Loading...

KSZ8873MLLAM-TR

Microchip Technology

KSZ8873MLLAM-TR by Microchip Technology

KSZ8873MLLAM-TR by Microchip: LAN switching circuit with 64 terminals, operates at -40 to 85°C. Features AEC-Q100 screening, 3.3V supply voltage, and gull wing terminal form. Ideal for telecom applications requiring a low profile, fine pitch flatpack package design.

Median Price

$6.430

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 76 parts In-Stock

1+ parts

$6.430

100+ parts

-

1k+ parts

-

10k+ parts

-

76

$6.430

-

-

-

ComSIT Distribution GmbH

Germany . 4,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,000

-

-

-

-

ComSIT USA

USA . 4,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,000

-

-

-

-

Vyrian

USA . 2,134 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,134

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Continental Prestige Electronics

USA . 5,177 parts In-Stock

1+ parts

$6.430

100+ parts

-

1k+ parts

-

10k+ parts

$6.301

5,177

$6.430

-

-

$6.301

Bastille Electronics

Australia . 450 parts In-Stock

1+ parts

$6.430

100+ parts

$6.108

1k+ parts

$5.803

10k+ parts

$5.723

450

$6.430

$6.108

$5.803

$5.723

Corohmni

South Africa . 804 parts In-Stock

1+ parts

$15.896

100+ parts

-

1k+ parts

-

10k+ parts

-

804

$15.896

-

-

-

AZTECH Wire

Italy . 765 parts In-Stock

1+ parts

$18.451

100+ parts

-

1k+ parts

-

10k+ parts

-

765

$18.451

-

-

-

Ampacity Inc.

Singapore . 532 parts In-Stock

1+ parts

$425.000

100+ parts

-

1k+ parts

-

10k+ parts

-

532

$425.000

-

-

-

Semicontronic

India . 1,314 parts In-Stock

1+ parts

$817.000

100+ parts

$796.575

1k+ parts

$792.490

10k+ parts

-

1,314

$817.000

$796.575

$792.490

-

Kepictronics

USA . 26,092 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

26,092

-

-

-

-

Lixinc

USA . 2,638 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,638

-

-

-

-

Argo Parts USA

USA . 1,781 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,781

-

-

-

-

Fulton Briggs Corp.

USA . 1,436 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,436

-

-

-

-

Microchip USA

USA . 1,317 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,317

-

-

-

-

Authorized Procurement Solutions

USA . 1,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,000

-

-

-

-

Overview

Enhance your telecom systems with the reliable and high-quality KSZ8873MLLAM-TR by Microchip Technology. As a leading manufacturer in the industry, Microchip Technology delivers top-notch products that meet the highest standards. The KSZ8873MLLAM-TR is a versatile LAN switching circuit that offers seamless connectivity and efficient data transfer. With its compact design and wide temperature range, this telecom IC is perfect for various applications. Trust Microchip Technology to provide you with the best solutions for your networking needs. Upgrade today and experience the difference!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material provides good durability and resistance to environmental factors, making the product reliable for long-term use.

Surface Mount: YES

Surface mount capability allows for easy and convenient installation, saving time and effort during assembly.

Screening Level: AEC-Q100; TS 16949

Adherence to AEC-Q100 and TS 16949 screening standards ensures high quality and reliability, ideal for automotive and telecom applications.

Package Shape: SQUARE

Square package shape enables efficient use of board space, making it suitable for compact designs.

No. of Terminals: 64

64 terminals provide ample connectivity options, allowing for versatile configuration and compatibility in various systems.

Package Style (Meter): FLATPACK, LOW PROFILE, FINE PITCH

Flatpack, low profile, and fine pitch package style offers space-saving and high-density integration, ideal for applications with limited board space.

Maximum Operating Temperature: 85 °C

High maximum operating temperature ensures reliable performance even in demanding environmental conditions.

Minimum Operating Temperature: -40 °C

Wide temperature range allows for operation in both extreme cold and hot environments, increasing the product's versatility.

