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LAN9353TI/ML

Microchip Technology

LAN9353TI/ML by Microchip Technology

LAN9353TI/ML by Microchip Technology is a Telecom IC for Ethernet transceiver applications. It operates at 3.3V with a temp range of -40 to 85°C. This surface-mount IC has 64 terminals, quad position, and a square package style suitable for industrial use.

Median Price

$7.775

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 50 parts In-Stock

1+ parts

$7.775

100+ parts

-

1k+ parts

-

10k+ parts

-

50

$7.775

-

-

-

Vyrian

USA . 5,385 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

5,385

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Advanced Electronics

New Zealand . 3,000 parts In-Stock

1+ parts

$6.044

100+ parts

$5.560

1k+ parts

$5.210

10k+ parts

-

3,000

$6.044

$5.560

$5.210

-

AZTECH Wire

Italy . 315 parts In-Stock

1+ parts

$7.606

100+ parts

-

1k+ parts

-

10k+ parts

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315

$7.606

-

-

-

Continental Prestige Electronics

USA . 5,470 parts In-Stock

1+ parts

$7.775

100+ parts

-

1k+ parts

-

10k+ parts

$7.620

5,470

$7.775

-

-

$7.620

Corohmni

South Africa . 114 parts In-Stock

1+ parts

$13.697

100+ parts

-

1k+ parts

-

10k+ parts

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114

$13.697

-

-

-

Aztec Data Supply Inc.

USA . 2,604 parts In-Stock

1+ parts

$16.180

100+ parts

-

1k+ parts

-

10k+ parts

-

2,604

$16.180

-

-

-

Semicontronic

India . 719 parts In-Stock

1+ parts

$499.000

100+ parts

$486.525

1k+ parts

$484.030

10k+ parts

-

719

$499.000

$486.525

$484.030

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Ampacity Inc.

Singapore . 1,436 parts In-Stock

1+ parts

$544.000

100+ parts

-

1k+ parts

-

10k+ parts

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1,436

$544.000

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-

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Argo Parts USA

USA . 2,192 parts In-Stock

1+ parts

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100+ parts

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1k+ parts

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2,192

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Marpe Global Electronics

Taiwan . 600 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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600

-

-

-

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QualityLine Systems

Poland . 600 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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600

-

-

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XL Components Corporation

Australia . 600 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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600

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Netroflash

USA . 50 parts In-Stock

1+ parts

-

100+ parts

$7.620

1k+ parts

$7.386

10k+ parts

$7.231

50

-

$7.620

$7.386

$7.231

Overview

Upgrade your network with the cutting-edge LAN9353TI/ML from Microchip Technology. As a leader in the industry, Microchip Technology delivers top-quality products that exceed expectations. The Telecom - Switching ICs category of the LAN9353TI/ML offers unmatched performance and reliability for all your networking needs. With surface mount capability, TS 16949 screening level, and a wide range of applications, this product is essential for any modern setup. Experience the value and benefits of seamless connectivity, improved efficiency, and superior performance with the LAN9353TI/ML. Trust Microchip Technology to elevate your networking experience.

Feature Benefit Bullets

Surface Mount: YES

Surface mount capability allows for easy and efficient installation on PCBs, making this product a convenient choice for manufacturers.

Screening Level: TS 16949

TS 16949 screening level ensures high quality and reliability of the product, making it a trustworthy option for telecom applications.

Package Shape: SQUARE

The square package shape allows for efficient use of space on the PCB, making it suitable for compact telecom devices.

No. of Terminals: 64

With 64 terminals, this product offers a high level of connectivity and flexibility for telecom switching applications.

Package Style (Meter): CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

The package style with a chip carrier, heat sink/slug, and very thin profile design enables efficient thermal management and space-saving on the PCB.

Maximum Operating Temperature: 85 °C

With a maximum operating temperature of 85°C, this product can withstand high temperatures in industrial environments, ensuring stable performance.

Minimum Operating Temperature: -40 °C

The wide range of operating temperatures from -40°C to 85°C makes this product suitable for use in various environments and conditions.

Terminal Finish: MATTE TIN

The matte tin terminal finish provides corrosion resistance and ensures reliable contact, enhancing the longevity of the product.

Terminal Position: QUAD

The quad terminal position simplifies installation and connectivity, making this product user-friendly and easy to integrate into telecom equipment.

