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USB7002-I/KDXVAO

Microchip Technology

USB7002-I/KDXVAO by Microchip Technology

USB7002-I/KDXVAO by Microchip Technology is a bus controller with a max data transfer rate of 625 MBps. It is compatible with I2C, I2S, SMBUS, SPI, UART, and USB buses. This chip is commonly used in industrial applications due to its wide temperature range (-40°C to 85°C) and small form factor (12mm x 12mm).

Median Price

$14.430

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Microchip Technology

USA . 127,848 parts In-Stock

1+ parts

$14.430

100+ parts

$10.930

1k+ parts

$10.110

10k+ parts

$9.580

127,848

$14.430

$10.930

$10.110

$9.580

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 15 parts In-Stock

1+ parts

$9.630

100+ parts

-

1k+ parts

-

10k+ parts

-

15

$9.630

-

-

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Vyrian

USA . 832 parts In-Stock

1+ parts

-

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-

1k+ parts

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10k+ parts

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832

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Continental Prestige Electronics

USA . 2,741 parts In-Stock

1+ parts

$9.630

100+ parts

-

1k+ parts

-

10k+ parts

$9.437

2,741

$9.630

-

-

$9.437

Netroflash

USA . 100 parts In-Stock

1+ parts

$9.630

100+ parts

-

1k+ parts

-

10k+ parts

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100

$9.630

-

-

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AZTECH Wire

Italy . 468 parts In-Stock

1+ parts

$10.567

100+ parts

-

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468

$10.567

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-

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Semicontronic

India . 40,137 parts In-Stock

1+ parts

$12.270

100+ parts

$11.963

1k+ parts

$11.902

10k+ parts

-

40,137

$12.270

$11.963

$11.902

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Ampacity Inc.

Singapore . 26,194 parts In-Stock

1+ parts

$12.270

100+ parts

-

1k+ parts

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26,194

$12.270

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Aztec Data Supply Inc.

USA . 56 parts In-Stock

1+ parts

$39.820

100+ parts

-

1k+ parts

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56

$39.820

-

-

-

Advanced Electronics

New Zealand . 700 parts In-Stock

1+ parts

$56.970

100+ parts

$54.122

1k+ parts

$54.122

10k+ parts

-

700

$56.970

$54.122

$54.122

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Corohmni

South Africa . 66 parts In-Stock

1+ parts

$73.534

100+ parts

-

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66

$73.534

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Montano Global Distributors

Canada . 4,921 parts In-Stock

1+ parts

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100+ parts

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4,921

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Argo Parts USA

USA . 4,640 parts In-Stock

1+ parts

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100+ parts

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4,640

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LMD Electronica

Estonia . 4,628 parts In-Stock

1+ parts

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4,628

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Lixinc

USA . 4,261 parts In-Stock

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4,261

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LOOK Integrated Logistics

Peru . 3,686 parts In-Stock

1+ parts

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3,686

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RC Electronics

USA . 1,882 parts In-Stock

1+ parts

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100+ parts

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1,882

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-

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Authorized Procurement Solutions

USA . 1,000 parts In-Stock

1+ parts

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100+ parts

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1k+ parts

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10k+ parts

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1,000

-

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NIA Electronics

USA . 125 parts In-Stock

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125

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Ledger Components

France . 125 parts In-Stock

1+ parts

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100+ parts

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1k+ parts

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125

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Overview

Experience seamless data transfer and unparalleled performance with the USB7002-I/KDXVAO by Microchip Technology. As a leader in the industry, Microchip Technology has been known for its exceptional quality and reliability. The USB7002-I/KDXVAO is a versatile bus controller that supports a wide range of applications including I2C, I2S, SMBUS, SPI, UART, and USB. With a maximum data transfer rate of 625 MBps and a clock frequency of 25 MHz, this product ensures lightning-fast connectivity and efficient communication. Its compact design, very thin profile, and quad terminal position make it easy to integrate into any system. Whether you're a tech enthusiast or a professional, the USB7002-I/KDXVAO offers incredible value, benefits, and advantages that will enhance your experience and take your projects to new heights. Trust Microchip Technology to deliver excellence in every aspect.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable, ideal for use in various applications.

Surface Mount: YES

Surface mount capability allows for easy installation and integration into electronic systems.

Maximum Supply Voltage: 1.32 V

The high maximum supply voltage ensures compatibility with a wide range of power sources.

Screening Level: AEC-Q100

AEC-Q100 compliance ensures high reliability and quality standards for automotive applications.

Package Shape: SQUARE

Square package shape enables efficient use of space on circuit boards.

No. of Terminals: 100

The high number of terminals allows for versatile connectivity options.

