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FT245RNQ-TRAY

FTDI

FT245RNQ-TRAY by FTDI

FTDI's FT245RNQ-TRAY is a USB bus controller with 32 terminals, operating at 3.3-5.25V. It offers a data transfer rate of 60MBps, clocked at 12.02MHz, suitable for applications requiring high-speed USB interfacing in compact spaces due to its 0.9mm seated height and small package size.

Median Price

$7.257

Lifecycle Status

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4

In-Stock Inventory

1k+

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Verical

USA . 100 parts In-Stock

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$7.257

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$7.257

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Nova Conductors

Japan . 88 parts In-Stock

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$3.428

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88

$3.428

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TME

Poland . 197 parts In-Stock

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$4.920

100+ parts

$4.040

1k+ parts

$3.710

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197

$4.920

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$3.710

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Vyrian

USA . 1,203 parts In-Stock

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Netroflash

USA . 50 parts In-Stock

1+ parts

$3.428

100+ parts

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$3.256

10k+ parts

$3.188

50

$3.428

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$3.256

$3.188

Corohmni

South Africa . 88 parts In-Stock

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$51.750

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Aztec Data Supply Inc.

USA . 269 parts In-Stock

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$53.560

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269

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Argo Parts USA

USA . 1,965 parts In-Stock

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Continental Prestige Electronics

USA . 1,746 parts In-Stock

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Overview

Experience seamless data transfer and enhanced connectivity with the FT245RNQ-TRAY by FTDI. As a leading manufacturer in the industry, FTDI delivers top-notch quality with this bus controller, perfect for a wide range of applications. Whether you're looking to streamline your communications or boost your device's performance, this product offers unmatched value and reliability. Trust FTDI to provide cutting-edge technology that meets your needs and exceeds your expectations. Elevate your projects with the FT245RNQ-TRAY today.

Feature Benefit Bullets

Surface Mount: YES

Surface mount technology allows for easy and efficient assembly onto printed circuit boards, saving space and reducing overall product size.

Maximum Supply Voltage: 5.25 V

Supports a wide range of supply voltages, providing flexibility in design and compatibility with various power sources.

Package Shape: SQUARE

Square package shape makes it easy to integrate into a standard layout, reducing design complexity.

No. of Terminals: 32

Sufficient number of terminals for connecting to multiple data and power sources, ensuring versatility in connectivity.

Package Style: CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Combination of package styles offers efficient heat dissipation and compact form factor, ideal for space-constrained applications.

Minimum Supply Voltage: 3.3 V

Low minimum supply voltage allows for energy-efficient operation and compatibility with a wide range of power sources.

Maximum Operating Temperature: 85 °C

High maximum operating temperature ensures reliable performance in various environmental conditions.

Maximum Data Transfer Rate: 60 MBps

High data transfer rate enables fast and efficient communication between devices, improving overall system performance.

Minimum Operating Temperature: -40 °C

Low minimum operating temperature ensures reliable performance even in extreme cold environments.

Terminal Position: QUAD

Quad terminal position facilitates easy connection and ensures stable signal transmission.

Maximum Seated Height: 0.9 mm

Ultra-thin profile with maximum seated height of 0.9 mm allows for compact and space-saving designs.

Width: 5 mm

Narrow width of 5 mm enables easy integration into tight spaces, reducing overall product footprint.

External Data Bus Width: 8

Wide external data bus width of 8 ensures efficient data transfer and compatibility with various data formats.

Maximum Clock Frequency: 12.02 MHz

High maximum clock frequency enables rapid data processing and efficient communication between devices.

Length: 5 mm

Short length of 5 mm ensures compact design and easy integration into space-constrained applications.

Peripheral IC Type: BUS CONTROLLER, UNIVERSAL SERIAL BUS

Peripheral IC type specifically designed as a bus controller for USB devices, ensuring seamless communication and compatibility.

Technology: CMOS

CMOS technology offers low power consumption, high noise immunity, and compatibility with various supply voltages.

Terminal Form: NO LEAD

No lead terminal form ensures easy and reliable connection, reducing the risk of signal interference.

Bus Compatibility: USB

Designed for USB bus compatibility, ensuring seamless integration with USB devices and systems.

Terminal Pitch: 0.5 mm

Narrow terminal pitch of 0.5 mm facilitates high-density mounting and efficient signal transmission.

Technical Specifications

Bus Controllers FT245RNQ-TRAY attributes and parameters. Explore more Bus Controllers devices from FTDI

Specs

Bus Compatibility:

USB

Maximum Clock Frequency:

12.02 MHz

Maximum Data Transfer Rate:

60 MBps

External Data Bus Width:

8

JESD-30 Code:

S-XQCC-N32

Length:

5 mm

No. of Terminals:

32

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

UNSPECIFIED

Package Code:

Package Equivalence Code:

LCC32,.2SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Maximum Seated Height:

.9 mm

Maximum Supply Voltage:

5.25 V

Minimum Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

5 mm

Trade Compliance

FT245RNQ-TRAY Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

FTDI

FTDI Chip is a fab-less semiconductor company established in 1992, partnered with the world’s leading foundries. The headquarter is located in Glasgow, UK and is supported with research and development facilities in Glasgow, Singapore and Taipei (Taiwan) plus regional sales and technical support sites in Glasgow, Taipei, Tigard (Oregon, USA) and Shanghai (China). FTDI Chip develops innovative silicon solutions that enhance interaction with the latest in global technology. The major objective from the company is to ‘bridge technologies’ in order to support engineers with highly sophisticated, feature-rich, robust and simple-to-use product platforms. FTDI Chip continues its philosophy of Design Made Easy, where it strives to incorporate device and system features in its chips that enable the designer to quickly and easily create and implement designs. We supplement this strategy, with WW regional support and a “total” solutions mindset to provide reduced development and debug costs and a fast time to market.

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