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KSZ8873MLLI-TR

Microchip Technology

KSZ8873MLLI-TR by Microchip Technology

Microchip Technology's KSZ8873MLLI-TR is an Ethernet switch IC with 1 function, operating at -40 to 85°C. It features a 64-terminal flatpack package suitable for telecom applications. The IC has a nominal voltage of 3.3V and AEC-Q100 screening level for industrial use.

Median Price

$7.640

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Microchip Technology

USA . 33,000 parts In-Stock

1+ parts

$7.640

100+ parts

$5.780

1k+ parts

$5.360

10k+ parts

$5.060

33,000

$7.640

$5.780

$5.360

$5.060

Mouser Electronics

USA . 2,305 parts In-Stock

1+ parts

$7.640

100+ parts

$6.300

1k+ parts

-

10k+ parts

-

2,305

$7.640

$6.300

-

-

DigiKey

USA . 1,679 parts In-Stock

1+ parts

$7.640

100+ parts

$6.150

1k+ parts

$6.150

10k+ parts

-

1,679

$7.640

$6.150

$6.150

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 89 parts In-Stock

1+ parts

$7.167

100+ parts

-

1k+ parts

-

10k+ parts

-

89

$7.167

-

-

-

NAC Semi

USA . 30,000 parts In-Stock

1+ parts

$7.240

100+ parts

$6.560

1k+ parts

$6.000

10k+ parts

-

30,000

$7.240

$6.560

$6.000

-

Vyrian

USA . 15,752 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

15,752

-

-

-

-

Chip Stock

USA . 6,150 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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6,150

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-

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 15,744 parts In-Stock

1+ parts

$5.190

100+ parts

-

1k+ parts

-

10k+ parts

-

15,744

$5.190

-

-

-

Continental Prestige Electronics

USA . 3,871 parts In-Stock

1+ parts

$6.990

100+ parts

-

1k+ parts

-

10k+ parts

$6.850

3,871

$6.990

-

-

$6.850

Aranea Global

USA . 1,000 parts In-Stock

1+ parts

$7.024

100+ parts

-

1k+ parts

$6.743

10k+ parts

-

1,000

$7.024

-

$6.743

-

Component Stockers USA

USA . 13,869 parts In-Stock

1+ parts

$7.560

100+ parts

$5.720

1k+ parts

$5.300

10k+ parts

-

13,869

$7.560

$5.720

$5.300

-

Advanced Electronics

New Zealand . 350 parts In-Stock

1+ parts

$9.079

100+ parts

$8.625

1k+ parts

$8.625

10k+ parts

-

350

$9.079

$8.625

$8.625

-

Semicontronic

India . 15,770 parts In-Stock

1+ parts

$11.300

100+ parts

$11.018

1k+ parts

$10.961

10k+ parts

-

15,770

$11.300

$11.018

$10.961

-

Corohmni

South Africa . 164 parts In-Stock

1+ parts

$12.086

100+ parts

-

1k+ parts

-

10k+ parts

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164

$12.086

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-

-

Aztec Data Supply Inc.

USA . 4,235 parts In-Stock

1+ parts

$15.201

100+ parts

-

1k+ parts

-

10k+ parts

-

4,235

$15.201

-

-

-

QUARKTWIN TECHNOLOGY LTD

USA . 17,153 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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17,153

-

-

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Lixinc

USA . 10,276 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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10,276

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-

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Fulton Briggs Corp.

USA . 1,429 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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1,429

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-

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Authorized Procurement Solutions

USA . 1,000 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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1,000

-

-

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A-Z Elektronik GmbH

Germany . 1,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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1,000

-

-

-

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Futuretech Components

Singapore . 900 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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900

-

-

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Argo Parts USA

USA . 85 parts In-Stock

1+ parts

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100+ parts

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1k+ parts

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85

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Overview

Unleash the power of seamless connectivity with the Microchip Technology KSZ8873MLLI-TR Ethernet Switch. Crafted with precision and expertise, this Telecom - Switching IC is designed to elevate your networking experience to new heights. With a focus on reliability and performance, this product boasts AEC-Q100 and TS 16949 screening levels, ensuring top-notch quality and durability. Whether you're looking to streamline your communication systems or enhance data transfer speeds, the KSZ8873MLLI-TR is the perfect solution for all your networking needs. Trust Microchip Technology to deliver unparalleled value and innovation with every product they create. Elevate your networking game today with the KSZ8873MLLI-TR.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and helps in reducing the overall weight of the product, making it a good choice for portable applications.

Surface Mount: YES

This feature allows for easy and efficient installation on circuit boards, saving time and effort in the manufacturing process.

No. of Functions: 1

With a single function, this product simplifies design and integration, making it ideal for straightforward applications.

