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VSC7546TSN-V/5CC-VAO

Microchip Technology

VSC7546TSN-V/5CC-VAO by Microchip Technology

Microchip Technology's VSC7546TSN-V/5CC-VAO is an Ethernet switch IC with 888 terminals, AEC-Q100 screening, and operates b/w -40 to 110°C. It comes in a square grid array package style, suitable for telecom applications requiring high-density switching solutions.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 1,180 parts In-Stock

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1,180

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Nova Conductors

Japan . 100 parts In-Stock

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100

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Distributors (Availability)

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AZTECH Wire

Italy . 258 parts In-Stock

1+ parts

$6.218

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258

$6.218

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Aztec Data Supply Inc.

USA . 1,995 parts In-Stock

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$7.152

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$7.152

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Corohmni

South Africa . 725 parts In-Stock

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$17.859

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725

$17.859

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Ampacity Inc.

Singapore . 195 parts In-Stock

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$973.000

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195

$973.000

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Continental Prestige Electronics

USA . 5,556 parts In-Stock

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5,556

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Montano Global Distributors

Canada . 3,635 parts In-Stock

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LMD Electronica

Estonia . 3,532 parts In-Stock

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NIA Electronics

USA . 3,428 parts In-Stock

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Ledger Components

France . 3,428 parts In-Stock

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LOOK Integrated Logistics

Peru . 3,272 parts In-Stock

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3,272

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Argo Parts USA

USA . 1,319 parts In-Stock

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1,319

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Aranea Global

USA . 100 parts In-Stock

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100

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Overview

Elevate your telecom system with the VSC7546TSN-V/5CC-VAO by Microchip Technology. This cutting-edge Ethernet switch IC boasts superior quality and reliability, ensuring seamless communication in your network. With its AEC-Q100 screening level and innovative design, this product offers unmatched performance and efficiency. Whether you're upgrading existing infrastructure or building a new network, the VSC7546TSN-V/5CC-VAO delivers exceptional value, making it the ideal choice for telecom applications. Experience the benefits of advanced technology and unlock endless possibilities with Microchip Technology's top-notch solution.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/epoxy material provides good durability and resistance to external elements, making the product suitable for rugged environments.

Surface Mount: YES

Surface mount capability allows for easy installation on PCBs, saving assembly time and space.

Screening Level: AEC-Q100

AEC-Q100 screening ensures high reliability and quality standards for automotive applications.

Package Shape: SQUARE

Square package shape allows for efficient use of PCB space and easy alignment during assembly.

No. of Terminals: 888

Large number of terminals provide versatility and connectivity options for complex circuit designs.

Maximum Operating Temperature: 110 °C

High maximum operating temperature ensures stable performance in demanding conditions.

Minimum Operating Temperature: -40 °C

Low minimum operating temperature allows for use in wide temperature range applications.

Terminal Position: BOTTOM

Bottom terminal position facilitates easy PCB layout and routing of other components.

Maximum Seated Height: 2.806 mm

Compact maximum seated height saves vertical space on the PCB.

Width: 24.6 mm

Standard width for easy integration into various board designs.

Length: 24.6 mm

Square shape with equal length and width dimensions simplifies layout and alignment on the PCB.

Terminal Form: BALL

Ball terminal form allows for reliable electrical connections and easy rework if needed.

Telecom IC Type: ETHERNET SWITCH

Ethernet switch functionality enables efficient data transfer and network management in telecom applications.

Nominal Supply Voltage: 0.9 V

Low nominal supply voltage for energy efficiency and compatibility with low-power systems.

Terminal Pitch: 0.8 mm

Fine terminal pitch enables high-density mounting and enhances signal integrity in the circuit.

Technical Specifications

Telecom - Switching ICs VSC7546TSN-V/5CC-VAO attributes and parameters. Explore more Telecom - Switching ICs devices from Microchip Technology

Specs

JESD-30 Code:

S-PBGA-B888

Length:

24.6 mm

No. of Functions:

1

No. of Terminals:

888

Maximum Operating Temperature:

110 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA888,30X30,32

Package Shape:

Package Style (Meter):

GRID ARRAY, FINE PITCH

Screening Level:

AEC-Q100

Maximum Seated Height:

2.806 mm

Nominal Supply Voltage:

.9 V

Surface Mount:

YES

Telecom IC Type:

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Width:

24.6 mm

Trade Compliance

VSC7546TSN-V/5CC-VAO Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Microchip Technology

Microchip Technology Incorporated is a leading provider of integrated circuit (IC) solutions for the global market. Founded in 1989, the company designs, manufactures, tests and markets state-of-the-art microcontrollers and analog devices for use in a wide array of electronics applications, such as the automotive industry, consumer electronics and industrial automation. Through its world-class production processes and technologies, Microchip Technology has become an innovator of semiconductor solutions that enable customers to maximize their performance while streamlining costs.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President and CEO

Ganesh Moorthy

Executive Chair

Steve Sanghi

CFO, Senior VP

J. Eric Bjornholt

Manufacturer fab locations 9

Fab name Location Fab Initiation Wafer Capacity

Fab 5 - Colorado

Fabrication

Fab Initiation

1995

USA

Colorado Springs

Wafer Capacity

70,000

1995

70,000

Santa Clara

Fabrication

Fab Initiation

1990

USA

Santa Clara

Wafer Capacity

1,290

1990

1,290

Lawrence

Fabrication

Fab Initiation

1989

USA

Lawrence

Wafer Capacity

5,000

1989

5,000

Fab 4 - Gresham

Fabrication

Fab Initiation

1988

USA

Gresham

Wafer Capacity

50,000

1988

50,000

Fab 2 - Tempe

Fabrication

Fab Initiation

1994

USA

Tempe

Wafer Capacity

30,000

1994

30,000

Beverly

Fabrication

Fab Initiation

1985

USA

Beverly

Wafer Capacity

2,000

1985

2,000

Lowell

Fabrication

Fab Initiation

1986

USA

Lowell

Wafer Capacity

15,000

1986

15,000

Garden Grove

Fabrication

Fab Initiation

1985

USA

Garden Grove

Wafer Capacity

12,000

1985

12,000

New Fab - Gresham

Fabrication

Fab Initiation

2024

USA

Gresham

Wafer Capacity

2024

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