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VNC2-32L1B

FTDI

VNC2-32L1B by FTDI

VNC2-32L1B by FTDI is a 32-terminal bus controller with 1.8-3.3V power supplies, operating at -40 to 125°C. It offers a data transfer rate of 1.5 MBps and supports USB technology for automotive applications. The compact package style, low profile design, and CMOS technology make it ideal for high-speed communication needs in various electronic systems.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

< 1k

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Vyrian

USA . 592 parts In-Stock

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Nova Conductors

Japan . 50 parts In-Stock

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Distributors (Availability)

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AZTECH Wire

Italy . 692 parts In-Stock

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$18.501

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692

$18.501

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Aztec Data Supply Inc.

USA . 219 parts In-Stock

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$43.760

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Continental Prestige Electronics

USA . 5,717 parts In-Stock

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Argo Parts USA

USA . 4,283 parts In-Stock

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Authorized Procurement Solutions

USA . 4,000 parts In-Stock

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4,000

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Perfect Parts

USA . 3,602 parts In-Stock

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Infinite Electronics LLP (Excess)

. 72 parts In-Stock

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Bastille Electronics

Australia . 10 parts In-Stock

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Overview

Enhance your electronic designs with the VNC2-32L1B by FTDI, a top-of-the-line bus controller that offers unparalleled quality and reliability. With FTDI's reputation for excellence in the industry, this product is sure to meet and exceed your expectations. From automotive applications to universal serial bus peripherals, the VNC2-32L1B provides seamless data transfer at high speeds of up to 1.5 MBps. Experience the value and benefits of this innovative technology, as it elevates your projects to new heights. Elevate your creations with the VNC2-32L1B by FTDI today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable, ideal for automotive applications.

Surface Mount: YES

Surface mount capability allows for easy and efficient PCB assembly, saving time and cost in production.

Maximum Supply Voltage: 1.98 V

The maximum supply voltage of 1.98 V ensures reliable operation within specified limits, preventing damage to the device.

Package Shape: SQUARE

The square package shape enables efficient use of board space, making it suitable for compact electronic designs.

Power Supplies (V): 1.8,3.3

Support for multiple power supply voltages (1.8V and 3.3V) provides compatibility with various systems and components.

No. of Terminals: 32

The 32 terminals allow for versatile connectivity options, accommodating a range of input and output connections.

Maximum Seated Height: 1.6 mm

The low profile design with a maximum seated height of 1.6mm enables installation in space-constrained environments.

Maximum Data Transfer Rate: 1.5 MBps

High data transfer rate of 1.5 MBps ensures fast and efficient communication between devices, enhancing overall system performance.

Temperature Grade: AUTOMOTIVE

Designed for automotive applications, the product meets industry standards for temperature tolerance and reliability in harsh operating conditions.

Technical Specifications

Bus Controllers VNC2-32L1B attributes and parameters. Explore more Bus Controllers devices from FTDI

Specs

Additional Features:

ALSO REQUIRES AT 3.3 V I/O SUPPLY

Address Bus Width:

0

Maximum Clock Frequency:

6 MHz

Maximum Data Transfer Rate:

1.5 MBps

External Data Bus Width:

0

JESD-30 Code:

S-PQFP-G32

Length:

7 mm

No. of Terminals:

32

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP32,.35SQ,32

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

1.8,3.3

Qualification:

Not Qualified

Maximum Seated Height:

1.6 mm

Sub-Category:

Bus Controllers

Maximum Supply Voltage:

1.98 V

Minimum Supply Voltage:

1.62 V

Nominal Supply Voltage:

1.8 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

7 mm

Trade Compliance

VNC2-32L1B Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

FTDI

FTDI Chip is a fab-less semiconductor company established in 1992, partnered with the world’s leading foundries. The headquarter is located in Glasgow, UK and is supported with research and development facilities in Glasgow, Singapore and Taipei (Taiwan) plus regional sales and technical support sites in Glasgow, Taipei, Tigard (Oregon, USA) and Shanghai (China). FTDI Chip develops innovative silicon solutions that enhance interaction with the latest in global technology. The major objective from the company is to ‘bridge technologies’ in order to support engineers with highly sophisticated, feature-rich, robust and simple-to-use product platforms. FTDI Chip continues its philosophy of Design Made Easy, where it strives to incorporate device and system features in its chips that enable the designer to quickly and easily create and implement designs. We supplement this strategy, with WW regional support and a “total” solutions mindset to provide reduced development and debug costs and a fast time to market.

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