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USB5537B5000AKZETR

Microchip Technology

USB5537B5000AKZETR by Microchip Technology

Microchip Technology's USB5537B5000AKZETR is a BUS CONTROLLER with 625 MBps data rate, 25 MHz clock frequency, and 1.31 V max supply voltage. Ideal for I2C, SMBUS, SPI, and USB bus compatibility applications in commercial-grade environments.

Median Price

$10.189

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 139 parts In-Stock

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$10.189

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Chip Stock

USA . 1,125 parts In-Stock

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Vyrian

USA . 506 parts In-Stock

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506

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Distributors (Availability)

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AZTECH Wire

Italy . 780 parts In-Stock

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$5.734

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780

$5.734

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Aranea Global

USA . 500 parts In-Stock

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$9.985

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$9.585

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500

$9.985

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$9.585

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Ampacity Inc.

Singapore . 1,610 parts In-Stock

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$10.000

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Continental Prestige Electronics

USA . 10,172 parts In-Stock

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$10.189

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$9.985

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$9.985

Netroflash

USA . 500 parts In-Stock

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$10.189

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500

$10.189

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Semicontronic

India . 1,449 parts In-Stock

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$19.000

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$18.525

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$18.430

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$19.000

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$18.430

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Aztec Data Supply Inc.

USA . 4,253 parts In-Stock

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$24.307

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Corohmni

South Africa . 597 parts In-Stock

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$44.040

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Lixinc

USA . 8,091 parts In-Stock

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Argo Parts USA

USA . 6,028 parts In-Stock

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NIA Electronics

USA . 5,711 parts In-Stock

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Ledger Components

France . 5,711 parts In-Stock

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LOOK Integrated Logistics

Peru . 4,886 parts In-Stock

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LMD Electronica

Estonia . 4,437 parts In-Stock

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Kepictronics

USA . 3,500 parts In-Stock

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Montano Global Distributors

Canada . 1,639 parts In-Stock

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Authorized Procurement Solutions

USA . 1,000 parts In-Stock

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Microchip USA

USA . 162 parts In-Stock

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Overview

Enhance your device's performance with the USB5537B5000AKZETR by Microchip Technology, a top-tier manufacturer known for delivering cutting-edge solutions in the Bus Controllers category. With a maximum supply voltage of 1.31 V and a maximum data transfer rate of 625 MBps, this product offers unparalleled quality and reliability. Its compatibility with I2C, SMBUS, SPI, and USB makes it versatile for various applications. Elevate your system's capabilities and efficiency with this innovative technology that guarantees seamless operation and optimal performance.

Feature Benefit Bullets

Surface Mount: YES

Surface mount technology allows for more efficient and compact PCB assembly, saving space and reducing manufacturing costs.

Maximum Supply Voltage: 1.31 V

Provides a high maximum supply voltage tolerance, ensuring stable operation under varying voltage conditions.

Screening Level: TS 16949

Compliance with TS 16949 screening level ensures high quality and reliability in automotive applications.

Package Shape: SQUARE

Square package shape is easy to handle and align during assembly, improving manufacturing efficiency.

No. of Terminals: 72

Having 72 terminals allows for versatile connectivity options and compatibility with a wide range of devices.

Package Style: CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Combination of chip carrier, heat sink/slug, and very thin profile package style enables efficient heat dissipation and space-saving design.

Minimum Supply Voltage: 1.22 V

Low minimum supply voltage ensures energy efficiency and stable operation even under low voltage conditions.

Maximum Operating Temperature: 70 °C

Withstands high operating temperatures, making it suitable for use in challenging environments.

Maximum Data Transfer Rate: 625 MBps

High data transfer rate enables fast and efficient communication between devices, improving system performance.

Minimum Operating Temperature: 0 °C

Capable of operating at low temperatures, ensuring reliable performance in cold environments.

Terminal Finish: MATTE TIN

Matte tin terminal finish provides corrosion resistance and excellent solderability for reliable connections.

Terminal Position: QUAD

Quad terminal position allows for easy installation and secure connectivity in multi-device configurations.

Maximum Seated Height: 1 mm

Low seated height enables a slim profile design, ideal for compact electronic devices.

Width: 10 mm

Compact width dimension saves space on the PCB, contributing to a more efficient and streamlined design.

