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CYUSB2304-68LTXI

Infineon Technologies

CYUSB2304-68LTXI by Infineon Technologies

CYUSB2304-68LTXI by Infineon is a Bus Controller with 68 terminals, operating at -40 to 85 °C. It has a supply voltage range of 1.14V to 1.26V and supports I2C bus compatibility. This CMOS technology chip carrier is ideal for industrial applications requiring USB peripheral control in compact spaces.

Median Price

$3.606

Lifecycle Status

Suppliers In-Stock

10

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Chip1Stop

Japan . 300 parts In-Stock

1+ parts

$2.980

100+ parts

-

1k+ parts

-

10k+ parts

-

300

$2.980

-

-

-

Arrow

USA . 6,038 parts In-Stock

1+ parts

$4.233

100+ parts

$2.945

1k+ parts

$2.808

10k+ parts

$2.676

6,038

$4.233

$2.945

$2.808

$2.676

Mouser Electronics

USA . 1,029 parts In-Stock

1+ parts

$5.400

100+ parts

$3.460

1k+ parts

$3.110

10k+ parts

$3.020

1,029

$5.400

$3.460

$3.110

$3.020

DigiKey

USA . 1,200 parts In-Stock

1+ parts

$5.560

100+ parts

$3.560

1k+ parts

$3.279

10k+ parts

$3.105

1,200

$5.560

$3.560

$3.279

$3.105

Verical

USA . 6,038 parts In-Stock

1+ parts

-

100+ parts

$2.945

1k+ parts

$2.808

10k+ parts

$2.676

6,038

-

$2.945

$2.808

$2.676

Rochester

USA . 1,535 parts In-Stock

1+ parts

-

100+ parts

$2.790

1k+ parts

$2.500

10k+ parts

$2.350

1,535

-

$2.790

$2.500

$2.350

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 669 parts In-Stock

1+ parts

$2.636

100+ parts

-

1k+ parts

-

10k+ parts

-

669

$2.636

-

-

-

Vyrian

USA . 58 parts In-Stock

1+ parts

$2.775

100+ parts

-

1k+ parts

-

10k+ parts

-

58

$2.775

-

-

-

Chip Stock

USA . 857 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

857

-

-

-

-

Nova Conductors

Japan . 300 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

300

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 4,525 parts In-Stock

1+ parts

$2.360

100+ parts

-

1k+ parts

-

10k+ parts

-

4,525

$2.360

-

-

-

Corphita

USA . 83 parts In-Stock

1+ parts

$2.498

100+ parts

-

1k+ parts

-

10k+ parts

-

83

$2.498

-

-

-

Modulus Dynamics

Lithuania . 4,635 parts In-Stock

1+ parts

$21.030

100+ parts

$20.189

1k+ parts

$19.348

10k+ parts

-

4,635

$21.030

$20.189

$19.348

-

Corohmni

South Africa . 856 parts In-Stock

1+ parts

$44.375

100+ parts

-

1k+ parts

-

10k+ parts

-

856

$44.375

-

-

-

QUARKTWIN TECHNOLOGY LTD

USA . 15,574 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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15,574

-

-

-

-

Authorized Procurement Solutions

USA . 3,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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3,000

-

-

-

-

Continental Prestige Electronics

USA . 798 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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798

-

-

-

-

Argo Parts USA

USA . 217 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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217

-

-

-

-

Aranea Global

USA . 100 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

100

-

-

-

-

Overview

Discover the ultimate solution for your bus controller needs with the CYUSB2304-68LTXI by Infineon Technologies. Designed with precision and expertise, this versatile chip carrier offers unrivaled performance and reliability in a compact square package. Perfect for a wide range of applications, from industrial to consumer electronics, this innovative product ensures seamless communication and control. Elevate your projects with the superior quality and cutting-edge technology of the CYUSB2304-68LTXI - the perfect choice for all your bus controller requirements.

Feature Benefit Bullets

Surface Mount: YES

Allows for easy placement and soldering onto PCB, making it convenient for manufacturing and assembly.

Maximum Supply Voltage: 1.26 V

High maximum supply voltage ensures stable and reliable operation within safe limits.

Package Shape: SQUARE

Square package shape can provide better thermal dissipation and easier handling compared to other shapes.

No. of Terminals: 68

Having a higher number of terminals allows for more connectivity options and functionalities.

Package Style: CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

This package style offers a good balance of compact size, thermal management, and durability.

Minimum Supply Voltage: 1.14 V

Low minimum supply voltage allows for efficient power consumption and operation at lower levels.

Maximum Operating Temperature: 85 °C

High maximum operating temperature ensures reliability in various environmental conditions.

Minimum Operating Temperature: -40 °C

Wide range of minimum operating temperature ensures functionality in extreme cold conditions.

Terminal Finish: PURE TIN

Pure tin terminal finish provides good conductivity and solderability.

Terminal Position: QUAD

Quad terminal position allows for easier routing and connection to other components.

Maximum Seated Height: 1 mm

Low seated height reduces overall profile of the product for space-constrained applications.

Width: 8 mm

Compact width allows for efficient use of board space and easier integration into designs.

Length: 8 mm

Compact length allows for efficient use of board space and easier integration into designs.

Temperature Grade: INDUSTRIAL

Industrial-grade temperature range ensures reliable operation in harsh industrial environments.

Peripheral IC Type: BUS CONTROLLER, UNIVERSAL SERIAL BUS

Being a bus controller for universal serial bus provides versatile connectivity options and compatibility.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity for efficient performance.

Terminal Form: NO LEAD

No lead terminal form is environmentally friendly and allows for better thermal management.

Nominal Supply Voltage: 1.2 V

Stable nominal supply voltage ensures consistent performance and compatibility with standard power sources.

Bus Compatibility: I2C

Compatibility with I2C bus protocol expands connectivity options and integration with other devices.

Terminal Pitch: 0.4 mm

Fine terminal pitch allows for high-density mounting and compact design implementation.

Moisture Sensitivity Level (MSL): 3

MSL 3 indicates appropriate moisture sensitivity for reliable storage and handling in manufacturing.

Technical Specifications

Bus Controllers CYUSB2304-68LTXI attributes and parameters. Explore more Bus Controllers devices from Infineon Technologies

Specs

Bus Compatibility:

I2C

JESD-30 Code:

S-XQCC-N68

Length:

8 mm

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

68

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

UNSPECIFIED

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Maximum Seated Height:

1 mm

Maximum Supply Voltage:

1.26 V

Minimum Supply Voltage:

1.14 V

Nominal Supply Voltage:

1.2 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

PURE TIN

Terminal Form:

Terminal Pitch:

.4 mm

Terminal Position:

QUAD

Width:

8 mm

Trade Compliance

CYUSB2304-68LTXI Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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