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KSZ8864RMNUB-VAO

Microchip Technology

KSZ8864RMNUB-VAO by Microchip Technology

Microchip Technology's KSZ8864RMNUB-VAO is an Ethernet switch IC with 64 terminals, AEC-Q100 screening, and operates b/w -40 to 85°C. It features a square chip carrier package style with matte tin terminal finish, suitable for telecom applications requiring a nominal voltage of 1.2V.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

< 1k

Distributors (In-Stock)

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Vyrian

USA . 782 parts In-Stock

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Nova Conductors

Japan . 10 parts In-Stock

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Advanced Electronics

New Zealand . 100 parts In-Stock

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$14.920

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$14.174

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$14.174

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$14.920

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$14.174

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Corohmni

South Africa . 510 parts In-Stock

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$15.865

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Aztec Data Supply Inc.

USA . 2,068 parts In-Stock

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$16.300

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AZTECH Wire

Italy . 500 parts In-Stock

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$17.069

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Ampacity Inc.

Singapore . 580 parts In-Stock

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$18.000

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$18.000

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Semicontronic

India . 578 parts In-Stock

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$944.000

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$920.400

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$915.680

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578

$944.000

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Authorized Procurement Solutions

USA . 10,000 parts In-Stock

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RGB Technical Solutions

Ukraine . 2,610 parts In-Stock

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Continental Prestige Electronics

USA . 1,025 parts In-Stock

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Argo Parts USA

USA . 93 parts In-Stock

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Bastille Electronics

Australia . 91 parts In-Stock

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Overview

Unlock seamless connectivity and reliable performance with the KSZ8864RMNUB-VAO by Microchip Technology. As a leading manufacturer in the industry, Microchip delivers top-quality Telecom Switching ICs that cater to various applications with ease. With its surface mount capability, AEC-Q100 screening level, and industrial temperature grade, this Ethernet switch ensures optimal functionality in any setting. Experience the value of fast and efficient data transmission, enhanced network performance, and simplified installation processes. Elevate your networking solutions with the KSZ8864RMNUB-VAO today.

Feature Benefit Bullets

Surface Mount: YES

Allows for easy and efficient mounting on PCBs, saving space and making assembly simpler.

Screening Level: AEC-Q100

High level of reliability and quality assurance, especially important for automotive applications where ruggedness is key.

Package Shape: SQUARE

Square shape helps with efficient use of board space and facilitates easier layout design.

No. of Terminals: 64

Provides ample connectivity options and flexibility in networking configurations.

Package Style: CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Combination of chip carrier and heat sink design helps in efficient heat dissipation and maintaining a low profile.

Maximum Operating Temperature: 85 °C

Can perform reliably in a wide range of temperatures, suitable for various operating environments.

Minimum Operating Temperature: -40 °C

Capable of functioning in extreme low temperature conditions, making it versatile for different applications.

Terminal Finish: MATTE TIN

Provides good solderability and long-term reliability in electrical connections.

Maximum Seated Height: 0.9 mm

Low profile design enables compact and space-saving installation in devices.

Width: 8 mm

Compact width allows for easy integration and placement within circuit designs.

Maximum Time At Peak Reflow Temperature (s): 30

Can withstand high temperatures for a brief period during reflow soldering process without compromising performance.

Peak Reflow Temperature °C: 260

Supports high-temperature reflow soldering process, ensuring secure and reliable solder joints.

Length: 8 mm

Compact length for efficient board space utilization and component placement.

Temperature Grade: INDUSTRIAL

Suitable for industrial applications where ruggedness and reliability are essential.

Terminal Form: NO LEAD

Lead-free terminal form for compliance with environmental regulations and ensuring safer disposal.

Telecom IC Type: ETHERNET SWITCH

Specifically designed for Ethernet switching applications, meeting the requirements of modern networking systems.

Nominal Supply Voltage: 1.2 V

Low supply voltage requirement for efficient power usage and compatibility with modern electronics.

Terminal Pitch: 0.4 mm

Narrow terminal pitch enables high density integration and compact design layout on PCBs.

Technical Specifications

Telecom - Switching ICs KSZ8864RMNUB-VAO attributes and parameters. Explore more Telecom - Switching ICs devices from Microchip Technology

Specs

Additional Features:

SEATED HT-CALCULATED

JESD-30 Code:

S-XQCC-N64

JESD-609 Code:

e3

Length:

8 mm

No. of Functions:

1

No. of Terminals:

64

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

UNSPECIFIED

Package Code:

Package Equivalence Code:

LCC64,.32SQ,16

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Screening Level:

AEC-Q100

Maximum Seated Height:

.9 mm

Nominal Supply Voltage:

1.2 V

Surface Mount:

YES

Telecom IC Type:

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.4 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

8 mm

Trade Compliance

KSZ8864RMNUB-VAO Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Microchip Technology

Microchip Technology Incorporated is a leading provider of integrated circuit (IC) solutions for the global market. Founded in 1989, the company designs, manufactures, tests and markets state-of-the-art microcontrollers and analog devices for use in a wide array of electronics applications, such as the automotive industry, consumer electronics and industrial automation. Through its world-class production processes and technologies, Microchip Technology has become an innovator of semiconductor solutions that enable customers to maximize their performance while streamlining costs.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President and CEO

Ganesh Moorthy

Executive Chair

Steve Sanghi

CFO, Senior VP

J. Eric Bjornholt

Manufacturer fab locations 9

Fab name Location Fab Initiation Wafer Capacity

Fab 5 - Colorado

Fabrication

Fab Initiation

1995

USA

Colorado Springs

Wafer Capacity

70,000

1995

70,000

Santa Clara

Fabrication

Fab Initiation

1990

USA

Santa Clara

Wafer Capacity

1,290

1990

1,290

Lawrence

Fabrication

Fab Initiation

1989

USA

Lawrence

Wafer Capacity

5,000

1989

5,000

Fab 4 - Gresham

Fabrication

Fab Initiation

1988

USA

Gresham

Wafer Capacity

50,000

1988

50,000

Fab 2 - Tempe

Fabrication

Fab Initiation

1994

USA

Tempe

Wafer Capacity

30,000

1994

30,000

Beverly

Fabrication

Fab Initiation

1985

USA

Beverly

Wafer Capacity

2,000

1985

2,000

Lowell

Fabrication

Fab Initiation

1986

USA

Lowell

Wafer Capacity

15,000

1986

15,000

Garden Grove

Fabrication

Fab Initiation

1985

USA

Garden Grove

Wafer Capacity

12,000

1985

12,000

New Fab - Gresham

Fabrication

Fab Initiation

2024

USA

Gresham

Wafer Capacity

2024

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