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LAN9355/PT

Microchip Technology

LAN9355/PT by Microchip Technology

LAN9355/PT by Microchip is an Ethernet switch IC with 80 terminals, operating temp of 0-70°C. It features a plastic package, Gull Wing terminals, and 1.2V supply voltage. Ideal for telecom applications requiring high-speed data switching in compact designs.

Median Price

$8.075

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 50 parts In-Stock

1+ parts

$8.075

100+ parts

-

1k+ parts

-

10k+ parts

-

50

$8.075

-

-

-

Vyrian

USA . 3,011 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,011

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Continental Prestige Electronics

USA . 6,083 parts In-Stock

1+ parts

$8.075

100+ parts

-

1k+ parts

-

10k+ parts

$7.914

6,083

$8.075

-

-

$7.914

AZTECH Wire

Italy . 425 parts In-Stock

1+ parts

$9.167

100+ parts

-

1k+ parts

-

10k+ parts

-

425

$9.167

-

-

-

Marpe Global Electronics

Taiwan . 6,995 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

-

6,995

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-

-

-

QualityLine Systems

Poland . 6,208 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

-

6,208

-

-

-

-

Netroflash

USA . 2,000 parts In-Stock

1+ parts

-

100+ parts

$7.914

1k+ parts

$7.671

10k+ parts

$7.510

2,000

-

$7.914

$7.671

$7.510

Argo Parts USA

USA . 1,677 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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1,677

-

-

-

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XL Components Corporation

Australia . 1,667 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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1,667

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Overview

Upgrade your networking capabilities with the LAN9355/PT by Microchip Technology. As a leading manufacturer in the industry, Microchip Technology brings you a high-quality Telecom - Switching IC that offers unparalleled performance and reliability. The LAN9355/PT is designed for a wide range of applications, providing seamless connectivity and efficient data transfer. With its advanced features and superior design, this product delivers exceptional value and benefits to customers looking to enhance their network infrastructure. Trust Microchip Technology to deliver cutting-edge solutions for all your networking needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material in the package body makes the product lightweight and cost-effective.

Surface Mount: YES

Being surface mountable, the product is easy to assemble on printed circuit boards, saving space and enhancing reliability.

Screening Level: TS 16949

Compliance with TS 16949 screening level ensures high quality and reliability for automotive applications.

Package Shape: SQUARE

The square package shape allows for efficient use of space on the PCB and facilitates easier component placement.

No. of Terminals: 80

Having 80 terminals provides flexibility in connectivity options and allows for more features to be integrated.

Package Style (Meter): FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH

The combination of flatpack, heat sink/slug, thin profile, and fine pitch package styles offers enhanced thermal management and space-saving benefits.

Maximum Operating Temperature: 70 °C

With a maximum operating temperature of 70°C, the product can withstand different environmental conditions and ensures reliable performance.

Minimum Operating Temperature: 0 °C

The product's minimum operating temperature of 0°C ensures functionality even in low-temperature environments.

Terminal Position: QUAD

Quad terminal position allows for easy soldering and connection, simplifying the manufacturing process.

Maximum Seated Height: 1.2 mm

The low maximum seated height of 1.2 mm helps in reducing the overall profile of the product, ideal for space-constrained applications.

Width: 12 mm

The 12mm width makes the product compact and suitable for applications where space is limited.

Length: 12 mm

The 12mm length complements the width, ensuring a square form factor that optimizes PCB layout.

Temperature Grade: COMMERCIAL

The commercial temperature grade ensures the product's suitability for standard operating environments, making it versatile for various applications.

Terminal Form: GULL WING

The gull-wing terminal form simplifies the soldering process and enhances mechanical strength, improving overall reliability.

Telecom IC Type: ETHERNET SWITCH

Being an Ethernet switch type, the product enables efficient data communication and networking capabilities for telecom applications.

Nominal Supply Voltage: 1.2 V

With a nominal supply voltage of 1.2 V, the product offers energy efficiency and compatibility with low-power systems.

Terminal Pitch: 0.5 mm

The 0.5mm terminal pitch allows for high-density mounting and compact design, making the product suitable for space-constrained applications.

Technical Specifications

Telecom - Switching ICs LAN9355/PT attributes and parameters. Explore more Telecom - Switching ICs devices from Microchip Technology

Specs

JESD-30 Code:

S-PQFP-G80

Length:

12 mm

No. of Functions:

1

No. of Terminals:

80

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TQFP80,.55SQ

Package Shape:

Package Style (Meter):

FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

NOT SPECIFIED

Screening Level:

TS 16949

Maximum Seated Height:

1.2 mm

Nominal Supply Voltage:

1.2 V

Surface Mount:

YES

Telecom IC Type:

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

12 mm

Trade Compliance

LAN9355/PT Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Microchip Technology

Microchip Technology Incorporated is a leading provider of integrated circuit (IC) solutions for the global market. Founded in 1989, the company designs, manufactures, tests and markets state-of-the-art microcontrollers and analog devices for use in a wide array of electronics applications, such as the automotive industry, consumer electronics and industrial automation. Through its world-class production processes and technologies, Microchip Technology has become an innovator of semiconductor solutions that enable customers to maximize their performance while streamlining costs.

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Management team

President and CEO

Ganesh Moorthy

Executive Chair

Steve Sanghi

CFO, Senior VP

J. Eric Bjornholt

Manufacturer fab locations 9

Fab name Location Fab Initiation Wafer Capacity

Fab 5 - Colorado

Fabrication

Fab Initiation

1995

USA

Colorado Springs

Wafer Capacity

70,000

1995

70,000

Santa Clara

Fabrication

Fab Initiation

1990

USA

Santa Clara

Wafer Capacity

1,290

1990

1,290

Lawrence

Fabrication

Fab Initiation

1989

USA

Lawrence

Wafer Capacity

5,000

1989

5,000

Fab 4 - Gresham

Fabrication

Fab Initiation

1988

USA

Gresham

Wafer Capacity

50,000

1988

50,000

Fab 2 - Tempe

Fabrication

Fab Initiation

1994

USA

Tempe

Wafer Capacity

30,000

1994

30,000

Beverly

Fabrication

Fab Initiation

1985

USA

Beverly

Wafer Capacity

2,000

1985

2,000

Lowell

Fabrication

Fab Initiation

1986

USA

Lowell

Wafer Capacity

15,000

1986

15,000

Garden Grove

Fabrication

Fab Initiation

1985

USA

Garden Grove

Wafer Capacity

12,000

1985

12,000

New Fab - Gresham

Fabrication

Fab Initiation

2024

USA

Gresham

Wafer Capacity

2024

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