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TUSB8041IRGCT

Texas Instruments

TUSB8041IRGCT by Texas Instruments

TUSB8041IRGCT by Texas Instruments is a 64-terminal BUS CONTROLLER IC with CMOS technology. It operates b/w -40 to 85 °C, compatible with I2C and SMBUS buses. The chip carrier package has a very thin profile, suitable for industrial applications requiring low voltage supply.

Median Price

$10.517

Lifecycle Status

Suppliers In-Stock

10

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 508 parts In-Stock

1+ parts

$8.033

100+ parts

$6.549

1k+ parts

$4.366

10k+ parts

-

508

$8.033

$6.549

$4.366

-

Verical

USA . 215 parts In-Stock

1+ parts

$10.517

100+ parts

$7.169

1k+ parts

$6.351

10k+ parts

$6.243

215

$10.517

$7.169

$6.351

$6.243

Chip1Stop

Japan . 215 parts In-Stock

1+ parts

$11.200

100+ parts

$7.440

1k+ parts

$6.460

10k+ parts

$5.820

215

$11.200

$7.440

$6.460

$5.820

Mouser Electronics

USA . 32 parts In-Stock

1+ parts

$12.750

100+ parts

$9.200

1k+ parts

$7.770

10k+ parts

-

32

$12.750

$9.200

$7.770

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DigiKey

USA . 691 parts In-Stock

1+ parts

-

100+ parts

-

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$7.827

10k+ parts

$7.708

691

-

-

$7.827

$7.708

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 1,000 parts In-Stock

1+ parts

$7.173

100+ parts

-

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1,000

$7.173

-

-

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Digiode

USA . 1,306 parts In-Stock

1+ parts

$7.631

100+ parts

-

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-

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1,306

$7.631

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-

-

Chip Stock

USA . 29,190 parts In-Stock

1+ parts

-

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29,190

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Vyrian

USA . 9,295 parts In-Stock

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-

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9,295

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Sensible Micro Corp

USA . 90 parts In-Stock

1+ parts

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90

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Semicontronic

India . 200 parts In-Stock

1+ parts

$6.830

100+ parts

$6.659

1k+ parts

$6.625

10k+ parts

-

200

$6.830

$6.659

$6.625

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Ampacity Inc.

Singapore . 73 parts In-Stock

1+ parts

$6.830

100+ parts

-

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-

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73

$6.830

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Continental Prestige Electronics

USA . 2,326 parts In-Stock

1+ parts

$7.173

100+ parts

-

1k+ parts

-

10k+ parts

$7.030

2,326

$7.173

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-

$7.030

Netroflash

USA . 500 parts In-Stock

1+ parts

$7.173

100+ parts

$7.030

1k+ parts

-

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500

$7.173

$7.030

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Corphita

USA . 3,570 parts In-Stock

1+ parts

$7.230

100+ parts

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3,570

$7.230

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Advanced Electronics

New Zealand . 300 parts In-Stock

1+ parts

$45.280

100+ parts

$43.016

1k+ parts

$43.016

10k+ parts

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300

$45.280

$43.016

$43.016

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Parana Technologies

USA . 786 parts In-Stock

1+ parts

$51.220

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786

$51.220

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DigiPath Technology Company

USA . 1,465 parts In-Stock

1+ parts

$56.400

100+ parts

$51.888

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1,465

$56.400

$51.888

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ChromeModa Solutions

Germany . 4,159 parts In-Stock

1+ parts

$57.551

100+ parts

$47.192

1k+ parts

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4,159

$57.551

$47.192

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IDEA Electronic Components Group

