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CY7C65215A-32LTXIT

Infineon Technologies

CY7C65215A-32LTXIT by Infineon Technologies

CY7C65215A-32LTXIT by Infineon: Bus Controller with 1.71-1.89 V supply, 85 °C max temp, and 1.5 MBps data rate. Ideal for I2C, SPI, UART interfaces in industrial settings due to RS232/RS422/RS485 compatibility and compact square chip carrier design.

Median Price

$2.510

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 750 parts In-Stock

1+ parts

$2.510

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750

$2.510

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Flip Electronics

USA . 2,500 parts In-Stock

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2,500

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Vyrian

USA . 1,477 parts In-Stock

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1,477

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Digiode

USA . 267 parts In-Stock

1+ parts

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267

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Continental Prestige Electronics

USA . 2,696 parts In-Stock

1+ parts

$2.431

100+ parts

-

1k+ parts

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10k+ parts

$2.382

2,696

$2.431

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-

$2.382

Argo Parts USA

USA . 386 parts In-Stock

1+ parts

$2.431

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386

$2.431

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AZTECH Wire

Italy . 732 parts In-Stock

1+ parts

$8.293

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732

$8.293

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Ampacity Inc.

Singapore . 1,258 parts In-Stock

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$11.000

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1,258

$11.000

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Microchip USA

USA . 4,911 parts In-Stock

1+ parts

$15.811

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4,911

$15.811

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Semicontronic

India . 612 parts In-Stock

1+ parts

$33.000

100+ parts

$32.175

1k+ parts

$32.010

10k+ parts

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612

$33.000

$32.175

$32.010

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Corohmni

South Africa . 61 parts In-Stock

1+ parts

$35.130

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61

$35.130

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Modulus Dynamics

Lithuania . 2,248 parts In-Stock

1+ parts

$41.994

100+ parts

$40.314

1k+ parts

$38.634

10k+ parts

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2,248

$41.994

$40.314

$38.634

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Aztec Data Supply Inc.

USA . 9,752 parts In-Stock

1+ parts

$69.065

100+ parts

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9,752

$69.065

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Bastille Electronics

Australia . 100 parts In-Stock

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100

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Corphita

USA . 87 parts In-Stock

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87

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Overview

Unlock seamless connectivity and unparalleled performance with the CY7C65215A-32LTXIT by Infineon Technologies. As a leading manufacturer in the industry, Infineon Technologies sets the standard for quality and innovation in bus controllers. Perfect for a wide range of applications, this versatile chip carrier boasts an impressive data transfer rate of 1.5 MBps, making it ideal for I2C, SPI, UART, and VBUS compatibility. Experience the benefits of industrial-grade technology and maximize efficiency with the CY7C65215A-32LTXIT. Elevate your connectivity solutions today.

Feature Benefit Bullets

Surface Mount: YES

Allows for easy and convenient installation onto circuit boards, saving space and reducing assembly time.

Maximum Supply Voltage: 1.89 V

Provides a wide range of input voltage options for compatibility with various systems.

Package Shape: SQUARE

Square shape allows for efficient placement on circuit boards and easy integration into systems.

No. of Terminals: 32

Sufficient number of terminals for connectivity and data transmission purposes.

Package Style (Meter): CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

The combination of chip carrier, heat sink/slug, and very thin profile design helps in heat dissipation and space-saving.

Minimum Supply Voltage: 1.71 V

Allows for operation at low voltage levels, enhancing energy efficiency.

Maximum Operating Temperature: 85 °C

Capable of operating in high-temperature environments, suitable for industrial applications.

Maximum Data Transfer Rate: 1.5 MBps

High data transfer rate enables fast and efficient communication within the system.

Minimum Operating Temperature: -40 °C

Ability to operate in extremely low temperatures, making it suitable for diverse environmental conditions.

Terminal Finish: PURE TIN

Pure tin finish provides excellent conductivity and solderability for reliable connections.

Terminal Position: QUAD

Quad terminal position allows for multiple connections, enhancing versatility in system integration.

Maximum Seated Height: 1 mm

Low seated height minimizes the overall height profile of the component, suitable for compact designs.

Width: 5 mm

Compact width size for space-saving and efficient board layout.

Length: 5 mm

Compact length size for space-saving and efficient board layout.

Temperature Grade: INDUSTRIAL

Designed for industrial-grade temperature requirements, ensuring reliable operation in harsh conditions.

Peripheral IC Type: BUS CONTROLLER, UNIVERSAL SERIAL BUS

Versatile peripheral IC type supporting multiple bus interfaces for broad compatibility.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity for efficient performance.

Terminal Form: NO LEAD

No lead terminal form for RoHS compliance and environmental sustainability.

Nominal Supply Voltage: 1.8 V

Optimal supply voltage for stable and efficient operation of the component.

Bus Compatibility: I2C; SPI; UART; VBUS

Supports multiple bus interfaces for flexible connectivity options.

Terminal Pitch: 0.5 mm

Fine terminal pitch for high-density mounting and space-saving on circuit boards.

Moisture Sensitivity Level (MSL): 3

MSL level 3 indicates a moderate level of sensitivity to moisture exposure, requiring standard handling procedures.

Drive Interface Standard: RS232; RS422; RS485

Supports various drive interfaces for versatile communication capabilities.

Technical Specifications

Bus Controllers CY7C65215A-32LTXIT attributes and parameters. Explore more Bus Controllers devices from Infineon Technologies

Specs

Additional Features:

ALSO OPERATES AT 2V-5.5V SUPPLY RANGE.

Address Bus Width:

0

Bus Compatibility:

I2C; SPI; UART; VBUS

Maximum Data Transfer Rate:

1.5 MBps

Drive Interface Standard:

RS232; RS422; RS485

External Data Bus Width:

0

JESD-30 Code:

S-XQCC-N32

Length:

5 mm

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

32

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

UNSPECIFIED

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Maximum Seated Height:

1 mm

Maximum Supply Voltage:

1.89 V

Minimum Supply Voltage:

1.71 V

Nominal Supply Voltage:

1.8 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

PURE TIN

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

5 mm

Trade Compliance

CY7C65215A-32LTXIT Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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