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USB5744/2GTA

Microchip Technology

USB5744/2GTA by Microchip Technology

The Microchip Technology USB5744/2GTA is a BUS CONTROLLER IC with 56 terminals, operating at 0-70 °C. It supports I2C, SMBUS, SPI, and USB buses with a data transfer rate of 625 MBps. The chip has a supply voltage range of 1.08-1.32 V and comes in a square-shaped package suitable for various applications requiring high-speed data transfer.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 6,322 parts In-Stock

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6,322

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Nova Conductors

Japan . 57 parts In-Stock

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57

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Distributors (Availability)

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AZTECH Wire

Italy . 452 parts In-Stock

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$6.756

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452

$6.756

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Semicontronic

India . 1,250 parts In-Stock

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$15.000

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$14.625

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$14.550

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$15.000

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$14.550

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Ampacity Inc.

Singapore . 350 parts In-Stock

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$26.000

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350

$26.000

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Aztec Data Supply Inc.

USA . 4,462 parts In-Stock

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$54.850

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$54.850

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Corohmni

South Africa . 2,210 parts In-Stock

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$61.965

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$61.965

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Argo Parts USA

USA . 4,944 parts In-Stock

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Marpe Global Electronics

Taiwan . 3,990 parts In-Stock

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3,990

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QualityLine Systems

Poland . 3,990 parts In-Stock

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3,990

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XL Components Corporation

Australia . 3,990 parts In-Stock

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3,990

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Microchip USA

USA . 365 parts In-Stock

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365

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Bastille Electronics

Australia . 100 parts In-Stock

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Advanced Electronics

New Zealand . 100 parts In-Stock

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Continental Prestige Electronics

USA . 64 parts In-Stock

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Overview

Enhance your connectivity with the USB5744/2GTA by Microchip Technology. As a leading manufacturer in the industry, Microchip Technology delivers top-notch quality and reliability. The USB5744/2GTA falls under the category of Bus Controllers, offering seamless integration for various applications. With its high data transfer rate of 625 MBps and compatibility with I2C, SMBUS, SPI, and USB, this product provides unmatched value and efficiency to customers. Elevate your technological experience with the USB5744/2GTA and enjoy the benefits of cutting-edge innovation at your fingertips.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material makes the package durable and resistant to physical damage, ensuring the longevity of the product.

Surface Mount: YES

The surface mount feature allows for easy and convenient installation on circuit boards, saving time and effort during assembly.

Maximum Supply Voltage: 1.32 V

The high maximum supply voltage provides flexibility and compatibility with a wide range of power sources for the bus controller.

Screening Level: TS 16949

The TS 16949 screening level ensures that the product meets strict quality and reliability standards, guaranteeing a high-performance bus controller.

Package Shape: SQUARE

The square package shape allows for efficient use of space on the circuit board, making it suitable for compact designs.

No. of Terminals: 56

The high number of terminals provides ample connectivity options for interfacing with other components in the system.

Package Style (Meter): CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

The chip carrier, heat sink/slug, and very thin profile package style ensures efficient heat dissipation and space-saving design for optimal performance.

Minimum Supply Voltage: 1.08 V

The low minimum supply voltage allows for energy-efficient operation, saving power and reducing operating costs.

Maximum Operating Temperature: 70 °C

The high maximum operating temperature tolerance ensures reliable performance even in elevated temperature environments.

Maximum Data Transfer Rate: 625 MBps

The high data transfer rate enables fast and efficient communication within the system, enhancing overall performance.

Minimum Operating Temperature: 0 °C

The low minimum operating temperature ensures the bus controller can function even in cold environments without any issues.

Terminal Position: QUAD

The quad terminal position allows for easy integration and connectivity with other components in the system.

Maximum Seated Height: 1 mm

The low maximum seated height profile ensures compatibility with slim and compact design requirements.

Width: 7 mm

The compact width of 7 mm enables space-saving installation on the circuit board, ideal for applications with limited space.

