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USB7252/KDX

Microchip Technology

USB7252/KDX by Microchip Technology

The Microchip Technology USB7252/KDX is a BUS CONTROLLER IC with 100 terminals, operating at 25 MHz clock frequency. It supports I2C, I2S, SMBUS, SPI, UART, and USB buses with a data transfer rate of 1.25 MBps. Ideal for applications requiring low supply voltage and high-speed data communication in commercial temperature environments.

Median Price

$9.736

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 10 parts In-Stock

1+ parts

$9.736

100+ parts

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1k+ parts

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10

$9.736

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Vyrian

USA . 5,095 parts In-Stock

1+ parts

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5,095

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 630 parts In-Stock

1+ parts

$8.257

100+ parts

-

1k+ parts

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10k+ parts

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630

$8.257

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Continental Prestige Electronics

USA . 1,457 parts In-Stock

1+ parts

$9.736

100+ parts

-

1k+ parts

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10k+ parts

$9.542

1,457

$9.736

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-

$9.542

Vigor

Singapore . 209 parts In-Stock

1+ parts

$9.760

100+ parts

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209

$9.760

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Ampacity Inc.

Singapore . 643 parts In-Stock

1+ parts

$32.000

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643

$32.000

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Corohmni

South Africa . 113 parts In-Stock

1+ parts

$33.806

100+ parts

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113

$33.806

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RGB Technical Solutions

Ukraine . 6,831 parts In-Stock

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6,831

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Netroflash

USA . 2,000 parts In-Stock

1+ parts

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100+ parts

$9.542

1k+ parts

$9.250

10k+ parts

$9.055

2,000

-

$9.542

$9.250

$9.055

Argo Parts USA

USA . 309 parts In-Stock

1+ parts

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309

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Microchip USA

USA . 208 parts In-Stock

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208

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Authorized Procurement Solutions

USA . 15 parts In-Stock

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15

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Overview

Get ready to experience seamless connectivity with the USB7252/KDX by Microchip Technology. As a leader in manufacturing high-quality bus controllers, Microchip Technology has created a versatile and reliable product that offers unmatched value to customers. Whether you need to interface with I2C, I2S, SMBUS, SPI, UART, or USB, this chip carrier with heat sink/slug and very thin profile is designed to meet your needs. With a maximum data transfer rate of 1.25 MBps and a maximum clock frequency of 25 MHz, this bus controller ensures fast and efficient communication. Trust Microchip Technology to deliver cutting-edge technology for all your connectivity requirements.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the package lightweight and durable, ideal for applications where weight and strength are important.

Surface Mount: YES

Surface mount capability allows for easy and efficient integration into circuit boards, saving space and simplifying the manufacturing process.

Maximum Supply Voltage: 1.21 V

The maximum supply voltage of 1.21 V ensures safe operation within specified voltage limits, protecting the components from damage.

Package Shape: SQUARE

The square package shape is compact and space-efficient, ideal for applications where board space is limited.

No. of Terminals: 100

With 100 terminals, this bus controller offers a high level of connectivity and flexibility for interfacing with other components and peripherals.

Package Style (Meter): CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

The combination of chip carrier, heat sink/slug, and very thin profile package styles allows for efficient heat dissipation and compact design, making it suitable for applications with limited space and thermal constraints.

Minimum Supply Voltage: 1.09 V

The minimum supply voltage of 1.09 V ensures reliable operation even at lower voltage levels, providing flexibility in power supply options.

Maximum Operating Temperature: 70 °C

With a maximum operating temperature of 70°C, this bus controller can function effectively in a wide range of environmental conditions.

Maximum Data Transfer Rate: 1.25 MBps

The high data transfer rate of 1.25 MBps enables fast and efficient communication with other devices, making it suitable for high-performance applications.

Minimum Operating Temperature: 0 °C

The minimum operating temperature of 0°C ensures reliable performance even in cold environments, making it versatile for various operating conditions.

Terminal Position: QUAD

The quad terminal position provides a secure and stable connection, reducing the risk of disconnection or signal interference.

Maximum Seated Height: 0.9 mm

The low maximum seated height of 0.9 mm allows for a slim profile and compact design, suitable for applications with height restrictions.

Width: 12 mm

The width of 12 mm offers a good balance between compactness and ease of handling during installation, making it versatile for various board sizes.