Terminal Position: QUAD

Quad terminal position enhances stability and connectivity, ensuring secure connections during operation.

Maximum Seated Height: 1.6 mm

Low maximum seated height minimizes profile, making the product suitable for compact and slim designs.

Width: 12 mm

12mm width provides a compact form factor, enabling easy integration into space-constrained applications.

Maximum Time At Peak Reflow Temperature (s): 30

30 seconds maximum time at peak reflow temperature ensures proper soldering and reliability during assembly.

Peak Reflow Temperature °C: 260

Peak reflow temperature of 260°C allows for secure and effective soldering, ensuring a stable connection.

Length: 12 mm

12mm length complements the compact width, enabling the product to fit well in tight spaces.

Temperature Grade: INDUSTRIAL

Industrial temperature grade ensures reliable performance in harsh environments typically found in industrial settings.

Terminal Form: GULL WING

Gull wing terminal form offers strong mechanical support, reducing the risk of damage during handling and installation.

Telecom IC Type: LAN SWITCHING CIRCUIT

LAN switching circuit type is ideal for telecom applications, providing efficient and reliable data transmission within local area networks.

Nominal Supply Voltage: 3.3 V

Nominal supply voltage of 3.3V ensures compatibility with common power sources, enhancing ease of integration into existing systems.

Terminal Pitch: 0.5 mm

Fine 0.5mm terminal pitch allows for high-density mounting, enabling intricate designs and space-efficient layouts.

Technical Specifications

Telecom - Switching ICs KSZ8873MLLAM-TR attributes and parameters. Explore more Telecom - Switching ICs devices from Microchip Technology

Specs

JESD-30 Code:

S-PQFP-G64

Length:

12 mm

No. of Functions:

1

No. of Terminals:

64

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP64,.47SQ,20

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Screening Level:

AEC-Q100; TS 16949

Maximum Seated Height:

1.6 mm

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Telecom IC Type:

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

12 mm

PCN

Manufacturer Highlights

Microchip Technology

Microchip Technology Incorporated is a leading provider of integrated circuit (IC) solutions for the global market. Founded in 1989, the company designs, manufactures, tests and markets state-of-the-art microcontrollers and analog devices for use in a wide array of electronics applications, such as the automotive industry, consumer electronics and industrial automation. Through its world-class production processes and technologies, Microchip Technology has become an innovator of semiconductor solutions that enable customers to maximize their performance while streamlining costs.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President and CEO

Ganesh Moorthy

Executive Chair

Steve Sanghi

CFO, Senior VP

J. Eric Bjornholt

Manufacturer fab locations 9

Fab name Location Fab Initiation Wafer Capacity

Fab 5 - Colorado

Fabrication

Fab Initiation

1995

USA

Colorado Springs

Wafer Capacity

70,000

1995

70,000

Santa Clara

Fabrication

Fab Initiation

1990

USA

Santa Clara

Wafer Capacity

1,290

1990

1,290

Lawrence

Fabrication

Fab Initiation

1989

USA

Lawrence

Wafer Capacity

5,000

1989

5,000

Fab 4 - Gresham

Fabrication

Fab Initiation

1988

USA

Gresham

Wafer Capacity

50,000

1988

50,000

Fab 2 - Tempe

Fabrication

Fab Initiation

1994

USA

Tempe

Wafer Capacity

30,000

1994

30,000

Beverly

Fabrication

Fab Initiation

1985

USA

Beverly

Wafer Capacity

2,000

1985

2,000

Lowell

Fabrication

Fab Initiation

1986

USA

Lowell

Wafer Capacity

15,000

1986

15,000

Garden Grove

Fabrication

Fab Initiation

1985

USA

Garden Grove

Wafer Capacity

12,000

1985

12,000

New Fab - Gresham

Fabrication

Fab Initiation

2024

USA

Gresham

Wafer Capacity

2024

Category top products 20

Authentic purchasing experiences

Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.

Similar products 20