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M27C4002-80C6

STMicroelectronics

M27C4002-80C6 by STMicroelectronics

M27C4002-80C6 by STMicroelectronics is a 256KX16 OTP ROM with 80 ns access time, operating at 5V. It features a 44-terminal chip carrier package suitable for industrial applications. With a memory density of 4Mbit and parallel interface, it offers common I/O type and 3-STATE output characteristics.

Median Price

-

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 8,803 parts In-Stock

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ComSIT Distribution GmbH

Germany . 8,605 parts In-Stock

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8,605

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Digiode

USA . 4,705 parts In-Stock

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4,705

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ComSIT USA

USA . 4,000 parts In-Stock

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4,000

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Anansix

USA . 1,991 parts In-Stock

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Distributors (Availability)

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IDEA Electronic Components Group

UK . 2,225 parts In-Stock

1+ parts

$5.222

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-

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$4.700

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2,225

$5.222

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$4.700

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MKK Technologies

India . 1,636 parts In-Stock

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$9.819

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1,636

$9.819

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DigiPath Technology Company

USA . 1,636 parts In-Stock

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$9.819

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1,636

$9.819

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AZTECH Wire

Italy . 168 parts In-Stock

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$16.260

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168

$16.260

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QUARKTWIN TECHNOLOGY LTD

USA . 13,092 parts In-Stock

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Microchip USA

USA . 3,086 parts In-Stock

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3,086

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Corphita

USA . 1,814 parts In-Stock

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Parana Technologies

USA . 257 parts In-Stock

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$6.244

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257

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$6.244

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Kepictronics

USA . 91 parts In-Stock

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Overview

Unlock the power of reliable data storage with the M27C4002-80C6 by STMicroelectronics. As a trusted leader in semiconductor manufacturing, STMicroelectronics delivers top-notch quality and performance. This OTP ROM chip is perfect for a wide range of applications, offering customers unmatched value and benefits. Trust in the exceptional capabilities of this product to enhance your projects and take them to the next level.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the internal components of the OTP ROM, ensuring a longer lifespan.

Operating Mode: ASYNCHRONOUS

Allows for independent operation of the OTP ROM, increasing flexibility and compatibility with different systems.

Nominal Supply Voltage / Vsup (V): 5

Stable supply voltage ensures reliable performance of the OTP ROM under standard operating conditions.

No. of Terminals: 44

Sufficient number of terminals for connecting the OTP ROM to other components, enabling efficient data transfer.

Maximum Operating Temperature: 85 °C

Wide operating temperature range makes the OTP ROM suitable for use in various environments.

Organization: 256KX16

Organized into 256K words of 16 bits each, providing ample storage capacity for data.

Memory Width: 16

Wide memory width allows for efficient data processing and retrieval in the OTP ROM.

Technology: CMOS

CMOS technology ensures low power consumption and high-speed operation of the OTP ROM.

Maximum Access Time: 80 ns

Fast access time ensures quick retrieval of data from the OTP ROM, enhancing overall system performance.

Technical Specifications

OTP ROM M27C4002-80C6 attributes and parameters. Explore more OTP ROM devices from STMicroelectronics

Specs

Maximum Access Time:

80 ns

Input/Output Type:

COMMON

JESD-30 Code:

S-PQCC-J44

JESD-609 Code:

e3

Length:

16.586 mm

Memory Density:

4194304 bit

Memory IC Type:

Memory Width:

16

No. of Functions:

1

No. of Terminals:

44

No. of Words:

262144 words

No. of Words Code:

256K

Operating Mode:

ASYNCHRONOUS

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Organization:

256KX16

Output Characteristics:

3-STATE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LDCC44,.7SQ

Package Shape:

Package Style (Meter):

CHIP CARRIER

Parallel or Serial:

PARALLEL

Peak Reflow Temperature (C):

245

Power Supplies (V):

5

Qualification:

Not Qualified

Maximum Seated Height:

4.57 mm

Maximum Standby Current:

.0001 Amp

Sub-Category:

OTP ROMs

Maximum Supply Current:

70 mA

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

J BEND

Terminal Pitch:

1.27 mm

Terminal Position:

QUAD

Width:

16.586 mm

Trade Compliance

M27C4002-80C6 Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.71

SB

8542.32.00.70

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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