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5962-01-166-0116

Texas Instruments

5962-01-166-0116 by Texas Instruments

Texas Instruments' 5962-01-166-0116 is a 32x8 OTP ROM with 5V supply, 40ns access time, and 110mA max supply current. Ideal for commercial applications, this TTL technology chip has a rectangular plastic/epoxy package with 16 terminals in an in-line style.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,969 parts In-Stock

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4,969

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Digiode

USA . 4,169 parts In-Stock

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4,169

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Distributors (Availability)

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Parana Technologies

USA . 209 parts In-Stock

1+ parts

$4.744

100+ parts

-

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$5.243

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209

$4.744

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$5.243

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AZTECH Wire

Italy . 754 parts In-Stock

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$5.082

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754

$5.082

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DigiPath Technology Company

USA . 2,328 parts In-Stock

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$5.223

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2,328

$5.223

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ChromeModa Solutions

Germany . 1,990 parts In-Stock

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$5.330

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$4.371

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1,990

$5.330

$4.371

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IDEA Electronic Components Group

UK . 1,601 parts In-Stock

1+ parts

$5.330

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-

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$4.797

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1,601

$5.330

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$4.797

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One Stop Electronics

USA . 1,302 parts In-Stock

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$16.000

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1,302

$16.000

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Northwest PG Solutions

USA . 2,056 parts In-Stock

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Corphita

USA . 2,040 parts In-Stock

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Native Components

USA . 955 parts In-Stock

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955

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Overview

Elevate your electronics with the 5962-01-166-0116 by Texas Instruments, a top-tier OTP ROM that boasts unmatched quality and reliability. Designed to meet commercial-grade standards, this rectangular package offers 32x8 organization for seamless integration into various applications. Say goodbye to slow access times - with a maximum of 40 ns, this memory IC delivers lightning-fast performance. Upgrade your projects today with Texas Instruments' cutting-edge technology and experience the difference firsthand.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy as the package body material provides durability and ensures the protection of the OTP ROM.

Nominal Supply Voltage / Vsup (V): 5

A supply voltage of 5V is commonly used, ensuring compatibility with standard power supplies.

No. of Terminals: 16

Having 16 terminals allows for easy connectivity and integration of the OTP ROM into a wider range of systems.

Maximum Operating Temperature: 70 °C

With a maximum operating temperature of 70°C, this OTP ROM can function reliably in various environmental conditions.

Technology: TTL

Being based on TTL technology ensures high-speed operation and compatibility with many digital devices.

Memory IC Type: OTP ROM

The OTP ROM type of memory is ideal for storing program data that needs to be permanently written once, making it suitable for many applications.

Technical Specifications

OTP ROM 5962-01-166-0116 attributes and parameters. Explore more OTP ROM devices from Texas Instruments

Specs

Maximum Access Time:

40 ns

JESD-30 Code:

R-PDIP-T16

Memory IC Type:

Memory Width:

8

No. of Terminals:

16

No. of Words:

32 words

No. of Words Code:

32

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Organization:

32X8

Package Body Material:

PLASTIC/EPOXY

Package Code:

DIP

Package Equivalence Code:

DIP16,.3

Package Shape:

Package Style (Meter):

IN-LINE

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

5

Qualification:

Not Qualified

Sub-Category:

OTP ROMs

Maximum Supply Current:

110 mA

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

NO

Technology:

TTL

Temperature Grade:

Terminal Form:

THROUGH-HOLE

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Trade Compliance

5962-01-166-0116 Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.71

SB

8542.32.00.70

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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