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BCM53115MIPBG

Broadcom

BCM53115MIPBG by Broadcom

ETHERNET TRANSCEIVER; Terminal Form: BALL; No. of Terminals: 484; Package Code: BGA; Package Shape: SQUARE; Surface Mount: YES;

Median Price

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Vyrian

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Chip Stock

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Semicontronic

India . 1,627 parts In-Stock

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Decca Corp

Germany . 495 parts In-Stock

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AZTECH Wire

Italy . 496 parts In-Stock

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Ampacity Inc.

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Corohmni

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Component Stockers USA

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Microchip USA

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Authorized Procurement Solutions

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A-Z Elektronik GmbH

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Alle Elektronik GmbH

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Glotronic Ltd.

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Continental Prestige Electronics

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Vigor

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Argo Parts USA

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GreenTree Electronics

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Corphita

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Bastille Electronics

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Kepictronics

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Technical Specifications

Telecom - Switching ICs BCM53115MIPBG attributes and parameters. Explore more Telecom - Switching ICs devices from Broadcom

Specs

JESD-30 Code:

S-PBGA-B484

Length:

23 mm

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

484

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

BGA

Package Equivalence Code:

BGA484,22X22,40

Package Shape:

Package Style (Meter):

GRID ARRAY

Peak Reflow Temperature (C):

250

Maximum Seated Height:

2.43 mm

Nominal Supply Voltage:

1.2 V

Surface Mount:

YES

Technology:

CMOS

Telecom IC Type:

Terminal Form:

Terminal Pitch:

1 mm

Terminal Position:

BOTTOM

Width:

23 mm

Trade Compliance

BCM53115MIPBG Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Broadcom

Broadcom Inc, a Delaware corporation headquartered in San Jose, CA, is a global technology leader that designs, develops and supplies a broad range of semiconductor and infrastructure software solutions. Broadcom’s category-leading product portfolio serves critical markets including data center, networking, software, broadband, wireless, storage and industrial. Our solutions include data center networking and storage, enterprise and mainframe software focused on automation, monitoring and security, smartphone components, telecoms and factory automation.

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