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FT245BL-TRAY

FTDI

FT245BL-TRAY by FTDI

FT245BL-TRAY by FTDI is a USB bus controller with 32 terminals, operating at 0-70°C. It supports data transfer rates up to 1 MBps, clock frequency of 6 MHz, and has a supply voltage range of 4.35-5.25 V. Ideal for applications requiring high-speed USB connectivity in commercial-grade environments.

Median Price

$9.008

Lifecycle Status

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1k+

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Nova Conductors

Japan . 550 parts In-Stock

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$5.750

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$5.750

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Ozdisan Elektronik

Türkiye . 38 parts In-Stock

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$12.266

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38

$12.266

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Vyrian

USA . 7,907 parts In-Stock

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7,907

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Chip Stock

USA . 6,020 parts In-Stock

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Classic Components Corporation

USA . 355 parts In-Stock

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355

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Continental Prestige Electronics

USA . 2,159 parts In-Stock

1+ parts

$5.079

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$4.977

2,159

$5.079

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$4.977

Aranea Global

USA . 1,000 parts In-Stock

1+ parts

$5.635

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$5.410

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1,000

$5.635

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$5.410

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Allen Electronics Distributors

USA . 11 parts In-Stock

1+ parts

$5.750

100+ parts

$4.250

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11

$5.750

$4.250

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AZTECH Wire

Italy . 604 parts In-Stock

1+ parts

$11.882

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604

$11.882

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Aztec Data Supply Inc.

USA . 763 parts In-Stock

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$34.690

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763

$34.690

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Advanced Electronics

New Zealand . 5,000 parts In-Stock

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$55.370

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$52.601

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$52.601

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$55.370

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$52.601

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Argo Parts USA

USA . 2,983 parts In-Stock

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Perfect Parts

USA . 1,400 parts In-Stock

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GreenTree Electronics

Israel . 39 parts In-Stock

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Overview

Discover the superior quality and reliability of the FT245BL-TRAY by FTDI, a cutting-edge bus controller designed to streamline data transfer processes. With a maximum data transfer rate of 1 MBps and compatibility with USB buses, this product offers lightning-fast connectivity for a wide range of applications. Trust in FTDI's reputation for excellence and innovation, and enjoy the seamless performance and efficiency that the FT245BL-TRAY brings to your projects. Experience the value and benefits of this powerful technology today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material provides durability and protection for the internal components of the bus controller, ensuring a long lifespan.

Surface Mount: YES

Surface mount technology allows for easy and efficient installation of the bus controller onto a PCB, saving space and reducing assembly time.

Maximum Supply Voltage: 5.25 V

With a high maximum supply voltage, this bus controller can handle a wide range of power inputs, making it versatile and compatible with various systems.

Package Shape: SQUARE

The square package shape allows for a compact design, ideal for applications where space is limited.

No. of Terminals: 32

With 32 terminals, this bus controller can support a multitude of connections and peripherals, enabling robust functionality.

Package Style (Meter): FLATPACK, LOW PROFILE

The flatpack, low profile package style saves space and allows for easy integration into tight spaces within devices.

Minimum Supply Voltage: 4.35 V

The low minimum supply voltage ensures that the bus controller can operate efficiently even with lower power inputs, increasing its flexibility.

Maximum Operating Temperature: 70 °C

With a high maximum operating temperature, this bus controller can withstand heat and operate reliably in various environments.

Maximum Data Transfer Rate: 1 MBps

The high data transfer rate of 1 MBps allows for fast and efficient communication between the bus controller and connected devices, enhancing overall system performance.

Minimum Operating Temperature: 0 °C

The low minimum operating temperature ensures that the bus controller can function in cold environments, providing versatility in application usage.

Terminal Finish: MATTE TIN

The matte tin terminal finish provides a reliable and durable connection for the bus controller, enhancing its overall performance and longevity.

Terminal Position: QUAD

The quad terminal position offers a stable and secure connection for multiple peripherals, ensuring smooth and uninterrupted data transfer.