Maximum Clock Frequency: 25 MHz

With a maximum clock frequency of 25 MHz, this bus controller can support high-speed data processing and communication, suitable for demanding applications.

Length: 12 mm

The length of 12 mm provides a compact form factor, enabling easy integration into tight spaces or smaller devices.

Temperature Grade: COMMERCIAL

The commercial temperature grade ensures reliable performance in standard operating conditions, making it suitable for a wide range of commercial applications.

Peripheral IC Type: BUS CONTROLLER, UNIVERSAL SERIAL BUS

The bus controller with universal serial bus peripheral IC type enables versatile connectivity and compatibility with different bus protocols, enhancing interoperability with various devices.

Technology: CMOS

The CMOS technology offers low power consumption, high speed, and compatibility with various voltage levels, making it a cost-effective and efficient choice for bus controller applications.

Terminal Form: NO LEAD

The no-lead terminal form provides a reliable and robust connection, minimizing signal loss and ensuring long-term performance and durability.

Nominal Supply Voltage: 1.15 V

The nominal supply voltage of 1.15 V provides a stable and consistent power source for the bus controller, ensuring reliable operation within specified voltage limits.

Bus Compatibility: I2C; I2S; SMBUS; SPI; UART; USB

The compatibility with multiple bus protocols such as I2C, I2S, SMBus, SPI, UART, and USB allows for flexible integration and communication with a wide range of devices and peripherals.

Terminal Pitch: 0.4 mm

The small terminal pitch of 0.4 mm allows for high-density mounting and efficient use of board space, making it suitable for compact and densely populated PCB layouts.

Technical Specifications

Bus Controllers USB7252/KDX attributes and parameters. Explore more Bus Controllers devices from Microchip Technology

Specs

Bus Compatibility:

I2C; I2S; SMBUS; SPI; UART; USB

Maximum Clock Frequency:

25 MHz

Maximum Data Transfer Rate:

1.25 MBps

JESD-30 Code:

S-PQCC-N100

Length:

12 mm

No. of Terminals:

100

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LCC100,.47SQ,16

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Maximum Seated Height:

.9 mm

Maximum Supply Voltage:

1.21 V

Minimum Supply Voltage:

1.09 V

Nominal Supply Voltage:

1.15 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.4 mm

Terminal Position:

QUAD

Width:

12 mm

Trade Compliance

USB7252/KDX Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Microchip Technology

Microchip Technology Incorporated is a leading provider of integrated circuit (IC) solutions for the global market. Founded in 1989, the company designs, manufactures, tests and markets state-of-the-art microcontrollers and analog devices for use in a wide array of electronics applications, such as the automotive industry, consumer electronics and industrial automation. Through its world-class production processes and technologies, Microchip Technology has become an innovator of semiconductor solutions that enable customers to maximize their performance while streamlining costs.

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Management team

President and CEO

Ganesh Moorthy

Executive Chair

Steve Sanghi

CFO, Senior VP

J. Eric Bjornholt

Manufacturer fab locations 9

Fab name Location Fab Initiation Wafer Capacity

Fab 5 - Colorado

Fabrication

Fab Initiation

1995

USA

Colorado Springs

Wafer Capacity

70,000

1995

70,000

Santa Clara

Fabrication

Fab Initiation

1990

USA

Santa Clara

Wafer Capacity

1,290

1990

1,290

Lawrence

Fabrication

Fab Initiation

1989

USA

Lawrence

Wafer Capacity

5,000

1989

5,000

Fab 4 - Gresham

Fabrication

Fab Initiation

1988

USA

Gresham

Wafer Capacity

50,000

1988

50,000

Fab 2 - Tempe

Fabrication

Fab Initiation

1994

USA

Tempe

Wafer Capacity

30,000

1994

30,000

Beverly

Fabrication

Fab Initiation

1985

USA

Beverly

Wafer Capacity

2,000

1985

2,000

Lowell

Fabrication

Fab Initiation

1986

USA

Lowell

Wafer Capacity

15,000

1986

15,000

Garden Grove

Fabrication

Fab Initiation

1985

USA

Garden Grove

Wafer Capacity

12,000

1985

12,000

New Fab - Gresham

Fabrication

Fab Initiation

2024

USA

Gresham

Wafer Capacity

2024

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