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TUSB8042AIRGCR

Texas Instruments

TUSB8042AIRGCR by Texas Instruments

TUSB8042AIRGCR by Texas Instruments is a 64-terminal chip carrier with a max data transfer rate of 625 MBps. It operates in industrial temperatures (-40 to 85 °C) and supports I2C/SMBUS bus compatibility. Ideal for USB bus control applications, it has a CMOS technology and no-lead terminal form.

Median Price

$7.430

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 5,744 parts In-Stock

1+ parts

$7.430

100+ parts

$6.057

1k+ parts

$4.038

10k+ parts

-

5,744

$7.430

$6.057

$4.038

-

Mouser Electronics

USA . 2,975 parts In-Stock

1+ parts

$11.780

100+ parts

$7.890

1k+ parts

$7.180

10k+ parts

$6.800

2,975

$11.780

$7.890

$7.180

$6.800

DigiKey

USA . 2,238 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

$7.051

2,238

-

-

-

$7.051

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 900 parts In-Stock

1+ parts

$5.048

100+ parts

-

1k+ parts

-

10k+ parts

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900

$5.048

-

-

-

Digiode

USA . 3,425 parts In-Stock

1+ parts

$7.058

100+ parts

-

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-

10k+ parts

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3,425

$7.058

-

-

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Cyclops Electronics Ltd

UK . 11,832 parts In-Stock

1+ parts

-

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-

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11,832

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-

-

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Vyrian

USA . 3,327 parts In-Stock

1+ parts

-

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3,327

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Netroflash

USA . 2,000 parts In-Stock

1+ parts

$5.048

100+ parts

-

1k+ parts

-

10k+ parts

-

2,000

$5.048

-

-

-

Continental Prestige Electronics

USA . 904 parts In-Stock

1+ parts

$5.048

100+ parts

-

1k+ parts

-

10k+ parts

$4.947

904

$5.048

-

-

$4.947

Semicontronic

India . 3,644 parts In-Stock

1+ parts

$6.320

100+ parts

$6.162

1k+ parts

$6.130

10k+ parts

-

3,644

$6.320

$6.162

$6.130

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Ampacity Inc.

Singapore . 3,571 parts In-Stock

1+ parts

$6.320

100+ parts

-

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3,571

$6.320

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Corphita

USA . 287 parts In-Stock

1+ parts

$6.687

100+ parts

-

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287

$6.687

-

-

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Parana Technologies

USA . 904 parts In-Stock

1+ parts

$30.431

100+ parts

-

1k+ parts

$69.073

10k+ parts

-

904

$30.431

-

$69.073

-

DigiPath Technology Company

USA . 842 parts In-Stock

1+ parts

$33.508

100+ parts

$30.828

1k+ parts

-

10k+ parts

-

842

$33.508

$30.828

-

-

IDEA Electronic Components Group

UK . 1,152 parts In-Stock

1+ parts

$34.192

100+ parts

$32.482

1k+ parts

$30.773

10k+ parts

-

1,152

$34.192

$32.482

$30.773

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ChromeModa Solutions

Germany . 622 parts In-Stock

1+ parts

$34.192

100+ parts

$28.037

1k+ parts

-

10k+ parts

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622

$34.192

$28.037

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-

Advanced Electronics

New Zealand . 5,000 parts In-Stock

1+ parts

$48.643

100+ parts

$46.211

1k+ parts

$46.211

10k+ parts

-

5,000

$48.643

$46.211

$46.211

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Corohmni

South Africa . 745 parts In-Stock

1+ parts

$83.882

100+ parts

-

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10k+ parts

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745

$83.882

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Authorized Procurement Solutions

USA . 30,000 parts In-Stock

1+ parts

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30,000

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GreenTree Electronics

Israel . 10,000 parts In-Stock

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10,000

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Lixinc

USA . 8,650 parts In-Stock

1+ parts

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8,650

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Futuretech Components

Singapore . 2,000 parts In-Stock

1+ parts

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2,000

-

-

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A-Z Elektronik GmbH

Germany . 2,000 parts In-Stock

1+ parts

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2,000

-

-

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Argo Parts USA

USA . 1,234 parts In-Stock

1+ parts

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1,234

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iodParts Technologies Inc.

India . 50 parts In-Stock

1+ parts

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100+ parts

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50

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-

Overview

Experience seamless data transfer with the TUSB8042AIRGCR by Texas Instruments, a high-quality bus controller designed for industrial applications. With Texas Instruments' reputation for excellence in semiconductor manufacturing, you can trust in the reliability and performance of this product. Perfect for integrating into a variety of devices, this chip carrier features a maximum data transfer rate of 625 MBps and is compatible with I2C and SMBUS buses. Upgrade your systems with the TUSB8042AIRGCR and enjoy fast and efficient connectivity like never before.

Feature Benefit Bullets

Surface Mount: YES

Surface mount technology allows for easy and compact installation on PCBs, making the product suitable for space-constrained applications.

Maximum Supply Voltage: 1.26 V

Supports a higher supply voltage which can provide improved performance and stability.

Package Shape: SQUARE

Square packages are easier to handle and align, simplifying the assembly process.

No. of Terminals: 64

Provides a sufficient number of terminals for connecting to various components in a system.

Minimum Supply Voltage: 0.99 V

Supports a low minimum supply voltage, enabling operation in energy-efficient designs.

Maximum Operating Temperature: 85 °C

Can withstand high operating temperatures, ensuring reliability in demanding environments.

Maximum Data Transfer Rate: 625 MBps

High data transfer rate enables fast and efficient communication between devices.

Minimum Operating Temperature: -40 °C

Capable of operating in extremely low temperatures, suitable for outdoor or industrial applications.

Terminal Finish: NICKEL PALLADIUM GOLD

Provides good conductivity and corrosion resistance, ensuring reliable connections over time.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, ideal for battery-powered devices.

Nominal Supply Voltage: 1.1 V

Optimal supply voltage for stable performance and compatibility with various components.

Bus Compatibility: I2C; SMBUS

Supports multiple bus protocols, enhancing interoperability with different devices.

Technical Specifications

Bus Controllers TUSB8042AIRGCR attributes and parameters. Explore more Bus Controllers devices from Texas Instruments

Specs

Address Bus Width:

0

Bus Compatibility:

I2C; SMBUS

Maximum Data Transfer Rate:

625 MBps

External Data Bus Width:

0

JESD-30 Code:

S-XQCC-N64

JESD-609 Code:

e4

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

64

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

UNSPECIFIED

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG

Peak Reflow Temperature (C):

260

Maximum Supply Voltage:

1.26 V

Minimum Supply Voltage:

.99 V

Nominal Supply Voltage:

1.1 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Trade Compliance

TUSB8042AIRGCR Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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