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CY7C65213-32LTXI

Infineon Technologies

CY7C65213-32LTXI by Infineon Technologies

CY7C65213-32LTXI by Infineon Technologies is a bus controller with a max data transfer rate of 1.5 MBps, suitable for industrial applications. It operates in temperatures ranging from -40 to 85 °C and supports UART, VBUS bus compatibility. The chip carrier package style has a square shape with 32 terminals and requires a supply voltage b/w 4.35V to 5.25V.

Median Price

$1.805

Lifecycle Status

Suppliers In-Stock

18

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Chip1Stop

Japan . 8,075 parts In-Stock

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$1.460

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8,075

$1.460

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Arrow

USA . 6,310 parts In-Stock

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$1.472

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6,310

$1.472

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Farnell

UK . 11 parts In-Stock

1+ parts

$1.730

100+ parts

$1.240

1k+ parts

$1.210

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-

11

$1.730

$1.240

$1.210

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Mouser Electronics

USA . 3,627 parts In-Stock

1+ parts

$3.150

100+ parts

$1.990

1k+ parts

$1.770

10k+ parts

$1.740

3,627

$3.150

$1.990

$1.770

$1.740

Newark

USA . 6 parts In-Stock

1+ parts

$3.180

100+ parts

$1.970

1k+ parts

$1.800

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6

$3.180

$1.970

$1.800

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DigiKey

USA . 6,909 parts In-Stock

1+ parts

$3.800

100+ parts

$2.347

1k+ parts

$2.087

10k+ parts

$2.010

6,909

$3.800

$2.347

$2.087

$2.010

Verical

USA . 2,772 parts In-Stock

1+ parts

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2,772

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Flip Electronics (Authorized)

USA . 2,135 parts In-Stock

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2,135

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RS (Exports)

UK . 490 parts In-Stock

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$1.805

10k+ parts

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490

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-

$1.805

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Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 54 parts In-Stock

1+ parts

$1.398

100+ parts

-

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54

$1.398

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Nova Conductors

Japan . 500 parts In-Stock

1+ parts

$2.583

100+ parts

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500

$2.583

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Ozdisan Elektronik

Türkiye . 1,492 parts In-Stock

1+ parts

$2.877

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1,492

$2.877

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Chip Stock

USA . 10,184 parts In-Stock

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10,184

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Rutronik

Germany . 8,820 parts In-Stock

1+ parts

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$1.630

8,820

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$1.630

Vyrian

USA . 3,631 parts In-Stock

1+ parts

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3,631

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Flip Electronics

USA . 2,135 parts In-Stock

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2,135

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Extreme Components

USA . 470 parts In-Stock

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470

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Schukat

Germany . 145 parts In-Stock

1+ parts

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100+ parts

$2.184

1k+ parts

$2.097

10k+ parts

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145

-

$2.184

$2.097

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 3,720 parts In-Stock

1+ parts

$1.020

100+ parts

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3,720

$1.020

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Corphita

USA . 145 parts In-Stock

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$1.325

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145

$1.325

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Corohmni

South Africa . 2,856 parts In-Stock

1+ parts

$1.740

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2,856

$1.740

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Modulus Dynamics

Lithuania . 647 parts In-Stock

1+ parts

$1.740

100+ parts

$1.670

1k+ parts

$1.601

10k+ parts

-

647

$1.740

$1.670

$1.601

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Advanced Electronics

New Zealand . 650 parts In-Stock

1+ parts

$1.792

100+ parts

$1.703

1k+ parts

$1.703

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650

$1.792

$1.703

$1.703

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Semicontronic

India . 3,552 parts In-Stock

1+ parts

$2.220

100+ parts

$2.164

1k+ parts

$2.153

10k+ parts

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3,552

$2.220

$2.164

$2.153

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Continental Prestige Electronics

USA . 6,278 parts In-Stock

1+ parts

$2.583

100+ parts

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$2.531

6,278

$2.583

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$2.531

Argo Parts USA

USA . 1,471 parts In-Stock

1+ parts

$2.583

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1,471

$2.583

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Microchip USA

USA . 4,380 parts In-Stock

1+ parts

$23.010

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4,380

$23.010

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Aztec Data Supply Inc.