Maximum Seated Height: 1 mm

With a low maximum seated height of 1 mm, this product helps save space on the PCB and enables compact design of telecom devices.

Width: 9 mm

The 9 mm width of this product ensures compatibility with standard PCB layouts and facilitates smooth installation in telecom systems.

Maximum Time At Peak Reflow Temperature (s): 40

The maximum time at peak reflow temperature of 40 seconds ensures quick and efficient soldering during manufacturing processes, saving time and costs.

Peak Reflow Temperature °C: 260

The peak reflow temperature of 260°C ensures reliable soldering and thermal stability for the product, contributing to its overall performance and longevity.

Length: 9 mm

With a length of 9 mm, this product is compact and space-saving, making it suitable for small form factor telecom devices.

Temperature Grade: INDUSTRIAL

The industrial temperature grade certification ensures that this product can withstand harsh environmental conditions in industrial settings, guaranteeing reliable operation.

Terminal Form: NO LEAD

The no lead terminal form eliminates the risk of lead contamination and promotes environmental sustainability, making this product a eco-friendly choice.

Telecom IC Type: ETHERNET TRANSCEIVER

The Ethernet transceiver type of this telecom IC ensures high-speed data transmission and reliable network connectivity, making it ideal for telecom switching applications.

Nominal Supply Voltage: 3.3 V

With a nominal supply voltage of 3.3V, this product offers compatibility with standard power sources and contributes to energy efficiency in telecom systems.

Terminal Pitch: 0.5 mm

The terminal pitch of 0.5 mm allows for precise and compact positioning of terminals on the PCB, enhancing connectivity and reliability of the product.

Moisture Sensitivity Level (MSL): 3

The moisture sensitivity level of 3 indicates that this product has moderate sensitivity to moisture, ensuring it remains stable and reliable in humid conditions.

Technical Specifications

Telecom - Switching ICs LAN9353TI/ML attributes and parameters. Explore more Telecom - Switching ICs devices from Microchip Technology

Specs

JESD-30 Code:

S-XQCC-N64

JESD-609 Code:

e3

Length:

9 mm

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

64

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

UNSPECIFIED

Package Code:

Package Equivalence Code:

LCC64,.35SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Screening Level:

TS 16949

Maximum Seated Height:

1 mm

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Telecom IC Type:

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

40

Width:

9 mm

Trade Compliance

LAN9353TI/ML Telecommunications trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Microchip Technology

Microchip Technology Incorporated is a leading provider of integrated circuit (IC) solutions for the global market. Founded in 1989, the company designs, manufactures, tests and markets state-of-the-art microcontrollers and analog devices for use in a wide array of electronics applications, such as the automotive industry, consumer electronics and industrial automation. Through its world-class production processes and technologies, Microchip Technology has become an innovator of semiconductor solutions that enable customers to maximize their performance while streamlining costs.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President and CEO

Ganesh Moorthy

Executive Chair

Steve Sanghi

CFO, Senior VP

J. Eric Bjornholt

Manufacturer fab locations 9

Fab name Location Fab Initiation Wafer Capacity

Fab 5 - Colorado

Fabrication

Fab Initiation

1995

USA

Colorado Springs

Wafer Capacity

70,000

1995

70,000

Santa Clara

Fabrication

Fab Initiation

1990

USA

Santa Clara

Wafer Capacity

1,290

1990

1,290

Lawrence

Fabrication

Fab Initiation

1989

USA

Lawrence

Wafer Capacity

5,000

1989

5,000

Fab 4 - Gresham

Fabrication

Fab Initiation

1988

USA

Gresham

Wafer Capacity

50,000

1988

50,000

Fab 2 - Tempe

Fabrication

Fab Initiation

1994

USA

Tempe

Wafer Capacity

30,000

1994

30,000

Beverly

Fabrication

Fab Initiation

1985

USA

Beverly

Wafer Capacity

2,000

1985

2,000

Lowell

Fabrication

Fab Initiation

1986

USA

Lowell

Wafer Capacity

15,000

1986

15,000

Garden Grove

Fabrication

Fab Initiation

1985

USA

Garden Grove

Wafer Capacity

12,000

1985

12,000

New Fab - Gresham

Fabrication

Fab Initiation

2024

USA

Gresham

Wafer Capacity

2024

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