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LAN9303M-AKZE-CAG

Microchip Technology

LAN9303M-AKZE-CAG by Microchip Technology

LAN9303M-AKZE-CAG by Microchip Technology is a 72-terminal Ethernet switch IC with TS 16949 screening. Operating b/w 0-70°C, it has a nominal voltage of 3.3V and terminal pitch of 0.5mm. Ideal for telecom applications, this chip carrier package with heat sink/slug suits commercial-grade projects requiring very thin profiles.

Median Price

$7.160

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

< 1k

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 26 parts In-Stock

1+ parts

$7.160

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26

$7.160

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Vyrian

USA . 803 parts In-Stock

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803

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Continental Prestige Electronics

USA . 404 parts In-Stock

1+ parts

$7.160

100+ parts

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1k+ parts

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10k+ parts

$7.017

404

$7.160

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$7.017

Aztec Data Supply Inc.

USA . 4,562 parts In-Stock

1+ parts

$9.180

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$9.180

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Corohmni

South Africa . 271 parts In-Stock

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$9.801

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271

$9.801

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AZTECH Wire

Italy . 546 parts In-Stock

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$10.465

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546

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Ampacity Inc.

Singapore . 510 parts In-Stock

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$786.000

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510

$786.000

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Semicontronic

India . 698 parts In-Stock

1+ parts

$913.000

100+ parts

$890.175

1k+ parts

$885.610

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698

$913.000

$890.175

$885.610

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Kepictronics

USA . 26,277 parts In-Stock

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RGB Technical Solutions

Ukraine . 5,634 parts In-Stock

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Authorized Procurement Solutions

USA . 1,000 parts In-Stock

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Argo Parts USA

USA . 340 parts In-Stock

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Overview

Upgrade your network with the LAN9303M-AKZE-CAG by Microchip Technology, a leading manufacturer in the industry. This Ethernet switch IC is designed for telecom applications, offering unparalleled performance and reliability. With a compact square package shape and commercial temperature grade, this product is perfect for a wide range of networking solutions. Trust Microchip Technology to deliver high-quality products that meet your needs and exceed your expectations. Elevate your network capabilities with the LAN9303M-AKZE-CAG today.

Feature Benefit Bullets

Surface Mount: YES

Surface mount technology allows for smaller and more compact designs, making this product suitable for space-constrained applications.

Screening Level: TS 16949

TS 16949 screening level ensures high quality and reliability, making this product ideal for critical telecom applications where downtime is not an option.

Package Shape: SQUARE

The square package shape provides efficient use of PCB real estate, making it easier to integrate this product into existing designs.

No. of Terminals: 72

With 72 terminals, this product offers a high level of connectivity options, allowing for versatile use in telecom switching applications.

Package Style (Meter): CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

The combination of chip carrier, heat sink/slug, and very thin profile package styles ensures efficient heat dissipation and space-saving design.

Maximum Operating Temperature: 70 °C

With a maximum operating temperature of 70°C, this product can operate reliably in a variety of environmental conditions without overheating.

Minimum Operating Temperature: 0 °C

The minimum operating temperature of 0°C ensures reliable performance even in colder environments, making this product versatile across different temperature ranges.

Terminal Position: QUAD

The quad terminal position provides stability and ease of connection, enhancing the overall durability and usability of this product.

Maximum Seated Height: 1 mm

With a maximum seated height of 1 mm, this product offers a low profile design that is ideal for compact and space-saving applications.

Width: 10 mm

The 10 mm width of this product makes it suitable for designs where space efficiency is a priority, allowing for optimal use of PCB real estate.

Length: 10 mm

The 10 mm length of this product provides a balanced form factor that can easily fit into various system designs without compromising on functionality.

Temperature Grade: COMMERCIAL

The commercial temperature grade ensures reliable performance in typical operating conditions, making this product suitable for standard telecom applications.

Terminal Form: NO LEAD

The no lead terminal form reduces the risk of solder joint failures, enhancing the reliability and longevity of this product in demanding telecom environments.

Telecom IC Type: ETHERNET SWITCH

As an Ethernet switch IC, this product enables high-speed data communication in telecom networks, making it an essential component for modern networking applications.

Nominal Supply Voltage: 3.3 V

With a nominal supply voltage of 3.3V, this product is compatible with standard power sources in telecom systems, ensuring seamless integration and reliable performance.

Terminal Pitch: 0.5 mm

The tight terminal pitch of 0.5 mm allows for high-density packaging and efficient use of PCB space, making this product suitable for compact telecom equipment designs.

Technical Specifications

Telecom - Switching ICs LAN9303M-AKZE-CAG attributes and parameters. Explore more Telecom - Switching ICs devices from Microchip Technology

Specs

JESD-30 Code:

S-XQCC-N72

Length:

10 mm

No. of Functions:

1

No. of Terminals:

72

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

UNSPECIFIED

Package Code:

Package Equivalence Code:

LCC72,.39SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Screening Level:

TS 16949

Maximum Seated Height:

1 mm

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Telecom IC Type:

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

10 mm

Trade Compliance

LAN9303M-AKZE-CAG Telecommunications trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Microchip Technology

Microchip Technology Incorporated is a leading provider of integrated circuit (IC) solutions for the global market. Founded in 1989, the company designs, manufactures, tests and markets state-of-the-art microcontrollers and analog devices for use in a wide array of electronics applications, such as the automotive industry, consumer electronics and industrial automation. Through its world-class production processes and technologies, Microchip Technology has become an innovator of semiconductor solutions that enable customers to maximize their performance while streamlining costs.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President and CEO

Ganesh Moorthy

Executive Chair

Steve Sanghi

CFO, Senior VP

J. Eric Bjornholt

Manufacturer fab locations 9

Fab name Location Fab Initiation Wafer Capacity

Fab 5 - Colorado

Fabrication

Fab Initiation

1995

USA

Colorado Springs

Wafer Capacity

70,000

1995

70,000

Santa Clara

Fabrication

Fab Initiation

1990

USA

Santa Clara

Wafer Capacity

1,290

1990

1,290

Lawrence

Fabrication

Fab Initiation

1989

USA

Lawrence

Wafer Capacity

5,000

1989

5,000

Fab 4 - Gresham

Fabrication

Fab Initiation

1988

USA

Gresham

Wafer Capacity

50,000

1988

50,000

Fab 2 - Tempe

Fabrication

Fab Initiation

1994

USA

Tempe

Wafer Capacity

30,000

1994

30,000

Beverly

Fabrication

Fab Initiation

1985

USA

Beverly

Wafer Capacity

2,000

1985

2,000

Lowell

Fabrication

Fab Initiation

1986

USA

Lowell

Wafer Capacity

15,000

1986

15,000

Garden Grove

Fabrication

Fab Initiation

1985

USA

Garden Grove

Wafer Capacity

12,000

1985

12,000

New Fab - Gresham

Fabrication

Fab Initiation

2024

USA

Gresham

Wafer Capacity

2024

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