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KSZ8864RMNI

Microchip Technology

KSZ8864RMNI by Microchip Technology

Microchip Technology's KSZ8864RMNI is a 64-terminal Ethernet switch IC with a package style of chip carrier. Operating temperature ranges from -40 to 85°C, making it suitable for industrial applications. With a nominal voltage of 1.2V, it offers high performance in telecom switching systems.

Median Price

$5.421

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

< 1k

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 100 parts In-Stock

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$5.421

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$5.421

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Vyrian

USA . 307 parts In-Stock

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307

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LIBRA Elektronik GmbH

Germany . 4 parts In-Stock

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Bastille Electronics

Australia . 300 parts In-Stock

1+ parts

$5.421

100+ parts

$5.150

1k+ parts

$4.892

10k+ parts

$4.825

300

$5.421

$5.150

$4.892

$4.825

AZTECH Wire

Italy . 407 parts In-Stock

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$7.777

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$7.777

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Aztec Data Supply Inc.

USA . 295 parts In-Stock

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$12.190

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295

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Advanced Electronics

New Zealand . 29 parts In-Stock

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$14.168

100+ parts

$12.893

1k+ parts

$11.618

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29

$14.168

$12.893

$11.618

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Corohmni

South Africa . 645 parts In-Stock

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$14.172

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645

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Ampacity Inc.

Singapore . 771 parts In-Stock

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$784.000

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Marpe Global Electronics

Taiwan . 5,667 parts In-Stock

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QualityLine Systems

Poland . 5,667 parts In-Stock

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XL Components Corporation

Australia . 5,667 parts In-Stock

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Argo Parts USA

USA . 3,611 parts In-Stock

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Authorized Procurement Solutions

USA . 3,000 parts In-Stock

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Perfect Parts

USA . 1,299 parts In-Stock

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Microchip USA

USA . 177 parts In-Stock

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Overview

Unlock seamless connectivity and unparalleled performance with the KSZ8864RMNI by Microchip Technology. As a trusted leader in the industry, Microchip Technology delivers top-quality products like this Ethernet switch, perfect for telecom applications. With its surface mount design and compact square package shape, this switch offers reliability and efficiency in a wide range of environments. Experience the benefits of fast and secure data transmission with the KSZ8864RMNI, providing value and convenience to customers looking for cutting-edge solutions. Elevate your connectivity with Microchip Technology today.

Feature Benefit Bullets

Surface Mount: YES

Allows for easy and convenient installation on circuit boards, improving efficiency.

Package Shape: SQUARE

This compact shape saves space on the board, making it ideal for applications with limited area.

No. of Terminals: 64

Offers a high level of connectivity and flexibility for various network configurations.

Package Style: CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Provides enhanced thermal performance and reliability in a compact design.

Maximum Operating Temperature: 85 °C

Ensures the product can operate effectively in a wide range of environments.

Minimum Operating Temperature: -40 °C

Allows for reliable performance even in extreme cold conditions.

Terminal Finish: MATTE TIN

Provides a durable and corrosion-resistant finish for long-term reliability.

Terminal Position: QUAD

Enables easy and secure connections to the circuit board for stable performance.

Maximum Seated Height: 0.9 mm

Low profile design helps save space and allows for more compact design options.

Width: 8 mm

Compact width makes it suitable for tight spaces and small form factor applications.

Maximum Time At Peak Reflow Temperature (s): 30

Ensures proper soldering and assembly for optimal performance and reliability.

Peak Reflow Temperature °C: 260

Withstands high temperatures during reflow soldering process without damage.

Length: 8 mm

Compact length allows for flexibility in board layout and design.

Temperature Grade: INDUSTRIAL

Suitable for industrial applications with reliable performance in challenging environments.

Terminal Form: NO LEAD

Lead-free design complies with environmental regulations and eliminates potential health hazards.

Telecom IC Type: ETHERNET SWITCH

Specifically designed for Ethernet switching applications for efficient data transfer.

Nominal Supply Voltage: 1.2 V

Low voltage requirement for efficient power consumption and operation.

Terminal Pitch: 0.4 mm

Close terminal pitch allows for high density and compact design options.

Technical Specifications

Telecom - Switching ICs KSZ8864RMNI attributes and parameters. Explore more Telecom - Switching ICs devices from Microchip Technology

Specs

Additional Features:

SEATED HT-CALCULATED

JESD-30 Code:

S-XQCC-N64

JESD-609 Code:

e3

Length:

8 mm

No. of Functions:

1

No. of Terminals:

64

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

UNSPECIFIED

Package Code:

Package Equivalence Code:

LCC64,.32SQ,16

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Maximum Seated Height:

.9 mm

Nominal Supply Voltage:

1.2 V

Surface Mount:

YES

Telecom IC Type:

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.4 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

8 mm

Trade Compliance

KSZ8864RMNI Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Microchip Technology

Microchip Technology Incorporated is a leading provider of integrated circuit (IC) solutions for the global market. Founded in 1989, the company designs, manufactures, tests and markets state-of-the-art microcontrollers and analog devices for use in a wide array of electronics applications, such as the automotive industry, consumer electronics and industrial automation. Through its world-class production processes and technologies, Microchip Technology has become an innovator of semiconductor solutions that enable customers to maximize their performance while streamlining costs.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President and CEO

Ganesh Moorthy

Executive Chair

Steve Sanghi

CFO, Senior VP

J. Eric Bjornholt

Manufacturer fab locations 9

Fab name Location Fab Initiation Wafer Capacity

Fab 5 - Colorado

Fabrication

Fab Initiation

1995

USA

Colorado Springs

Wafer Capacity

70,000

1995

70,000

Santa Clara

Fabrication

Fab Initiation

1990

USA

Santa Clara

Wafer Capacity

1,290

1990

1,290

Lawrence

Fabrication

Fab Initiation

1989

USA

Lawrence

Wafer Capacity

5,000

1989

5,000

Fab 4 - Gresham

Fabrication

Fab Initiation

1988

USA

Gresham

Wafer Capacity

50,000

1988

50,000

Fab 2 - Tempe

Fabrication

Fab Initiation

1994

USA

Tempe

Wafer Capacity

30,000

1994

30,000

Beverly

Fabrication

Fab Initiation

1985

USA

Beverly

Wafer Capacity

2,000

1985

2,000

Lowell

Fabrication

Fab Initiation

1986

USA

Lowell

Wafer Capacity

15,000

1986

15,000

Garden Grove

Fabrication

Fab Initiation

1985

USA

Garden Grove

Wafer Capacity

12,000

1985

12,000

New Fab - Gresham

Fabrication

Fab Initiation

2024

USA

Gresham

Wafer Capacity

2024

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