Maximum Clock Frequency: 25 MHz

High maximum clock frequency supports fast data processing, ideal for time-sensitive applications.

Peak Reflow Temperature °C: 260

Withstands peak reflow temperatures during manufacturing processes, ensuring reliability and quality of solder joints.

Length: 10 mm

Compact length dimension contributes to space-saving design and efficient use of PCB real estate.

Temperature Grade: COMMERCIAL

Commercial temperature grade ensures reliable operation in standard operating conditions for commercial applications.

Peripheral IC Type: BUS CONTROLLER, UNIVERSAL SERIAL BUS

Being a bus controller for Universal Serial Bus (USB) peripherals provides versatile connectivity options for a wide range of devices.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making the product energy efficient and reliable.

Terminal Form: NO LEAD

No lead terminal form is environmentally friendly and complies with regulations on hazardous substances.

Maximum Supply Current: 1173 mA

Capable of handling high supply current requirements, ensuring stable operation even under heavy loads.

Nominal Supply Voltage: 1.25 V

Stable nominal supply voltage ensures consistent performance and compatibility with standard power sources.

Bus Compatibility: I2C; SMBUS; SPI; USB

Support for multiple bus protocols (I2C, SMBus, SPI, USB) makes the product versatile and compatible with various devices and systems.

Terminal Pitch: 0.5 mm

Fine terminal pitch allows for high-density packaging, enabling more terminals in a compact space for enhanced connectivity options.

Technical Specifications

Bus Controllers USB5537B5000AKZETR attributes and parameters. Explore more Bus Controllers devices from Microchip Technology

Specs

Additional Features:

ALSO OPRATES AT 3.3 V SUPPLY

Bus Compatibility:

I2C; SMBUS; SPI; USB

Maximum Clock Frequency:

25 MHz

Maximum Data Transfer Rate:

625 MBps

JESD-30 Code:

S-XQCC-N72

JESD-609 Code:

e3

Length:

10 mm

Moisture Sensitivity Level (MSL):

1

No. of Terminals:

72

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

UNSPECIFIED

Package Code:

Package Equivalence Code:

LCC72,.39SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Screening Level:

TS 16949

Maximum Seated Height:

1 mm

Maximum Supply Current:

1173 mA

Maximum Supply Voltage:

1.31 V

Minimum Supply Voltage:

1.22 V

Nominal Supply Voltage:

1.25 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

10 mm

Trade Compliance

USB5537B5000AKZETR Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Microchip Technology

Microchip Technology Incorporated is a leading provider of integrated circuit (IC) solutions for the global market. Founded in 1989, the company designs, manufactures, tests and markets state-of-the-art microcontrollers and analog devices for use in a wide array of electronics applications, such as the automotive industry, consumer electronics and industrial automation. Through its world-class production processes and technologies, Microchip Technology has become an innovator of semiconductor solutions that enable customers to maximize their performance while streamlining costs.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President and CEO

Ganesh Moorthy

Executive Chair

Steve Sanghi

CFO, Senior VP

J. Eric Bjornholt

Manufacturer fab locations 9

Fab name Location Fab Initiation Wafer Capacity

Fab 5 - Colorado

Fabrication

Fab Initiation

1995

USA

Colorado Springs

Wafer Capacity

70,000

1995

70,000

Santa Clara

Fabrication

Fab Initiation

1990

USA

Santa Clara

Wafer Capacity

1,290

1990

1,290

Lawrence

Fabrication

Fab Initiation

1989

USA

Lawrence

Wafer Capacity

5,000

1989

5,000

Fab 4 - Gresham

Fabrication

Fab Initiation

1988

USA

Gresham

Wafer Capacity

50,000

1988

50,000

Fab 2 - Tempe

Fabrication

Fab Initiation

1994

USA

Tempe

Wafer Capacity

30,000

1994

30,000

Beverly

Fabrication

Fab Initiation

1985

USA

Beverly

Wafer Capacity

2,000

1985

2,000

Lowell

Fabrication

Fab Initiation

1986

USA

Lowell

Wafer Capacity

15,000

1986

15,000

Garden Grove

Fabrication

Fab Initiation

1985

USA

Garden Grove

Wafer Capacity

12,000

1985

12,000

New Fab - Gresham

Fabrication

Fab Initiation

2024

USA

Gresham

Wafer Capacity

2024

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