UK . 1,155 parts In-Stock

1+ parts

$57.551

100+ parts

$54.673

1k+ parts

$51.796

10k+ parts

-

1,155

$57.551

$54.673

$51.796

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Corohmni

South Africa . 533 parts In-Stock

1+ parts

$62.917

100+ parts

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533

$62.917

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Lixinc

USA . 10,574 parts In-Stock

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10,574

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Argo Parts USA

USA . 1,209 parts In-Stock

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1,209

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Robosynatics

Brazil . 114 parts In-Stock

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114

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Lucentia Tech

USA . 114 parts In-Stock

1+ parts

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100+ parts

$28.561

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$28.561

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$28.561

114

-

$28.561

$28.561

$28.561

Overview

Unlock the power of seamless connectivity with the TUSB8041IRGCT by Texas Instruments. With a reputation for superior quality and reliability, Texas Instruments delivers a cutting-edge Bus Controller that offers unparalleled performance in a variety of applications. Whether you're looking to enhance your industrial automation system or streamline data transfer in your consumer electronics devices, this versatile chip carrier provides exceptional value, benefits, and advantages to meet your specific needs. Experience the difference with Texas Instruments and take your projects to the next level with the TUSB8041IRGCT.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the internal components, ensuring a longer lifespan for the bus controller.

Surface Mount: YES

Allows for easy and efficient installation on a circuit board, saving time and reducing potential errors during assembly.

Maximum Supply Voltage: 1.26 V

Supports a wide range of supply voltages, making it versatile and compatible with various system configurations.

Package Shape: SQUARE

Helps in space-saving design and facilitates efficient placement on the circuit board.

No. of Terminals: 64

Provides ample connectivity options for interfacing with other components in the system.

Package Style (Meter): CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Allows for effective heat dissipation, ensuring optimal performance even under high operating temperatures.

Minimum Supply Voltage: 0.99 V

Works efficiently even at low supply voltages, making it energy-efficient and cost-effective.

Maximum Operating Temperature: 85 °C

Ensures reliable operation even in harsh environmental conditions where temperatures can be higher.

Minimum Operating Temperature: -40 °C

Designed to function in extremely cold temperatures, providing versatility in different operating environments.

Terminal Finish: NICKEL PALLADIUM GOLD

Delivers excellent conductivity and corrosion resistance, ensuring stable connections for efficient data transfer.

Terminal Position: QUAD

Facilitates easy integration with the circuit board and enhances signal integrity for reliable performance.

Maximum Seated Height: 1 mm

Low profile design allows for compact and space-saving placement on the circuit board.

Width: 9 mm

Compact size enables flexible placement and efficient use of space on the circuit board.

Maximum Time At Peak Reflow Temperature (s): 30

Ensures proper soldering and reflow process during assembly, reducing the risk of component damage.

Peak Reflow Temperature °C: 260

Withstands high reflow temperatures during the assembly process, ensuring a stable and reliable connection.

Length: 9 mm

Compact size enables efficient use of space on the circuit board, ideal for applications with limited space.

Temperature Grade: INDUSTRIAL

Designed to meet industrial-grade requirements for durability and reliability in harsh operating environments.

Peripheral IC Type: BUS CONTROLLER, UNIVERSAL SERIAL BUS

Supports universal serial bus connectivity, enabling seamless communication with various devices in the system.

Technology: CMOS

Utilizes CMOS technology for low power consumption and efficient operation, suitable for battery-powered applications.

Terminal Form: NO LEAD

Lead-free design ensures compliance with environmental regulations and reduces the risk of lead contamination.

Nominal Supply Voltage: 1.1 V

Optimal supply voltage for efficient performance and compatibility with standard power sources.

Bus Compatibility: I2C; SMBUS

Supports multiple bus protocols, providing flexibility and compatibility with various system configurations.

Terminal Pitch: 0.5 mm

Compact terminal pitch allows for high-density mounting, saving space and enabling efficient circuit board layout.

Moisture Sensitivity Level (MSL): 3

Designed to withstand moderate levels of moisture exposure, ensuring reliable operation in humid environments.

Technical Specifications

Bus Controllers TUSB8041IRGCT attributes and parameters. Explore more Bus Controllers devices from Texas Instruments

Specs

Bus Compatibility:

I2C; SMBUS

JESD-30 Code:

S-PQCC-N64

JESD-609 Code:

e4

Length:

9 mm

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

64

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Maximum Seated Height:

1 mm

Maximum Supply Voltage:

1.26 V

Minimum Supply Voltage:

.99 V

Nominal Supply Voltage:

1.1 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

9 mm

Trade Compliance

TUSB8041IRGCT Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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