Package Style (Meter): CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

This package style provides excellent thermal management and compact design for space-constrained applications.

Minimum Supply Voltage: 1.08 V

Low minimum supply voltage ensures energy efficiency and compatibility with various power sources.

Maximum Operating Temperature: 85 °C

High maximum operating temperature ensures reliable performance even in challenging thermal conditions.

Maximum Data Transfer Rate: 625 MBps

High data transfer rate enables fast and efficient communication between devices.

Minimum Operating Temperature: -40 °C

Low minimum operating temperature ensures reliable performance even in extreme cold environments.

Terminal Position: QUAD

Quad terminal position provides stable and secure connections in the circuit.

Maximum Seated Height: 0.9 mm

Low maximum seated height allows for compact and low-profile device design.

Width: 12 mm

The moderate width makes the product suitable for various board sizes and designs.

Maximum Clock Frequency: 25 MHz

High maximum clock frequency enables efficient data processing and communication.

Length: 12 mm

The moderate length allows for flexible placement and integration within electronic systems.

Temperature Grade: INDUSTRIAL

Industrial-grade temperature tolerance ensures reliable operation in harsh environments.

Peripheral IC Type: BUS CONTROLLER, UNIVERSAL SERIAL BUS

Support for multiple bus protocols makes the product versatile and compatible with a wide range of devices.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity for reliable performance.

Terminal Form: NO LEAD

No-lead terminal form simplifies installation and enhances reliability.

Nominal Supply Voltage: 1.2 V

Stable nominal supply voltage ensures consistent and reliable operation.

Bus Compatibility: I2C; I2S; SMBUS; SPI; UART; USB

Support for multiple bus protocols allows for seamless integration with various devices and systems.

Terminal Pitch: 0.4 mm

Small terminal pitch enables high-density mounting and compact device design.

Technical Specifications

Bus Controllers USB7002-I/KDXVAO attributes and parameters. Explore more Bus Controllers devices from Microchip Technology

Specs

Additional Features:

ALSO OPERATES WITH 3.3V SUPPLY

Bus Compatibility:

I2C; I2S; SMBUS; SPI; UART; USB

Maximum Clock Frequency:

25 MHz

Maximum Data Transfer Rate:

625 MBps

JESD-30 Code:

S-PQCC-N100

Length:

12 mm

No. of Terminals:

100

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LCC100,.47SQ,16

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Screening Level:

AEC-Q100

Maximum Seated Height:

.9 mm

Maximum Supply Voltage:

1.32 V

Minimum Supply Voltage:

1.08 V

Nominal Supply Voltage:

1.2 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.4 mm

Terminal Position:

QUAD

Width:

12 mm

Trade Compliance

USB7002-I/KDXVAO Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Microchip Technology

Microchip Technology Incorporated is a leading provider of integrated circuit (IC) solutions for the global market. Founded in 1989, the company designs, manufactures, tests and markets state-of-the-art microcontrollers and analog devices for use in a wide array of electronics applications, such as the automotive industry, consumer electronics and industrial automation. Through its world-class production processes and technologies, Microchip Technology has become an innovator of semiconductor solutions that enable customers to maximize their performance while streamlining costs.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President and CEO

Ganesh Moorthy

Executive Chair

Steve Sanghi

CFO, Senior VP

J. Eric Bjornholt

Manufacturer fab locations 9

Fab name Location Fab Initiation Wafer Capacity

Fab 5 - Colorado

Fabrication

Fab Initiation

1995

USA

Colorado Springs

Wafer Capacity

70,000

1995

70,000

Santa Clara

Fabrication

Fab Initiation

1990

USA

Santa Clara

Wafer Capacity

1,290

1990

1,290

Lawrence

Fabrication

Fab Initiation

1989

USA

Lawrence

Wafer Capacity

5,000

1989

5,000

Fab 4 - Gresham

Fabrication

Fab Initiation

1988

USA

Gresham

Wafer Capacity

50,000

1988

50,000

Fab 2 - Tempe

Fabrication

Fab Initiation

1994

USA

Tempe

Wafer Capacity

30,000

1994

30,000

Beverly

Fabrication

Fab Initiation

1985

USA

Beverly

Wafer Capacity

2,000

1985

2,000

Lowell

Fabrication

Fab Initiation

1986

USA

Lowell

Wafer Capacity

15,000

1986

15,000

Garden Grove

Fabrication

Fab Initiation

1985

USA

Garden Grove

Wafer Capacity

12,000

1985

12,000

New Fab - Gresham

Fabrication

Fab Initiation

2024

USA

Gresham

Wafer Capacity

2024

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