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LAN9352TI/ML

Microchip Technology

LAN9352TI/ML by Microchip Technology

LAN9352TI/ML by Microchip Technology is a telecom IC type Ethernet transceiver with surface mount capability. It operates at a temperature range of -40 to 85 °C and has a nominal voltage of 3.3 V. This IC is commonly used in telecommunications and switching applications.

Median Price

$14.960

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 10 parts In-Stock

1+ parts

$14.960

100+ parts

-

1k+ parts

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10

$14.960

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Vyrian

USA . 4,714 parts In-Stock

1+ parts

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4,714

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 316 parts In-Stock

1+ parts

$6.801

100+ parts

-

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316

$6.801

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Continental Prestige Electronics

USA . 1,005 parts In-Stock

1+ parts

$14.960

100+ parts

-

1k+ parts

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10k+ parts

$14.661

1,005

$14.960

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$14.661

QUARKTWIN TECHNOLOGY LTD

USA . 13,666 parts In-Stock

1+ parts

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100+ parts

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13,666

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Marpe Global Electronics

Taiwan . 6,564 parts In-Stock

1+ parts

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6,564

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QualityLine Systems

Poland . 6,564 parts In-Stock

1+ parts

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6,564

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XL Components Corporation

Australia . 6,564 parts In-Stock

1+ parts

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6,564

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Argo Parts USA

USA . 1,427 parts In-Stock

1+ parts

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1,427

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Netroflash

USA . 50 parts In-Stock

1+ parts

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100+ parts

$14.661

1k+ parts

$14.212

10k+ parts

$13.913

50

-

$14.661

$14.212

$13.913

Overview

Experience the power of seamless connectivity with the LAN9352TI/ML by Microchip Technology. As a leading manufacturer in the telecom industry, Microchip is known for its exceptional quality and reliability. The LAN9352TI/ML is a cutting-edge Ethernet transceiver that offers unmatched performance and versatility. With its surface mount design and compact size, this product is perfect for applications requiring efficient switching. Whether you're building a telecommunications network or designing advanced communication systems, the LAN9352TI/ML delivers value, benefits, and advantages that are second to none. Enjoy faster data transfer, enhanced signal integrity, and effortless integration with this innovative solution. Trust Microchip Technology to revolutionize your connectivity experience.

Feature Benefit Bullets

Surface Mount: YES

This product is surface mountable, making it easy to integrate into various telecom systems and devices.

No. of Functions: 1

With a single function, this product offers simplicity and efficiency in telecom switching applications.

Screening Level: TS 16949

This product meets the TS 16949 screening level, ensuring high quality and reliability in demanding telecom environments.

Package Shape: SQUARE

The square package shape allows for easy handling and compatibility with other components, simplifying the integration process.

No. of Terminals: 72

With 72 terminals, this switching IC provides versatile connectivity options for enhanced performance in telecom applications.

Package Style (Meter): CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

The combination of chip carrier, heat sink slug, and very thin profile package style offers efficient heat dissipation and space-saving advantages.

Maximum Operating Temperature: 85 °C

This product can operate at temperatures up to 85°C, allowing it to withstand high-temperature environments in telecom systems.

Minimum Operating Temperature: -40 °C

With a minimum operating temperature of -40°C, this product remains functional even in extremely cold conditions.

Terminal Position: QUAD

The quad terminal position provides flexibility in circuit board layout and ensures optimal performance in telecom applications.

Maximum Seated Height: 1 mm

With a maximum seated height of 1 mm, this switching IC offers a compact form factor, enabling space-efficient designs in telecom devices.

Width: 10 mm

At a width of 10 mm, this product provides a compact footprint without sacrificing functionality, making it suitable for space-constrained telecom setups.

Length: 10 mm

With a length of 10 mm, this switching IC offers a balanced form factor that fits well in various telecom applications.

Temperature Grade: INDUSTRIAL

This product maintains stable performance in industrial temperature ranges, ensuring reliability and longevity in telecom systems.

Terminal Form: NO LEAD

The no-lead terminal form enhances solder joint integrity and makes this switching IC suitable for applications requiring high vibration resistance in the telecom sector.

Telecom IC Type: ETHERNET TRANSCEIVER

As an Ethernet transceiver IC, this product is specifically designed for high-speed data transmission in telecommunication networks.

Nominal Supply Voltage: 3.3 V

With a nominal supply voltage of 3.3 V, this switching IC offers compatibility with common voltage standards in telecom systems.

Terminal Pitch: 0.5 mm

The terminal pitch of 0.5 mm provides a fine pitch spacing, enabling high-density integration in telecom circuit designs.

Technical Specifications

Telecom - Switching ICs LAN9352TI/ML attributes and parameters. Explore more Telecom - Switching ICs devices from Microchip Technology

Specs

JESD-30 Code:

S-XQCC-N72

Length:

10 mm

No. of Functions:

1

No. of Terminals:

72

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

UNSPECIFIED

Package Code:

Package Equivalence Code:

LCC72,.39SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Screening Level:

TS 16949

Maximum Seated Height:

1 mm

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Telecom IC Type:

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

10 mm

Trade Compliance

LAN9352TI/ML Telecommunications trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Microchip Technology

Microchip Technology Incorporated is a leading provider of integrated circuit (IC) solutions for the global market. Founded in 1989, the company designs, manufactures, tests and markets state-of-the-art microcontrollers and analog devices for use in a wide array of electronics applications, such as the automotive industry, consumer electronics and industrial automation. Through its world-class production processes and technologies, Microchip Technology has become an innovator of semiconductor solutions that enable customers to maximize their performance while streamlining costs.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President and CEO

Ganesh Moorthy

Executive Chair

Steve Sanghi

CFO, Senior VP

J. Eric Bjornholt

Manufacturer fab locations 9

Fab name Location Fab Initiation Wafer Capacity

Fab 5 - Colorado

Fabrication

Fab Initiation

1995

USA

Colorado Springs

Wafer Capacity

70,000

1995

70,000

Santa Clara

Fabrication

Fab Initiation

1990

USA

Santa Clara

Wafer Capacity

1,290

1990

1,290

Lawrence

Fabrication

Fab Initiation

1989

USA

Lawrence

Wafer Capacity

5,000

1989

5,000

Fab 4 - Gresham

Fabrication

Fab Initiation

1988

USA

Gresham

Wafer Capacity

50,000

1988

50,000

Fab 2 - Tempe

Fabrication

Fab Initiation

1994

USA

Tempe

Wafer Capacity

30,000

1994

30,000

Beverly

Fabrication

Fab Initiation

1985

USA

Beverly

Wafer Capacity

2,000

1985

2,000

Lowell

Fabrication

Fab Initiation

1986

USA

Lowell

Wafer Capacity

15,000

1986

15,000

Garden Grove

Fabrication

Fab Initiation

1985

USA

Garden Grove

Wafer Capacity

12,000

1985

12,000

New Fab - Gresham

Fabrication

Fab Initiation

2024

USA

Gresham

Wafer Capacity

2024

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