USA . 729 parts In-Stock

1+ parts

$25.542

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729

$25.542

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Futuretech Components

Singapore . 7,840 parts In-Stock

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7,840

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A-Z Elektronik GmbH

Germany . 3,489 parts In-Stock

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3,489

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Kepictronics

USA . 2,326 parts In-Stock

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2,326

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Perfect Parts

USA . 2,138 parts In-Stock

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2,138

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Lixinc

USA . 554 parts In-Stock

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554

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Formix International (Excess)

India . 69 parts In-Stock

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69

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Overview

Unlock seamless data transfer with the CY7C65213-32LTXI from Infineon Technologies. As a trusted manufacturer in the industry, Infineon delivers top-quality bus controllers like this one, designed for various applications. With a maximum supply voltage of 5.25V and a fast data transfer rate of 1.5 MBps, this chip carrier boasts reliability and efficiency. Whether you need UART or VBUS compatibility, this product offers unparalleled performance. Experience the convenience and effectiveness of this industrial-grade bus controller, offering customers unmatched value and benefits for their projects.

Feature Benefit Bullets

Surface Mount: YES

Surface mount technology allows for easy and efficient assembly onto circuit boards, saving time and cost in production.

Maximum Supply Voltage: 5.25 V

Higher maximum supply voltage provides flexibility in power input options for the bus controller.

Package Shape: SQUARE

Square package shape allows for easy integration into circuit layouts and saves space on the board.

No. of Terminals: 32

Having 32 terminals provides numerous connection options for various peripherals and devices.

Package Style (Meter): CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

The combination of chip carrier, heat sink/slug, and thin profile design ensures efficient heat dissipation and space-saving capabilities.

Minimum Supply Voltage: 4.35 V

Lower minimum supply voltage ensures compatibility with a wide range of power sources.

Maximum Operating Temperature: 85 °C

High maximum operating temperature allows for reliable performance in various environmental conditions.

Maximum Data Transfer Rate: 1.5 MBps

High data transfer rate enables fast communication between devices connected to the bus controller.

Minimum Operating Temperature: -40 °C

Low minimum operating temperature ensures the bus controller can function in extreme cold environments.

Terminal Finish: NICKEL PALLADIUM GOLD

Nickel palladium gold finish provides superior conductivity and corrosion resistance for terminal connections.

Terminal Position: QUAD

Quad terminal position allows for secure and stable connections with peripheral devices.

Maximum Seated Height: 1 mm

Low maximum seated height helps in compact device designs and reduces the overall profile of the bus controller.

Width: 5 mm

Narrow width makes the bus controller suitable for space-constrained applications.

Maximum Time At Peak Reflow Temperature (s): 30

Quick reflow process time of 30 seconds ensures efficient manufacturing and assembly.

Peak Reflow Temperature °C: 260

High peak reflow temperature ensures reliable solder joints during the assembly process.

Length: 5 mm

Compact length design enables easy integration into various electronic devices.

Temperature Grade: INDUSTRIAL

Industrial-grade temperature tolerance ensures the bus controller can withstand harsh operating conditions.

Peripheral IC Type: BUS CONTROLLER, UNIVERSAL SERIAL BUS

Support for universal serial bus communication protocol makes this bus controller versatile and widely compatible.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity for efficient and reliable operation.

Terminal Form: NO LEAD

No lead terminal form complies with environmental standards and eliminates the risk of lead-related hazards.

Maximum Supply Current: 18 mA

Low maximum supply current requirement means minimal power consumption during operation.

Nominal Supply Voltage: 5 V

Standard nominal supply voltage of 5V makes integration with existing systems straightforward.

Bus Compatibility: UART; VBUS

Support for UART and VBUS bus compatibility enhances the connectivity options of the bus controller.

Terminal Pitch: 0.5 mm

Fine terminal pitch of 0.5mm allows for high-density mounting on circuit boards.

Moisture Sensitivity Level (MSL): 3

MSL level 3 indicates the humidity sensitivity level during storage and handling, ensuring product reliability.

Drive Interface Standard: RS232; RS422; RS485

Compatibility with RS232, RS422, and RS485 drive interfaces broadens the range of devices the bus controller can communicate with.

Technical Specifications

Bus Controllers CY7C65213-32LTXI attributes and parameters. Explore more Bus Controllers devices from Infineon Technologies

Specs

Additional Features:

ALSO OPERATES AT 3.3 V TYP

Bus Compatibility:

UART; VBUS

Maximum Data Transfer Rate:

1.5 MBps

Drive Interface Standard:

RS232; RS422; RS485

JESD-30 Code:

S-XQCC-N32

JESD-609 Code:

e4

Length:

5 mm

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

32

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

UNSPECIFIED

Package Code:

Package Equivalence Code:

LCC32,.2SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Qualification:

Not Qualified

Maximum Seated Height:

1 mm

Maximum Supply Current:

18 mA

Maximum Supply Voltage:

5.25 V

Minimum Supply Voltage:

4.35 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

5 mm

Trade Compliance

CY7C65213-32LTXI Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.B.2.B

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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