compliance

SN74S474NP3 Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.71

SB

8542.32.00.70

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

Category top products 20

Authentic purchasing experiences

Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.

New products
from Texas Instruments 7

Similar products 20