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USB2512B-AEZG-BYC

Microchip Technology

USB2512B-AEZG-BYC by Microchip Technology

USB2512B-AEZG-BYC by Microchip Technology is a bus controller with a max clock frequency of 24 MHz. It is compatible with I2C, SMBUS, and USB buses. This chip is commonly used in applications requiring universal serial bus connectivity.

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2

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< 1k

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Vyrian

USA . 662 parts In-Stock

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Nova Conductors

Japan . 58 parts In-Stock

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AZTECH Wire

Italy . 343 parts In-Stock

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$6.952

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Advanced Electronics

New Zealand . 2,500 parts In-Stock

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$20.352

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$19.334

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$19.334

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Semicontronic

India . 1,329 parts In-Stock

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$22.000

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$21.450

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$21.340

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Corohmni

South Africa . 10 parts In-Stock

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$23.527

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Ampacity Inc.

Singapore . 669 parts In-Stock

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$25.000

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669

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Aztec Data Supply Inc.

USA . 227 parts In-Stock

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$62.722

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RGB Technical Solutions

Ukraine . 6,935 parts In-Stock

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Robosynatics

Brazil . 900 parts In-Stock

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Lucentia Tech

USA . 900 parts In-Stock

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900

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Argo Parts USA

USA . 296 parts In-Stock

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Continental Prestige Electronics

USA . 110 parts In-Stock

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Australia . 31 parts In-Stock

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Overview

Experience the future of connectivity with the USB2512B-AEZG-BYC by Microchip Technology. As a leader in bus controllers, Microchip Technology is renowned for delivering high-quality and reliable products. The USB2512B-AEZG-BYC offers seamless integration and compatibility with I2C, SMBUS, and USB, making it the perfect solution for a wide range of applications. With its compact design and very thin profile, this bus controller provides exceptional performance and versatility. Say goodbye to connectivity issues and embrace the convenience and efficiency that the USB2512B-AEZG-BYC brings to your projects. Upgrade to Microchip Technology and experience the difference today.

Feature Benefit Bullets

Surface Mount: YES

Surface mount design allows for easy and efficient integration onto circuit boards, saving space and reducing assembly time.

Maximum Supply Voltage: 3.6 V

Operates efficiently within a safe voltage range, providing stability and reliability to the system.

Screening Level: TS 16949

Compliance with TS 16949 screening ensures high quality and reliability in automotive applications.

Package Shape: SQUARE

Square package shape offers a compact design and efficient use of board space.

No. of Terminals: 36

Provides ample connectivity options for various components and peripherals in the system.

Package Style (Meter): CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Combination of chip carrier, heat sink/slug, and very thin profile package styles offer thermal efficiency and space-saving benefits.

Minimum Supply Voltage: 3 V

Supports a wide range of supply voltages, ensuring compatibility with different system configurations.

Maximum Operating Temperature: 85 °C

High maximum operating temperature tolerance allows for reliable performance in various environments.

Minimum Operating Temperature: 0 °C

Low minimum operating temperature ensures functionality even in colder conditions.

Terminal Position: QUAD

Quad terminal position enables easy and secure connection to the circuit board.

Maximum Seated Height: 1 mm

Low seated height contributes to a slim and compact overall design of the product.

Width: 6 mm

Narrow width allows for space-efficient placement on the board.

Maximum Clock Frequency: 24 MHz

High clock frequency capability supports fast and efficient data processing.

Length: 6 mm

Compact length complemented by other dimensions for an overall space-saving design.

Peripheral IC Type: BUS CONTROLLER, UNIVERSAL SERIAL BUS

Inclusion of a bus controller for universal serial bus (USB) compatibility for versatile connectivity options.

Technology: CMOS

CMOS technology offers low power consumption and efficient performance for the product.

Terminal Form: NO LEAD

No lead terminal form enhances reliability and durability of the product.

Maximum Supply Current: 85 mA

Moderate maximum supply current requirement for efficient power management within the system.

Nominal Supply Voltage: 3.3 V

Nominal supply voltage for stable and standardized power input.

Bus Compatibility: I2C, SMBUS, USB

Multiple bus compatibility options for flexible integration with different system architectures.

Terminal Pitch: 0.5 mm

Fine terminal pitch allows for precise connections and efficient signal transmission.

Technical Specifications

Bus Controllers USB2512B-AEZG-BYC attributes and parameters. Explore more Bus Controllers devices from Microchip Technology

Specs

Bus Compatibility:

I2C, SMBUS, USB

Maximum Clock Frequency:

24 MHz

JESD-30 Code:

S-XQCC-N36

Length:

6 mm

No. of Terminals:

36

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

0 Cel

Package Code:

Package Equivalence Code:

LCC36,.24SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Screening Level:

TS 16949

Maximum Seated Height:

1 mm

Maximum Supply Current:

85 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

6 mm

Trade Compliance

USB2512B-AEZG-BYC Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Microchip Technology

Microchip Technology Incorporated is a leading provider of integrated circuit (IC) solutions for the global market. Founded in 1989, the company designs, manufactures, tests and markets state-of-the-art microcontrollers and analog devices for use in a wide array of electronics applications, such as the automotive industry, consumer electronics and industrial automation. Through its world-class production processes and technologies, Microchip Technology has become an innovator of semiconductor solutions that enable customers to maximize their performance while streamlining costs.

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Management team

President and CEO

Ganesh Moorthy

Executive Chair

Steve Sanghi

CFO, Senior VP

J. Eric Bjornholt

Manufacturer fab locations 9

Fab name Location Fab Initiation Wafer Capacity

Fab 5 - Colorado

Fabrication

Fab Initiation

1995

USA

Colorado Springs

Wafer Capacity

70,000

1995

70,000

Santa Clara

Fabrication

Fab Initiation

1990

USA

Santa Clara

Wafer Capacity

1,290

1990

1,290

Lawrence

Fabrication

Fab Initiation

1989

USA

Lawrence

Wafer Capacity

5,000

1989

5,000

Fab 4 - Gresham

Fabrication

Fab Initiation

1988

USA

Gresham

Wafer Capacity

50,000

1988

50,000

Fab 2 - Tempe

Fabrication

Fab Initiation

1994

USA

Tempe

Wafer Capacity

30,000

1994

30,000

Beverly

Fabrication

Fab Initiation

1985

USA

Beverly

Wafer Capacity

2,000

1985

2,000

Lowell

Fabrication

Fab Initiation

1986

USA

Lowell

Wafer Capacity

15,000

1986

15,000

Garden Grove

Fabrication

Fab Initiation

1985

USA

Garden Grove

Wafer Capacity

12,000

1985

12,000

New Fab - Gresham

Fabrication

Fab Initiation

2024

USA

Gresham

Wafer Capacity

2024

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