Maximum Seated Height: 1.6 mm

The low maximum seated height allows for a slim and compact design, ideal for applications where space constraints are a concern.

Width: 7 mm

The narrow width of 7 mm enables easy integration of the bus controller into tight spaces or densely populated PCBs.

External Data Bus Width: 8

With an external data bus width of 8, this bus controller can support high-speed data transfer between connected peripherals, improving overall system efficiency.

Maximum Clock Frequency: 6 MHz

The high maximum clock frequency of 6 MHz allows for fast and efficient data processing, enhancing the performance of the bus controller.

Maximum Time At Peak Reflow Temperature (s): 30

With a maximum time of 30 seconds at peak reflow temperature, the bus controller can be easily and quickly integrated into the PCB during assembly.

Peak Reflow Temperature °C: 260

With a peak reflow temperature of 260°C, this bus controller can undergo soldering processes without compromising its functionality or integrity.

Length: 7 mm

The short length of 7 mm enables a compact and space-saving design, perfect for applications where size constraints are a consideration.

Temperature Grade: COMMERCIAL

The commercial temperature grade ensures that this bus controller can operate reliably in standard environmental conditions, making it suitable for a wide range of applications.

Peripheral IC Type: BUS CONTROLLER, UNIVERSAL SERIAL BUS

As a universal serial bus controller, this product offers compatibility with various USB devices, making it a versatile and practical choice for system integration.

Technology: CMOS

CMOS technology provides low power consumption and high speed performance, making this bus controller energy-efficient and reliable for long-term use.

Terminal Form: GULL WING

The gull wing terminal form offers a secure and stable connection for the bus controller, ensuring reliable data transfer and communication.

Nominal Supply Voltage: 5 V

The standard nominal supply voltage of 5 V ensures compatibility with common power sources, making this bus controller easy to integrate into existing systems.

Bus Compatibility: USB

With USB bus compatibility, this product can easily connect to a wide range of USB devices and peripherals, offering seamless integration and enhanced functionality.

Terminal Pitch: 0.8 mm

The small terminal pitch of 0.8 mm allows for high-density mounting of the bus controller on the PCB, saving space and enabling efficient use of available board real estate.

Moisture Sensitivity Level (MSL): 3

With a moisture sensitivity level of 3, this bus controller can withstand moderate exposure to humidity during storage and assembly processes, ensuring its reliability in various environments.

Technical Specifications

Bus Controllers FT245BL-TRAY attributes and parameters. Explore more Bus Controllers devices from FTDI

Specs

Additional Features:

AND ALSO DATA RATE TRANSFERE AT 300KILOBYTE/SECOND-VCP DRIVERS

Bus Compatibility:

USB

Maximum Clock Frequency:

6 MHz

Maximum Data Transfer Rate:

1 MBps

External Data Bus Width:

8

JESD-30 Code:

S-PQFP-G32

JESD-609 Code:

e3

Length:

7 mm

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

32

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE

Peak Reflow Temperature (C):

260

Maximum Seated Height:

1.6 mm

Maximum Supply Voltage:

5.25 V

Minimum Supply Voltage:

4.35 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

7 mm

Trade Compliance

FT245BL-TRAY Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

FTDI

FTDI Chip is a fab-less semiconductor company established in 1992, partnered with the world’s leading foundries. The headquarter is located in Glasgow, UK and is supported with research and development facilities in Glasgow, Singapore and Taipei (Taiwan) plus regional sales and technical support sites in Glasgow, Taipei, Tigard (Oregon, USA) and Shanghai (China). FTDI Chip develops innovative silicon solutions that enhance interaction with the latest in global technology. The major objective from the company is to ‘bridge technologies’ in order to support engineers with highly sophisticated, feature-rich, robust and simple-to-use product platforms. FTDI Chip continues its philosophy of Design Made Easy, where it strives to incorporate device and system features in its chips that enable the designer to quickly and easily create and implement designs. We supplement this strategy, with WW regional support and a “total” solutions mindset to provide reduced development and debug costs and a fast time to market.

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