Length: 7 mm

The compact length of 7 mm ensures the bus controller can fit into small areas within the system, enabling versatile placement options.

Temperature Grade: COMMERCIAL

The commercial temperature grade means the bus controller is suitable for standard commercial applications, offering reliable performance in typical operating conditions.

Peripheral IC Type: BUS CONTROLLER, UNIVERSAL SERIAL BUS

The bus controller with universal serial bus peripheral IC type offers versatile connectivity options for various devices, making it a versatile choice for different applications.

Technology: CMOS

The CMOS technology used in the bus controller ensures low power consumption and high noise immunity, enhancing overall performance and reliability.

Terminal Form: NO LEAD

The no-lead terminal form simplifies the installation process and enhances the durability of the product, minimizing the risk of damage during handling.

Nominal Supply Voltage: 1.2 V

The nominal supply voltage of 1.2 V provides a stable power source for the bus controller, ensuring consistent and reliable operation.

Bus Compatibility: I2C; SMBUS; SPI; USB

The bus controller is compatible with I2C, SMBUS, SPI, and USB interfaces, making it suitable for a wide range of applications and connectivity requirements.

Terminal Pitch: 0.4 mm

The small terminal pitch of 0.4 mm allows for high-density mounting on the circuit board, saving space and enabling efficient use of available board space.

Technical Specifications

Bus Controllers USB5744/2GTA attributes and parameters. Explore more Bus Controllers devices from Microchip Technology

Specs

Additional Features:

ALSO OPERATES AT 3.3 V

Address Bus Width:

0

Bus Compatibility:

I2C; SMBUS; SPI; USB

Maximum Data Transfer Rate:

625 MBps

External Data Bus Width:

0

JESD-30 Code:

S-PQCC-N56

Length:

7 mm

No. of Terminals:

56

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LCC56,.27SQ,16

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Screening Level:

TS 16949

Maximum Seated Height:

1 mm

Maximum Supply Voltage:

1.32 V

Minimum Supply Voltage:

1.08 V

Nominal Supply Voltage:

1.2 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.4 mm

Terminal Position:

QUAD

Width:

7 mm

Trade Compliance

USB5744/2GTA Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Microchip Technology

Microchip Technology Incorporated is a leading provider of integrated circuit (IC) solutions for the global market. Founded in 1989, the company designs, manufactures, tests and markets state-of-the-art microcontrollers and analog devices for use in a wide array of electronics applications, such as the automotive industry, consumer electronics and industrial automation. Through its world-class production processes and technologies, Microchip Technology has become an innovator of semiconductor solutions that enable customers to maximize their performance while streamlining costs.

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Management team

President and CEO

Ganesh Moorthy

Executive Chair

Steve Sanghi

CFO, Senior VP

J. Eric Bjornholt

Manufacturer fab locations 9

Fab name Location Fab Initiation Wafer Capacity

Fab 5 - Colorado

Fabrication

Fab Initiation

1995

USA

Colorado Springs

Wafer Capacity

70,000

1995

70,000

Santa Clara

Fabrication

Fab Initiation

1990

USA

Santa Clara

Wafer Capacity

1,290

1990

1,290

Lawrence

Fabrication

Fab Initiation

1989

USA

Lawrence

Wafer Capacity

5,000

1989

5,000

Fab 4 - Gresham

Fabrication

Fab Initiation

1988

USA

Gresham

Wafer Capacity

50,000

1988

50,000

Fab 2 - Tempe

Fabrication

Fab Initiation

1994

USA

Tempe

Wafer Capacity

30,000

1994

30,000

Beverly

Fabrication

Fab Initiation

1985

USA

Beverly

Wafer Capacity

2,000

1985

2,000

Lowell

Fabrication

Fab Initiation

1986

USA

Lowell

Wafer Capacity

15,000

1986

15,000

Garden Grove

Fabrication

Fab Initiation

1985

USA

Garden Grove

Wafer Capacity

12,000

1985

12,000

New Fab - Gresham

Fabrication

Fab Initiation

2024

USA

Gresham

Wafer Capacity

2024

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