Screening Level: AEC-Q100; TS 16949

This high screening level ensures reliability and quality performance, making it suitable for mission-critical systems.

Package Shape: SQUARE

The square shape enables space-efficient placement on the board, maximizing PCB real estate and allowing for compact designs.

No. of Terminals: 64

With a large number of terminals, this product offers enhanced connectivity options, making it versatile for various configurations.

Package Style (Meter): FLATPACK, LOW PROFILE, FINE PITCH

This package style allows for high-density packaging, enabling more functionality in a smaller footprint.

Maximum Operating Temperature: 85 °C

The high operating temperature range ensures stable performance even under challenging conditions, increasing the product's reliability.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature makes this product suitable for use in harsh environments or outdoor settings.

Terminal Finish: MATTE TIN

The matte tin finish provides good solderability and corrosion resistance, ensuring long-term performance and reliability.

Terminal Position: QUAD

The quad terminal position facilitates easy connections, simplifying the installation process and improving overall product usability.

Maximum Seated Height: 1.6 mm

The low seated height allows for a slim and compact design, making this product suitable for space-constrained applications.

Width: 10 mm

The compact width dimensions make this product ideal for applications where space is limited, offering flexibility in design.

Maximum Time At Peak Reflow Temperature (s): 30

The short reflow time minimizes the risk of thermal damage, ensuring the integrity of the product during assembly.

Peak Reflow Temperature °C: 260

The high peak reflow temperature capability allows for reliable solder joints and ensures optimal manufacturing quality.

Length: 10 mm

The compact length dimensions offer versatility in placement options, making this product suitable for various board sizes.

Temperature Grade: INDUSTRIAL

The industrial temperature grade ensures reliable operation in demanding environments, making this product suitable for rugged applications.

Terminal Form: GULL WING

The gull-wing terminal form provides mechanical strength and ease of soldering, ensuring robust connections and long-term reliability.

Telecom IC Type: ETHERNET SWITCH

This Ethernet switch type offers high-speed data transmission and networking capabilities, making it ideal for telecom and data communication applications.

Nominal Supply Voltage: 3.3 V

The stable supply voltage ensures consistent performance and reliable operation, enhancing the overall functionality of the product.

Terminal Pitch: 0.5 mm

The small terminal pitch enables high-density packaging and facilitates miniaturization, making this product suitable for compact designs.

Technical Specifications

Telecom - Switching ICs KSZ8873MLLI-TR attributes and parameters. Explore more Telecom - Switching ICs devices from Microchip Technology

Specs

Additional Features:

Internal 1.8V LDO

JESD-30 Code:

S-PQFP-G64

JESD-609 Code:

e3

Length:

10 mm

No. of Functions:

1

No. of Terminals:

64

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP64,.47SQ,20

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Screening Level:

AEC-Q100; TS 16949

Maximum Seated Height:

1.6 mm

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Telecom IC Type:

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

10 mm

Trade Compliance

KSZ8873MLLI-TR Telecommunications trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Microchip Technology

Microchip Technology Incorporated is a leading provider of integrated circuit (IC) solutions for the global market. Founded in 1989, the company designs, manufactures, tests and markets state-of-the-art microcontrollers and analog devices for use in a wide array of electronics applications, such as the automotive industry, consumer electronics and industrial automation. Through its world-class production processes and technologies, Microchip Technology has become an innovator of semiconductor solutions that enable customers to maximize their performance while streamlining costs.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President and CEO

Ganesh Moorthy

Executive Chair

Steve Sanghi

CFO, Senior VP

J. Eric Bjornholt

Manufacturer fab locations 9

Fab name Location Fab Initiation Wafer Capacity

Fab 5 - Colorado

Fabrication

Fab Initiation

1995

USA

Colorado Springs

Wafer Capacity

70,000

1995

70,000

Santa Clara

Fabrication

Fab Initiation

1990

USA

Santa Clara

Wafer Capacity

1,290

1990

1,290

Lawrence

Fabrication

Fab Initiation

1989

USA

Lawrence

Wafer Capacity

5,000

1989

5,000

Fab 4 - Gresham

Fabrication

Fab Initiation

1988

USA

Gresham

Wafer Capacity

50,000

1988

50,000

Fab 2 - Tempe

Fabrication

Fab Initiation

1994

USA

Tempe

Wafer Capacity

30,000

1994

30,000

Beverly

Fabrication

Fab Initiation

1985

USA

Beverly

Wafer Capacity

2,000

1985

2,000

Lowell

Fabrication

Fab Initiation

1986

USA

Lowell

Wafer Capacity

15,000

1986

15,000

Garden Grove

Fabrication

Fab Initiation

1985

USA

Garden Grove

Wafer Capacity

12,000

1985

12,000

New Fab - Gresham

Fabrication

Fab Initiation

2024

USA

Gresham

Wafer Capacity

2024

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