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CY7C65223D-32LTXIT

Infineon Technologies

CY7C65223D-32LTXIT by Infineon Technologies

CY7C65223D-32LTXIT by Infineon Tech is a bus controller with 32 terminals, operating at 48 MHz clock frequency. It supports UART and USB bus compatibility, with a data transfer rate of 1.5 MBps. Ideal for applications requiring RS232, RS422, or RS485 drive interfaces in compact designs.

Median Price

$2.081

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 50 parts In-Stock

1+ parts

$2.081

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50

$2.081

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Vyrian

USA . 915 parts In-Stock

1+ parts

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915

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Digiode

USA . 721 parts In-Stock

1+ parts

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721

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 393 parts In-Stock

1+ parts

$2.000

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393

$2.000

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Continental Prestige Electronics

USA . 3,529 parts In-Stock

1+ parts

$2.081

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$2.039

3,529

$2.081

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$2.039

Argo Parts USA

USA . 3,174 parts In-Stock

1+ parts

$2.081

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3,174

$2.081

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AZTECH Wire

Italy . 874 parts In-Stock

1+ parts

$10.475

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874

$10.475

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Semicontronic

India . 633 parts In-Stock

1+ parts

$17.000

100+ parts

$16.575

1k+ parts

$16.490

10k+ parts

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633

$17.000

$16.575

$16.490

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Corohmni

South Africa . 262 parts In-Stock

1+ parts

$31.190

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262

$31.190

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Aztec Data Supply Inc.

USA . 3,544 parts In-Stock

1+ parts

$49.606

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3,544

$49.606

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Modulus Dynamics

Lithuania . 2,129 parts In-Stock

1+ parts

$60.218

100+ parts

$57.809

1k+ parts

$55.401

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2,129

$60.218

$57.809

$55.401

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Microchip USA

USA . 3,937 parts In-Stock

1+ parts

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3,937

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Corphita

USA . 805 parts In-Stock

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805

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Overview

Unlock the power of seamless data transfer with the CY7C65223D-32LTXIT by Infineon Technologies. As a leader in the industry, Infineon brings unparalleled quality and reliability to the realm of Bus Controllers. Ideal for applications requiring high-speed connectivity, this product boasts a maximum data transfer rate of 1.5 MBps and a maximum clock frequency of 48 MHz. With its compact design and advanced technology, the CY7C65223D-32LTXIT provides customers with a valuable solution for their UART and USB bus compatibility needs. Upgrade your system today with the CY7C65223D-32LTXIT and experience the benefits of cutting-edge technology at your fingertips.

Feature Benefit Bullets

Surface Mount: YES

Surface mount technology allows for easy and efficient installation onto a circuit board, saving space and reducing assembly time.

Maximum Supply Voltage: 1.89 V

Provides a wide range of supply voltage tolerance, allowing for flexibility in power supply options.

Package Shape: SQUARE

Square package shape promotes efficient use of board space and aligns well with the overall design of modern electronic devices.

No. of Terminals: 32

Having a sufficient number of terminals allows for various connections and functionalities, making the product versatile and adaptable.

Package Style (Meter): CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

This package style enhances thermal performance, reduces overall size, and facilitates integration into compact electronic devices.

Minimum Supply Voltage: 1.71 V

The low minimum supply voltage ensures compatibility with a wide range of power sources and enhances operational efficiency.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature range ensures reliability and functionality in various environmental conditions.

Maximum Data Transfer Rate: 1.5 MBps

The high data transfer rate enables fast and efficient communication between devices, enhancing overall system performance.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature range ensures functionality in extreme cold environments, increasing the product's versatility.

Terminal Position: QUAD

Quad terminal position enhances connectivity options and facilitates efficient signal transmission.

Maximum Seated Height: 1 mm

Low seated height facilitates compact design and integration into slim electronic devices.

Width: 5 mm

The compact width allows for efficient use of board space and promotes an overall sleek design.

Maximum Clock Frequency: 48 MHz

High clock frequency supports fast data processing and enhances overall system efficiency.

Length: 5 mm

The compact length ensures space efficiency and accommodates tight design constraints.

Peripheral IC Type: BUS CONTROLLER, UNIVERSAL SERIAL BUS

Being a universal serial bus controller ensures compatibility with a wide range of devices, making it a versatile and widely applicable choice.

Technology: CMOS

CMOS technology offers low power consumption, high noise immunity, and compatibility with various digital systems.

Terminal Form: NO LEAD

No-lead terminal form simplifies installation and promotes efficient soldering processes.

Maximum Supply Current: 18 mA

The low maximum supply current requirement reduces power consumption and enhances overall energy efficiency.

Nominal Supply Voltage: 1.8 V

Having a nominal supply voltage of 1.8 V ensures stable and efficient operation under standard operating conditions.

Bus Compatibility: UART, USB

Support for UART and USB bus compatibility enables seamless integration with a wide range of communication protocols and devices.

Terminal Pitch: 0.5 mm

The narrow terminal pitch allows for compact layout design and enhances signal integrity.

Moisture Sensitivity Level (MSL): 3

MSL level of 3 indicates moderate moisture sensitivity, ensuring reliability in average manufacturing and storage environments.

Drive Interface Standard: RS232; RS422; RS485

Support for multiple drive interface standards enables connectivity with a variety of devices and systems, increasing flexibility.

Technical Specifications

Bus Controllers CY7C65223D-32LTXIT attributes and parameters. Explore more Bus Controllers devices from Infineon Technologies

Specs

Address Bus Width:

0

Bus Compatibility:

UART, USB

Maximum Clock Frequency:

48 MHz

Maximum Data Transfer Rate:

1.5 MBps

Drive Interface Standard:

RS232; RS422; RS485

External Data Bus Width:

0

JESD-30 Code:

S-XQCC-N32

Length:

5 mm

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

32

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

UNSPECIFIED

Package Code:

Package Equivalence Code:

LCC32,.2SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Maximum Seated Height:

1 mm

Maximum Supply Current:

18 mA

Maximum Supply Voltage:

1.89 V

Minimum Supply Voltage:

1.71 V

Nominal Supply Voltage:

1.8 V

Surface Mount:

YES

Technology:

CMOS

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

5 mm

Trade Compliance

CY7C65223D-32LTXIT Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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