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BCM53115MKPB

Broadcom

BCM53115MKPB by Broadcom

ETHERNET TRANSCEIVER; Terminal Form: BALL; No. of Terminals: 484; Package Code: BGA; Package Shape: SQUARE; Width: 23 mm;

Median Price

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Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 385 parts In-Stock

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385

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Bristol Electronics

USA . 315 parts In-Stock

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315

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Dan-Mar Components

USA . 315 parts In-Stock

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315

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Digiode

USA . 149 parts In-Stock

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149

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Distributors (Availability)

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Native Components

USA . 766 parts In-Stock

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$0.575

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766

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Northwest PG Solutions

USA . 2,294 parts In-Stock

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$0.632

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2,294

$0.632

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Decca Corp

Germany . 471 parts In-Stock

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$9.000

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$8.820

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$8.732

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471

$9.000

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$8.732

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Supply Digital

USA . 2,484 parts In-Stock

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2,484

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Corphita

USA . 159 parts In-Stock

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Technical Specifications

Telecom - Switching ICs BCM53115MKPB attributes and parameters. Explore more Telecom - Switching ICs devices from Broadcom

Specs

JESD-30 Code:

S-PBGA-B484

Length:

23 mm

No. of Functions:

1

No. of Terminals:

484

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

BGA

Package Equivalence Code:

BGA484,22X22,40

Package Shape:

Package Style (Meter):

GRID ARRAY

Maximum Seated Height:

2.43 mm

Nominal Supply Voltage:

1.2 V

Surface Mount:

YES

Technology:

CMOS

Telecom IC Type:

Terminal Form:

Terminal Pitch:

1 mm

Terminal Position:

BOTTOM

Width:

23 mm

PCN

Manufacturer Highlights

Broadcom

Broadcom Inc, a Delaware corporation headquartered in San Jose, CA, is a global technology leader that designs, develops and supplies a broad range of semiconductor and infrastructure software solutions. Broadcom’s category-leading product portfolio serves critical markets including data center, networking, software, broadband, wireless, storage and industrial. Our solutions include data center networking and storage, enterprise and mainframe software focused on automation, monitoring and security, smartphone components, telecoms and factory automation.

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