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VSC7422XJQ-04

Microchip Technology

VSC7422XJQ-04 by Microchip Technology

VSC7422XJQ-04 by Microchip: Ethernet switch IC with 302 terminals, operating temp -40 to 125°C. Package style includes flatpack and thin profile for automotive telecom applications. Nominal voltage of 1V and low supply current of 2.6mA make it ideal for compact designs.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

< 1k

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Vyrian

USA . 661 parts In-Stock

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Nova Conductors

Japan . 42 parts In-Stock

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AZTECH Wire

Italy . 338 parts In-Stock

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$17.256

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338

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Ampacity Inc.

Singapore . 1,348 parts In-Stock

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$25.000

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Authorized Procurement Solutions

USA . 8,000 parts In-Stock

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Marpe Global Electronics

Taiwan . 7,974 parts In-Stock

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XL Components Corporation

Australia . 7,301 parts In-Stock

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Argo Parts USA

USA . 4,068 parts In-Stock

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QualityLine Systems

Poland . 4,019 parts In-Stock

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Vigor

Singapore . 4,000 parts In-Stock

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Continental Prestige Electronics

USA . 3,205 parts In-Stock

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Microchip USA

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Bastille Electronics

Australia . 15 parts In-Stock

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Overview

Unlock the power of seamless connectivity with the VSC7422XJQ-04 by Microchip Technology. Designed for the Telecom industry, this Ethernet switch IC offers unparalleled quality and reliability. With a temperature grade of automotive, this product ensures optimal performance even in extreme conditions. Its compact design and advanced features make it ideal for various applications. Experience faster data transmission, improved efficiency, and enhanced network performance with the VSC7422XJQ-04. Upgrade your technology today with Microchip Technology.

Feature Benefit Bullets

Package Body Material

PLASTIC/EPOXY - Durable material for long-lasting performance.

Surface Mount

YES - Easy to solder onto circuit boards for quick installation.

Package Shape

SQUARE - Compact design for space-saving in electronic devices.

No. of Terminals

302 - Sufficient number for complex switching operations.

Package Style

FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH - Versatile options for varying installation needs.

Maximum Operating Temperature

125 °C - Can withstand high temperatures for reliable operation.

Minimum Operating Temperature

40 °C - Suitable for use in various environments.

Terminal Position

QUAD - Efficient layout for organized connectivity.

Maximum Seated Height

1.2 mm - Low profile for slim device designs.

Width

24 mm - Compact size for fitting into tight spaces.

Length

24 mm - Balanced dimensions for versatility in application.

Temperature Grade

AUTOMOTIVE - Suitable for automotive environments with temperature fluctuations.

Terminal Form

GULL WING - Secure terminal connection for stability.

Maximum Supply Current

2.6 mA - Energy-efficient operation for reduced power consumption.

Telecom IC Type

ETHERNET SWITCH - Ideal for network switching applications.

Nominal Supply Voltage

1 V - Compatible with standard voltage requirements.

Terminal Pitch

0.5 mm - Close terminal spacing for compact layout designs.

Technical Specifications

Telecom - Switching ICs VSC7422XJQ-04 attributes and parameters. Explore more Telecom - Switching ICs devices from Microchip Technology

Specs

JESD-30 Code:

S-PQFP-G302

Length:

24 mm

No. of Functions:

1

No. of Terminals:

302

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TQFP302,.1SQ

Package Shape:

Package Style (Meter):

FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH

Maximum Seated Height:

1.2 mm

Maximum Supply Current:

2.6 mA

Nominal Supply Voltage:

1 V

Surface Mount:

YES

Telecom IC Type:

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

24 mm

Trade Compliance

VSC7422XJQ-04 Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Microchip Technology

Microchip Technology Incorporated is a leading provider of integrated circuit (IC) solutions for the global market. Founded in 1989, the company designs, manufactures, tests and markets state-of-the-art microcontrollers and analog devices for use in a wide array of electronics applications, such as the automotive industry, consumer electronics and industrial automation. Through its world-class production processes and technologies, Microchip Technology has become an innovator of semiconductor solutions that enable customers to maximize their performance while streamlining costs.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President and CEO

Ganesh Moorthy

Executive Chair

Steve Sanghi

CFO, Senior VP

J. Eric Bjornholt

Manufacturer fab locations 9

Fab name Location Fab Initiation Wafer Capacity

Fab 5 - Colorado

Fabrication

Fab Initiation

1995

USA

Colorado Springs

Wafer Capacity

70,000

1995

70,000

Santa Clara

Fabrication

Fab Initiation

1990

USA

Santa Clara

Wafer Capacity

1,290

1990

1,290

Lawrence

Fabrication

Fab Initiation

1989

USA

Lawrence

Wafer Capacity

5,000

1989

5,000

Fab 4 - Gresham

Fabrication

Fab Initiation

1988

USA

Gresham

Wafer Capacity

50,000

1988

50,000

Fab 2 - Tempe

Fabrication

Fab Initiation

1994

USA

Tempe

Wafer Capacity

30,000

1994

30,000

Beverly

Fabrication

Fab Initiation

1985

USA

Beverly

Wafer Capacity

2,000

1985

2,000

Lowell

Fabrication

Fab Initiation

1986

USA

Lowell

Wafer Capacity

15,000

1986

15,000

Garden Grove

Fabrication

Fab Initiation

1985

USA

Garden Grove

Wafer Capacity

12,000

1985

12,000

New Fab - Gresham

Fabrication

Fab Initiation

2024

USA

Gresham

Wafer Capacity

2024

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