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VNC2-32Q1C

FTDI

VNC2-32Q1C by FTDI

VNC2-32Q1C by FTDI is a 32-terminal bus controller with 1.62-1.98 V supply voltage range, 60 MBps data transfer rate, and -40 to 85°C operating temperature. Ideal for SPI and UART bus compatibility in industrial applications requiring high-speed communication and low power consumption.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

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Vyrian

USA . 1,425 parts In-Stock

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Nova Conductors

Japan . 100 parts In-Stock

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100

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AZTECH Wire

Italy . 415 parts In-Stock

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$18.437

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415

$18.437

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Aztec Data Supply Inc.

USA . 4,248 parts In-Stock

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$42.910

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$42.910

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Continental Prestige Electronics

USA . 4,109 parts In-Stock

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Argo Parts USA

USA . 4,077 parts In-Stock

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Bastille Electronics

Australia . 500 parts In-Stock

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500

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Overview

Unlock the power of seamless data transfer with the VNC2-32Q1C by FTDI. As a leading manufacturer in the industry, FTDI delivers top-quality bus controllers that are perfect for a wide range of applications. Whether you need to interface with SPI or UART buses, this versatile chip carrier with a very thin profile offers unmatched performance and reliability. Experience the benefits of fast data transfer rates and industrial-grade temperature tolerance, all in a compact package that adds value to your projects. Elevate your designs with FTDI's VNC2-32Q1C and unleash a world of possibilities.

Feature Benefit Bullets

Surface Mount: YES

Surface mount technology allows for easy and efficient installation on circuit boards, saving space and enabling automated assembly processes.

Maximum Supply Voltage: 1.98 V

Operates efficiently within a safe voltage range, ensuring stable performance and preventing damage to the device.

Address Bus Width: 3

Provides ample address bus width for efficient communication and data transmission between components in the system.

Package Shape: SQUARE

Square package shape facilitates easier integration with other components on the circuit board and allows for more compact designs.

No. of Terminals: 32

Sufficient number of terminals for connectivity and interface with other devices, ensuring flexibility and compatibility during system integration.

Package Style (Meter): CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Versatile package style options provide flexibility in thermal management and space constraints, allowing for various installation configurations.

Minimum Supply Voltage: 1.62 V

Supports a low minimum supply voltage, enabling energy-efficient operation and compatibility with a wide range of power sources.

Maximum Operating Temperature: 85 °C

High maximum operating temperature ensures reliable performance in demanding industrial environments without overheating or degradation.

Maximum Data Transfer Rate: 60 MBps

High data transfer rate enables fast and efficient communication between devices, improving overall system performance and responsiveness.

Minimum Operating Temperature: -40 °C

Low minimum operating temperature allows for reliable operation in extreme cold conditions, suitable for a wide range of industrial applications.

Terminal Position: QUAD

Quad terminal position offers a standardized configuration for easy connection and compatibility with other components, streamlining the integration process.

Maximum Seated Height: 1 mm

Low seated height allows for a compact and space-saving design, ideal for applications where size constraints and height limitations are a concern.

Width: 7 mm

Narrow width facilitates efficient placement and routing on the circuit board, optimizing space utilization and enabling compact system designs.

External Data Bus Width: 8

Wide external data bus width enhances data transmission speed and efficiency, supporting high-bandwidth communication between devices.

Maximum Clock Frequency: 12 MHz

High maximum clock frequency allows for fast processing and operation, ensuring responsive and real-time data handling within the system.

Maximum Time At Peak Reflow Temperature (s): 40

Long time at peak reflow temperature provides sufficient duration for proper soldering and component bonding during manufacturing and assembly processes.

Peak Reflow Temperature °C: 260

High peak reflow temperature tolerance ensures reliable soldering and thermal stability, preventing solder joint failures and ensuring long-term durability.

Length: 7 mm

Compact length allows for a space-efficient layout on the circuit board, contributing to overall system miniaturization and optimal use of available space.

Temperature Grade: INDUSTRIAL

Industrial-grade temperature tolerance ensures reliable operation in harsh environmental conditions, making it suitable for rugged industrial applications.

Peripheral IC Type: BUS CONTROLLER, UNIVERSAL SERIAL BUS

Designed as a bus controller for USB devices, providing compatibility and support for various USB peripherals in a system, offering versatile connectivity options.

Technology: CMOS

CMOS technology offers low power consumption, high speed, and compatibility with various interfaces, ensuring efficient and reliable performance in diverse applications.

Terminal Form: NO LEAD

Lead-free terminal form complies with environmental regulations and reduces the risk of lead contamination, making it a more eco-friendly and safe choice.

Nominal Supply Voltage: 1.8 V

Stable nominal supply voltage ensures consistent and reliable operation, providing a suitable power source for the device's performance requirements.

Bus Compatibility: SPI; UART

Support for SPI and UART bus compatibility enables seamless communication with a wide range of devices and peripherals, enhancing the product's versatility and interoperability.

Terminal Pitch: 0.65 mm

Narrow terminal pitch allows for dense packing and efficient routing on the circuit board, maximizing space utilization and enabling high-density system integration.

Moisture Sensitivity Level (MSL): 3

Moisture sensitivity level 3 indicates moderate sensitivity to moisture exposure, requiring standard handling procedures to prevent damage during storage and assembly.

Drive Interface Standard: RS232; RS422; RS485

Support for standard RS232, RS422, and RS485 drive interfaces ensures compatibility with a wide range of communication protocols and devices, facilitating seamless integration into diverse systems.

Technical Specifications

Bus Controllers VNC2-32Q1C attributes and parameters. Explore more Bus Controllers devices from FTDI

Specs

Address Bus Width:

3

Bus Compatibility:

SPI; UART

Maximum Clock Frequency:

12 MHz

Maximum Data Transfer Rate:

60 MBps

Drive Interface Standard:

RS232; RS422; RS485

External Data Bus Width:

8

JESD-30 Code:

S-XQCC-N32

Length:

7 mm

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

32

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

UNSPECIFIED

Package Code:

Package Equivalence Code:

LCC32,.27SQ,25

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Maximum Seated Height:

1 mm

Maximum Supply Voltage:

1.98 V

Minimum Supply Voltage:

1.62 V

Nominal Supply Voltage:

1.8 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

40

Width:

7 mm

Trade Compliance

VNC2-32Q1C Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

FTDI

FTDI Chip is a fab-less semiconductor company established in 1992, partnered with the world’s leading foundries. The headquarter is located in Glasgow, UK and is supported with research and development facilities in Glasgow, Singapore and Taipei (Taiwan) plus regional sales and technical support sites in Glasgow, Taipei, Tigard (Oregon, USA) and Shanghai (China). FTDI Chip develops innovative silicon solutions that enhance interaction with the latest in global technology. The major objective from the company is to ‘bridge technologies’ in order to support engineers with highly sophisticated, feature-rich, robust and simple-to-use product platforms. FTDI Chip continues its philosophy of Design Made Easy, where it strives to incorporate device and system features in its chips that enable the designer to quickly and easily create and implement designs. We supplement this strategy, with WW regional support and a “total” solutions mindset to provide reduced development and debug costs and a fast time to market.

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