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LAN9303-ABZJ-TR

Microchip Technology

LAN9303-ABZJ-TR by Microchip Technology

LAN9303-ABZJ-TR by Microchip is a 56-terminal Ethernet switch IC with 3.3V supply voltage, operating b/w 0 to 70°C. It features TS16949 screening level, square package shape, and quad terminal position. Ideal for telecom applications requiring a very thin profile chip carrier with no lead terminals.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

< 1k

Distributors (In-Stock)

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Vyrian

USA . 441 parts In-Stock

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441

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Nova Conductors

Japan . 150 parts In-Stock

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150

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Distributors (Availability)

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Aztec Data Supply Inc.

USA . 2,166 parts In-Stock

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$6.087

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$6.087

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AZTECH Wire

Italy . 896 parts In-Stock

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$11.422

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Advanced Electronics

New Zealand . 50 parts In-Stock

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$11.435

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$10.863

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$10.863

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50

$11.435

$10.863

$10.863

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Corohmni

South Africa . 279 parts In-Stock

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$14.126

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279

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Ampacity Inc.

Singapore . 177 parts In-Stock

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$801.000

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177

$801.000

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Semicontronic

India . 678 parts In-Stock

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$913.000

100+ parts

$890.175

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$885.610

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678

$913.000

$890.175

$885.610

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Kepictronics

USA . 26,273 parts In-Stock

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RGB Technical Solutions

Ukraine . 5,386 parts In-Stock

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Continental Prestige Electronics

USA . 5,031 parts In-Stock

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Argo Parts USA

USA . 2,404 parts In-Stock

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Bastille Electronics

Australia . 300 parts In-Stock

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Overview

Unlock the power of seamless connectivity with the LAN9303-ABZJ-TR by Microchip Technology. As a leading manufacturer in the industry, Microchip Technology delivers top-notch quality and reliability. This Ethernet switch is perfect for various telecom applications, offering unmatched performance and efficiency. Experience faster data transfer speeds and improved network connectivity with this innovative product. Upgrade your system today and enjoy the benefits of superior technology at an affordable price.

Feature Benefit Bullets

Surface Mount: YES

Being surface mountable allows for easy and efficient installation onto circuit boards, saving time and effort during manufacturing.

Screening Level: TS 16949

TS 16949 screening ensures high quality and reliability, making it suitable for use in critical telecommunications applications.

Package Shape: SQUARE

The square package shape provides good thermal conductivity and efficient use of board space.

No. of Terminals: 56

Having a high number of terminals allows for a greater level of connectivity and functionality within the IC.

Package Style: CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

The combination of package styles ensures optimal heat dissipation and a compact form factor, ideal for space-constrained designs.

Maximum Operating Temperature: 70 °C

The high maximum operating temperature allows for reliable operation under demanding conditions without overheating.

Minimum Operating Temperature: 0 °C

The low minimum operating temperature ensures that the IC can function effectively even in cold environments.

Terminal Position: QUAD

The quad terminal position provides a stable connection and facilitates easy integration into the circuit board.

Maximum Seated Height: 1 mm

The low maximum seated height saves on board space and enables a more compact overall design.

Width: 8 mm

The narrow width allows for a smaller footprint on the circuit board, enabling denser packing of components.

Length: 8 mm

The compact length of the IC contributes to a space-saving design and efficient use of board space.

Temperature Grade: COMMERCIAL

The commercial temperature grade is suitable for standard operating environments, making it a versatile choice for various applications.

Terminal Form: NO LEAD

The no-lead terminal form enhances reliability and eliminates the risk of solder joint fatigue, ensuring a longer lifespan for the IC.

Telecom IC Type: ETHERNET SWITCH

As an Ethernet switch, this IC provides high-speed data processing and efficient network management capabilities for telecommunications systems.

Nominal Supply Voltage: 3.3 V

The 3.3V nominal supply voltage is commonly used in telecom applications, ensuring compatibility and reliable performance.

Terminal Pitch: 0.5 mm

The tight terminal pitch allows for a high density of connections, enabling more features and functionality in a compact package.

Technical Specifications

Telecom - Switching ICs LAN9303-ABZJ-TR attributes and parameters. Explore more Telecom - Switching ICs devices from Microchip Technology

Specs

JESD-30 Code:

S-XQCC-N56

Length:

8 mm

No. of Functions:

1

No. of Terminals:

56

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

UNSPECIFIED

Package Code:

Package Equivalence Code:

LCC56,.31SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Screening Level:

TS 16949

Maximum Seated Height:

1 mm

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Telecom IC Type:

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

8 mm

Trade Compliance

LAN9303-ABZJ-TR Telecommunications trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Microchip Technology

Microchip Technology Incorporated is a leading provider of integrated circuit (IC) solutions for the global market. Founded in 1989, the company designs, manufactures, tests and markets state-of-the-art microcontrollers and analog devices for use in a wide array of electronics applications, such as the automotive industry, consumer electronics and industrial automation. Through its world-class production processes and technologies, Microchip Technology has become an innovator of semiconductor solutions that enable customers to maximize their performance while streamlining costs.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President and CEO

Ganesh Moorthy

Executive Chair

Steve Sanghi

CFO, Senior VP

J. Eric Bjornholt

Manufacturer fab locations 9

Fab name Location Fab Initiation Wafer Capacity

Fab 5 - Colorado

Fabrication

Fab Initiation

1995

USA

Colorado Springs

Wafer Capacity

70,000

1995

70,000

Santa Clara

Fabrication

Fab Initiation

1990

USA

Santa Clara

Wafer Capacity

1,290

1990

1,290

Lawrence

Fabrication

Fab Initiation

1989

USA

Lawrence

Wafer Capacity

5,000

1989

5,000

Fab 4 - Gresham

Fabrication

Fab Initiation

1988

USA

Gresham

Wafer Capacity

50,000

1988

50,000

Fab 2 - Tempe

Fabrication

Fab Initiation

1994

USA

Tempe

Wafer Capacity

30,000

1994

30,000

Beverly

Fabrication

Fab Initiation

1985

USA

Beverly

Wafer Capacity

2,000

1985

2,000

Lowell

Fabrication

Fab Initiation

1986

USA

Lowell

Wafer Capacity

15,000

1986

15,000

Garden Grove

Fabrication

Fab Initiation

1985

USA

Garden Grove

Wafer Capacity

12,000

1985

12,000

New Fab - Gresham

Fabrication

Fab Initiation

2024

USA

Gresham

Wafer Capacity

2024

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