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KSZ8567RTXV-TRVAO

Microchip Technology

KSZ8567RTXV-TRVAO by Microchip Technology

KSZ8567RTXV-TRVAO by Microchip: Ethernet switch IC with 128 terminals, operates b/w -40 to 105 °C, suitable for telecom applications. Package style includes flatpack and gull wing terminals, AEC-Q100 screening level for industrial use.

Median Price

$17.660

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Microchip Technology

USA . 2,990 parts In-Stock

1+ parts

$17.660

100+ parts

$13.380

1k+ parts

$12.360

10k+ parts

$11.720

2,990

$17.660

$13.380

$12.360

$11.720

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 20 parts In-Stock

1+ parts

$9.460

100+ parts

-

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20

$9.460

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Vyrian

USA . 12,540 parts In-Stock

1+ parts

-

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12,540

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Continental Prestige Electronics

USA . 3,377 parts In-Stock

1+ parts

$9.460

100+ parts

-

1k+ parts

-

10k+ parts

$9.271

3,377

$9.460

-

-

$9.271

Netroflash

USA . 2,000 parts In-Stock

1+ parts

$9.460

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-

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2,000

$9.460

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Corohmni

South Africa . 37 parts In-Stock

1+ parts

$10.353

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-

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37

$10.353

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Aztec Data Supply Inc.

USA . 2,984 parts In-Stock

1+ parts

$10.630

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2,984

$10.630

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Advanced Electronics

New Zealand . 60 parts In-Stock

1+ parts

$10.805

100+ parts

$10.264

1k+ parts

$10.264

10k+ parts

-

60

$10.805

$10.264

$10.264

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Ampacity Inc.

Singapore . 12,579 parts In-Stock

1+ parts

$15.010

100+ parts

-

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12,579

$15.010

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Semicontronic

India . 2,942 parts In-Stock

1+ parts

$15.010

100+ parts

$14.635

1k+ parts

$14.560

10k+ parts

-

2,942

$15.010

$14.635

$14.560

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Authorized Procurement Solutions

USA . 12,000 parts In-Stock

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12,000

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RGB Technical Solutions

Ukraine . 6,794 parts In-Stock

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6,794

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Argo Parts USA

USA . 3,482 parts In-Stock

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3,482

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Lixinc

USA . 988 parts In-Stock

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988

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Overview

Experience seamless connectivity and unparalleled performance with the Microchip Technology KSZ8567RTXV-TRVAO Ethernet Switch. Manufactured by industry leader Microchip Technology, this Telecom - Switching IC offers reliability and innovation in a compact package. Perfect for a wide range of applications, this product is designed to meet the highest standards of quality and efficiency. Trust in Microchip Technology to deliver cutting-edge technology that enhances your network connectivity. Elevate your networking experience with the KSZ8567RTXV-TRVAO today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/epoxy material provides durability and protection for the IC, ensuring it can withstand various environmental conditions.

Surface Mount: YES

Surface mount capability allows for easy and efficient assembly onto circuit boards, saving time and effort during manufacturing.

Package Shape: SQUARE

Square package shape optimizes space utilization on the circuit board, making it suitable for compact designs.

Maximum Operating Temperature: 105 °C

High maximum operating temperature ensures reliable performance in potentially hot environments, increasing the product's overall reliability.

Minimum Operating Temperature: -40 °C

Wide range of operating temperatures allows the IC to function even in extremely cold conditions, enhancing its versatility.

Telecom IC Type: ETHERNET SWITCH

Ethernet switch type enables the IC to efficiently manage network traffic, making it ideal for telecom applications requiring reliable data transmission.

Nominal Supply Voltage: 1.2 V

Low supply voltage requirement helps in reducing power consumption and heat generation, contributing to energy efficiency.

Technical Specifications

Telecom - Switching ICs KSZ8567RTXV-TRVAO attributes and parameters. Explore more Telecom - Switching ICs devices from Microchip Technology

Specs

JESD-30 Code:

S-PQFP-G128

Length:

14 mm

No. of Functions:

1

No. of Terminals:

128

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TQFP128,.63SQ,16

Package Shape:

Package Style (Meter):

FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Screening Level:

AEC-Q100

Maximum Seated Height:

1.2 mm

Nominal Supply Voltage:

1.2 V

Surface Mount:

YES

Telecom IC Type:

Temperature Grade:

Terminal Form:

Terminal Pitch:

.4 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

14 mm

Trade Compliance

KSZ8567RTXV-TRVAO Telecommunications trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Microchip Technology

Microchip Technology Incorporated is a leading provider of integrated circuit (IC) solutions for the global market. Founded in 1989, the company designs, manufactures, tests and markets state-of-the-art microcontrollers and analog devices for use in a wide array of electronics applications, such as the automotive industry, consumer electronics and industrial automation. Through its world-class production processes and technologies, Microchip Technology has become an innovator of semiconductor solutions that enable customers to maximize their performance while streamlining costs.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President and CEO

Ganesh Moorthy

Executive Chair

Steve Sanghi

CFO, Senior VP

J. Eric Bjornholt

Manufacturer fab locations 9

Fab name Location Fab Initiation Wafer Capacity

Fab 5 - Colorado

Fabrication

Fab Initiation

1995

USA

Colorado Springs

Wafer Capacity

70,000

1995

70,000

Santa Clara

Fabrication

Fab Initiation

1990

USA

Santa Clara

Wafer Capacity

1,290

1990

1,290

Lawrence

Fabrication

Fab Initiation

1989

USA

Lawrence

Wafer Capacity

5,000

1989

5,000

Fab 4 - Gresham

Fabrication

Fab Initiation

1988

USA

Gresham

Wafer Capacity

50,000

1988

50,000

Fab 2 - Tempe

Fabrication

Fab Initiation

1994

USA

Tempe

Wafer Capacity

30,000

1994

30,000

Beverly

Fabrication

Fab Initiation

1985

USA

Beverly

Wafer Capacity

2,000

1985

2,000

Lowell

Fabrication

Fab Initiation

1986

USA

Lowell

Wafer Capacity

15,000

1986

15,000

Garden Grove

Fabrication

Fab Initiation

1985

USA

Garden Grove

Wafer Capacity

12,000

1985

12,000

New Fab - Gresham

Fabrication

Fab Initiation

2024

USA

Gresham

Wafer Capacity

2024

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