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USB3803BI-1-GL-TR

Microchip Technology

USB3803BI-1-GL-TR by Microchip Technology

USB3803BI-1-GL-TR by Microchip Technology is a CMOS bus controller with 25 terminals in a grid array package. Operating b/w -40 to 85°C, it supports I2C bus compatibility at 3.3V. Ideal for industrial applications requiring universal serial bus peripheral ICs in a surface-mount square package.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 7,369 parts In-Stock

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7,369

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Nova Conductors

Japan . 150 parts In-Stock

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150

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Distributors (Availability)

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Ampacity Inc.

Singapore . 437 parts In-Stock

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$2.000

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437

$2.000

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AZTECH Wire

Italy . 773 parts In-Stock

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$13.012

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773

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Corohmni

South Africa . 83 parts In-Stock

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$28.102

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83

$28.102

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Authorized Procurement Solutions

USA . 20,000 parts In-Stock

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Vigor

Singapore . 5,984 parts In-Stock

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Argo Parts USA

USA . 3,692 parts In-Stock

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Kepictronics

USA . 1,691 parts In-Stock

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Marpe Global Electronics

Taiwan . 1,358 parts In-Stock

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QualityLine Systems

Poland . 1,358 parts In-Stock

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XL Components Corporation

Australia . 1,358 parts In-Stock

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1,358

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Continental Prestige Electronics

USA . 499 parts In-Stock

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499

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Microchip USA

USA . 278 parts In-Stock

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278

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Aranea Global

USA . 100 parts In-Stock

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100

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Overview

Unlock seamless connectivity with the USB3803BI-1-GL-TR by Microchip Technology. As a leading manufacturer in the industry, Microchip Technology delivers top-quality Bus Controllers that cater to various applications. This product boasts a multitude of benefits, from its reliable performance to its versatile compatibility with I2C bus systems. Experience the convenience and efficiency this universal serial bus controller brings to your projects, all while ensuring industrial-grade durability and ease of integration. Elevate your designs with the USB3803BI-1-GL-TR - the ultimate solution for your connectivity needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material ensures that the bus controller is lightweight, yet durable and resistant to impact and environmental factors.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature of 85°C, this bus controller can be used in various industrial applications without the risk of overheating.

Nominal Supply Voltage: 3.3 V

Operating at a nominal supply voltage of 3.3 V makes this bus controller energy efficient and compatible with standard power sources.

Bus Compatibility: I2C

Designed for I2C bus compatibility, this bus controller can easily integrate with a wide range of devices and peripherals, providing flexibility and ease of use.

Technical Specifications

Bus Controllers USB3803BI-1-GL-TR attributes and parameters. Explore more Bus Controllers devices from Microchip Technology

Specs

Bus Compatibility:

I2C

JESD-30 Code:

S-PBGA-B25

JESD-609 Code:

e1

No. of Terminals:

25

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

BGA

Package Shape:

Package Style (Meter):

GRID ARRAY

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Position:

BOTTOM

Trade Compliance

USB3803BI-1-GL-TR Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Microchip Technology

Microchip Technology Incorporated is a leading provider of integrated circuit (IC) solutions for the global market. Founded in 1989, the company designs, manufactures, tests and markets state-of-the-art microcontrollers and analog devices for use in a wide array of electronics applications, such as the automotive industry, consumer electronics and industrial automation. Through its world-class production processes and technologies, Microchip Technology has become an innovator of semiconductor solutions that enable customers to maximize their performance while streamlining costs.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President and CEO

Ganesh Moorthy

Executive Chair

Steve Sanghi

CFO, Senior VP

J. Eric Bjornholt

Manufacturer fab locations 9

Fab name Location Fab Initiation Wafer Capacity

Fab 5 - Colorado

Fabrication

Fab Initiation

1995

USA

Colorado Springs

Wafer Capacity

70,000

1995

70,000

Santa Clara

Fabrication

Fab Initiation

1990

USA

Santa Clara

Wafer Capacity

1,290

1990

1,290

Lawrence

Fabrication

Fab Initiation

1989

USA

Lawrence

Wafer Capacity

5,000

1989

5,000

Fab 4 - Gresham

Fabrication

Fab Initiation

1988

USA

Gresham

Wafer Capacity

50,000

1988

50,000

Fab 2 - Tempe

Fabrication

Fab Initiation

1994

USA

Tempe

Wafer Capacity

30,000

1994

30,000

Beverly

Fabrication

Fab Initiation

1985

USA

Beverly

Wafer Capacity

2,000

1985

2,000

Lowell

Fabrication

Fab Initiation

1986

USA

Lowell

Wafer Capacity

15,000

1986

15,000

Garden Grove

Fabrication

Fab Initiation

1985

USA

Garden Grove

Wafer Capacity

12,000

1985

12,000

New Fab - Gresham

Fabrication

Fab Initiation

2024

USA

Gresham

Wafer Capacity

2024

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