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KSZ8567RTXVVAO

Microchip Technology

KSZ8567RTXVVAO by Microchip Technology

Microchip Technology's KSZ8567RTXVVAO is an Ethernet switch IC with 128 terminals, operating from -40 to 105°C. It features a flatpack package style, AEC-Q100 screening level, and Gull Wing terminal form. Ideal for telecom applications requiring a 1.2V supply voltage in industrial temperature environments.

Median Price

$17.590

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Microchip Technology

USA . 14,220 parts In-Stock

1+ parts

$17.590

100+ parts

$13.330

1k+ parts

$12.320

10k+ parts

$11.680

14,220

$17.590

$13.330

$12.320

$11.680

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 150 parts In-Stock

1+ parts

$9.420

100+ parts

-

1k+ parts

-

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-

150

$9.420

-

-

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Vyrian

USA . 10,949 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

10,949

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-

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corohmni

South Africa . 336 parts In-Stock

1+ parts

$7.637

100+ parts

-

1k+ parts

-

10k+ parts

-

336

$7.637

-

-

-

Aztec Data Supply Inc.

USA . 159 parts In-Stock

1+ parts

$8.030

100+ parts

-

1k+ parts

-

10k+ parts

-

159

$8.030

-

-

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Bastille Electronics

Australia . 54 parts In-Stock

1+ parts

$9.420

100+ parts

$8.949

1k+ parts

-

10k+ parts

$8.384

54

$9.420

$8.949

-

$8.384

Continental Prestige Electronics

USA . 3,578 parts In-Stock

1+ parts

$9.420

100+ parts

-

1k+ parts

-

10k+ parts

$9.232

3,578

$9.420

-

-

$9.232

Ampacity Inc.

Singapore . 14,827 parts In-Stock

1+ parts

$14.950

100+ parts

-

1k+ parts

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14,827

$14.950

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Semicontronic

India . 14,726 parts In-Stock

1+ parts

$14.950

100+ parts

$14.576

1k+ parts

$14.502

10k+ parts

-

14,726

$14.950

$14.576

$14.502

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Lixinc

USA . 15,224 parts In-Stock

1+ parts

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15,224

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Authorized Procurement Solutions

USA . 12,000 parts In-Stock

1+ parts

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12,000

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RGB Technical Solutions

Ukraine . 6,675 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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6,675

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Argo Parts USA

USA . 4,991 parts In-Stock

1+ parts

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4,991

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Overview

Elevate your network performance with the Microchip Technology KSZ8567RTXVVAO Ethernet Switch. Crafted with precision and expertise, this Telecom IC offers unparalleled reliability and efficiency. Whether you're looking to enhance your data transmission speed or streamline your network connections, this product delivers exceptional value and performance. Ideal for a wide range of applications, trust Microchip Technology to provide cutting-edge solutions that meet your networking needs. Choose quality, choose innovation, choose Microchip Technology.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is durable and lightweight, making the product easy to handle and install.

Surface Mount: YES

Allows for easy and secure attachment to circuit boards, ensuring reliable performance.

Screening Level: AEC-Q100

This high level of screening ensures the product meets automotive industry standards, making it suitable for use in vehicles.

Package Shape: SQUARE

The square shape allows for efficient use of space on the circuit board, optimizing layout and reducing footprint.

No. of Terminals: 128

With a high number of terminals, this product can accommodate complex wiring configurations for versatile applications.

Package Style (Meter): FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH

The various package styles offer flexibility in design and integration options, catering to different system requirements.

Maximum Operating Temperature: 105 °C

The high maximum operating temperature ensures reliability even in harsh environmental conditions.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature allows for use in a wide range of climates without compromising performance.

Terminal Position: QUAD

The quad terminal position facilitates easy connection to external components, simplifying installation and maintenance.

Maximum Seated Height: 1.2 mm

The low seated height saves space on the circuit board, enabling a compact overall design.

Width: 14 mm

The narrow width of the product makes it suitable for applications where space is limited.

Maximum Time At Peak Reflow Temperature (s): 30

This feature ensures that the product can withstand high reflow temperatures for a short duration, enabling soldering without damage.

Peak Reflow Temperature °C: 260

The high peak reflow temperature capability allows for reliable soldering connections, ensuring a secure bond between the product and the circuit board.

Length: 14 mm

The compact length of the product offers versatility in placement options and allows for integration into various system designs.

Temperature Grade: INDUSTRIAL

Designed for industrial environments, this product can withstand extreme temperature variations and harsh conditions.

Terminal Form: GULL WING

The gull wing terminal form provides a reliable connection point and ease of soldering, ensuring secure attachment to the circuit board.

Telecom IC Type: ETHERNET SWITCH

This type of IC is specifically designed for managing network traffic and ensuring smooth communication, making it ideal for telecom applications.

Nominal Supply Voltage: 1.2 V

The low supply voltage requirement reduces power consumption, making the product energy-efficient.

Terminal Pitch: 0.4 mm

The small terminal pitch allows for close spacing between terminals, enabling high-density integration and compact circuit designs.

Technical Specifications

Telecom - Switching ICs KSZ8567RTXVVAO attributes and parameters. Explore more Telecom - Switching ICs devices from Microchip Technology

Specs

JESD-30 Code:

S-PQFP-G128

Length:

14 mm

No. of Functions:

1

No. of Terminals:

128

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TQFP128,.63SQ,16

Package Shape:

Package Style (Meter):

FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Screening Level:

AEC-Q100

Maximum Seated Height:

1.2 mm

Nominal Supply Voltage:

1.2 V

Surface Mount:

YES

Telecom IC Type:

Temperature Grade:

Terminal Form:

Terminal Pitch:

.4 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

14 mm

Trade Compliance

KSZ8567RTXVVAO Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Microchip Technology

Microchip Technology Incorporated is a leading provider of integrated circuit (IC) solutions for the global market. Founded in 1989, the company designs, manufactures, tests and markets state-of-the-art microcontrollers and analog devices for use in a wide array of electronics applications, such as the automotive industry, consumer electronics and industrial automation. Through its world-class production processes and technologies, Microchip Technology has become an innovator of semiconductor solutions that enable customers to maximize their performance while streamlining costs.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President and CEO

Ganesh Moorthy

Executive Chair

Steve Sanghi

CFO, Senior VP

J. Eric Bjornholt

Manufacturer fab locations 9

Fab name Location Fab Initiation Wafer Capacity

Fab 5 - Colorado

Fabrication

Fab Initiation

1995

USA

Colorado Springs

Wafer Capacity

70,000

1995

70,000

Santa Clara

Fabrication

Fab Initiation

1990

USA

Santa Clara

Wafer Capacity

1,290

1990

1,290

Lawrence

Fabrication

Fab Initiation

1989

USA

Lawrence

Wafer Capacity

5,000

1989

5,000

Fab 4 - Gresham

Fabrication

Fab Initiation

1988

USA

Gresham

Wafer Capacity

50,000

1988

50,000

Fab 2 - Tempe

Fabrication

Fab Initiation

1994

USA

Tempe

Wafer Capacity

30,000

1994

30,000

Beverly

Fabrication

Fab Initiation

1985

USA

Beverly

Wafer Capacity

2,000

1985

2,000

Lowell

Fabrication

Fab Initiation

1986

USA

Lowell

Wafer Capacity

15,000

1986

15,000

Garden Grove

Fabrication

Fab Initiation

1985

USA

Garden Grove

Wafer Capacity

12,000

1985

12,000

New Fab - Gresham

Fabrication

Fab Initiation

2024

USA

Gresham

Wafer Capacity

2024

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