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PI7C9X3G606GPBFCAEX

Diodes Incorporated

PI7C9X3G606GPBFCAEX by Diodes Incorporated

PI7C9X3G606GPBFCAEX by Diodes Inc. is a 144-terminal bus controller IC with 0.9V to 0.99V supply voltage range and 0.0125 MBps data transfer rate. It is designed for PCI bus compatibility, featuring a low-profile grid array package suitable for various applications requiring high-speed data processing.

Median Price

$34.545

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Mouser Electronics

USA . 433 parts In-Stock

1+ parts

$32.950

100+ parts

$21.780

1k+ parts

$21.770

10k+ parts

$21.760

433

$32.950

$21.780

$21.770

$21.760

DigiKey

USA . 3 parts In-Stock

1+ parts

$36.140

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3

$36.140

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Distributors (In-Stock)

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Nova Conductors

Japan . 10 parts In-Stock

1+ parts

$32.019

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10

$32.019

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Chip Stock

USA . 16,000 parts In-Stock

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Component Sense

UK . 5,684 parts In-Stock

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5,684

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Vyrian

USA . 1,054 parts In-Stock

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1,054

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Distributors (Availability)

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Continental Prestige Electronics

USA . 6,416 parts In-Stock

1+ parts

$27.870

100+ parts

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$27.313

6,416

$27.870

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$27.313

Ampacity Inc.

Singapore . 1,179 parts In-Stock

1+ parts

$28.870

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1,179

$28.870

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Semicontronic

India . 1,065 parts In-Stock

1+ parts

$28.870

100+ parts

$28.148

1k+ parts

$28.004

10k+ parts

-

1,065

$28.870

$28.148

$28.004

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Advanced Electronics

New Zealand . 2,500 parts In-Stock

1+ parts

$31.054

100+ parts

$31.054

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$31.054

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2,500

$31.054

$31.054

$31.054

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Aztec Data Supply Inc.

USA . 840 parts In-Stock

1+ parts

$35.000

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840

$35.000

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Modulus Dynamics

Lithuania . 3,257 parts In-Stock

1+ parts

$36.573

100+ parts

$36.573

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$36.573

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3,257

$36.573

$36.573

$36.573

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Microchip USA

USA . 1,550 parts In-Stock

1+ parts

$50.483

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1,550

$50.483

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Corohmni

South Africa . 1,856 parts In-Stock

1+ parts

$66.637

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1,856

$66.637

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QUARKTWIN TECHNOLOGY LTD

USA . 26,334 parts In-Stock

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26,334

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Authorized Procurement Solutions

USA . 5,000 parts In-Stock

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5,000

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Argo Parts USA

USA . 1,771 parts In-Stock

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1,771

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Overview

Upgrade your system with the PI7C9X3G606GPBFCAEX from Diodes Incorporated, a leading manufacturer in the industry. This high-quality bus controller offers reliable performance and seamless integration for a wide range of applications. Say goodbye to slow data transfer rates and hello to enhanced efficiency with this cutting-edge technology. Experience the value and benefits of this product firsthand and take your projects to the next level.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is lightweight and durable, making the product suitable for various applications while still being able to withstand wear and tear.

Surface Mount: YES

The surface mount feature allows for easy and secure installation onto circuit boards, saving space and providing a clean and professional look.

Maximum Supply Voltage: 0.99 V

The low maximum supply voltage of 0.99 V helps in reducing power consumption and can be compatible with a wide range of power sources.

Package Shape: SQUARE

The square shape helps in efficient placement on the PCB board and allows for a compact design.

No. of Terminals: 144

With a high number of terminals, the product can handle complex connections and data transfers effectively.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, ensuring reliable performance of the bus controller.

Bus Compatibility: I2C, SPI

Compatibility with I2C and SPI ensures that the bus controller can be used with a wide range of devices and systems, offering flexibility and versatility.

Technical Specifications

Bus Controllers PI7C9X3G606GPBFCAEX attributes and parameters. Explore more Bus Controllers devices from Diodes Incorporated

Specs

Bus Compatibility:

I2C, SPI

Maximum Data Transfer Rate:

.0125 MBps

JESD-30 Code:

S-PBGA-B144

Length:

10 mm

No. of Terminals:

144

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA144,12X12,32

Package Shape:

Package Style (Meter):

GRID ARRAY, LOW PROFILE, FINE PITCH

Maximum Seated Height:

1.4 mm

Maximum Supply Voltage:

.99 V

Minimum Supply Voltage:

.9 V

Nominal Supply Voltage:

.95 V

Surface Mount:

YES

Technology:

CMOS

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Width:

10 mm

Peripheral IC Type:

Trade Compliance

PI7C9X3G606GPBFCAEX Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Diodes Incorporated

Diodes Incorporated is an international leader in the design and production of high-grade application specific standard products utilized in a wide variety of industries. The company has developed cutting-edge technology that enhances the performance and reliability of components for consumer, industrial, automotive and communication applications. Established in 1959, Diodes Incorporated has been providing superior services to its customers by creating innovative solutions from their world-class manufacturing centers located around the world. Their commitment to delivering quality products extends to their selection of materials which are carefully chosen to meet the demand of both commercial and military requirements.

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Management team

Chairman and CEO

Keh-Shew Lu 

CFO

Brett R. Whitmire 

Lead Director

Angie Chen Button

Manufacturer fab locations 11

Fab name Location Fab Initiation Wafer Capacity

Fab 1

Fabrication

Fab Initiation

1987

China

Shanghai

Wafer Capacity

40,000

1987

40,000

Zizhu Fab 1

Fabrication

Fab Initiation

2013

China

Shanghai

Wafer Capacity

18,500

2013

18,500

G Fab

Fabrication

Fab Initiation

2008

UK

Greenock

Wafer Capacity

8,000

2008

8,000

Keelung Fab

Fabrication

Fab Initiation

1990

Taiwan

Keelung

Wafer Capacity

58,000

1990

58,000

Wuxi Fab

Fabrication

Fab Initiation

2004

China

Wuxi

Wafer Capacity

190,000

2004

190,000

Shanghai Fab

Fabrication

Fab Initiation

1993

China

Shanghai

Wafer Capacity

110,000

1993

110,000

G Fab

Fabrication

Fab Initiation

1970

UK

Greenock

Wafer Capacity

22,000

1970

22,000

Hsinchu Fab

Fabrication

Fab Initiation

1998

Taiwan

Hsinchu

Wafer Capacity

38,000

1998

38,000

Fab 2

Fabrication

Fab Initiation

2003

China

Shanghai

Wafer Capacity

20,000

2003

20,000

SPFAB

Fabrication

Fab Initiation

1995

USA

South Portland

Wafer Capacity

17,000

1995

17,000

N/A

Fabrication

Fab Initiation

1982

UK

Oldham

Wafer Capacity

4,000

1982

4,000

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