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FT4232HPQ-TRAY

FTDI

FT4232HPQ-TRAY by FTDI

FTDI's FT4232HPQ-TRAY is a bus controller with 68 terminals, operating at -40 to 85 °C. It supports I2C, UART, and USB buses with a data transfer rate of 60 MBps. This chip carrier has a square shape, measures 8x8 mm in size, and requires a supply voltage b/w 1.08V to 1.32V for various applications.

Median Price

$6.915

Lifecycle Status

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3

In-Stock Inventory

< 1k

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Nova Conductors

Japan . 86 parts In-Stock

1+ parts

$6.830

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86

$6.830

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TME

Poland . 449 parts In-Stock

1+ parts

$7.000

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449

$7.000

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Vyrian

USA . 401 parts In-Stock

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401

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Distributors (Availability)

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Continental Prestige Electronics

USA . 6,833 parts In-Stock

1+ parts

$6.830

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$6.693

6,833

$6.830

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$6.693

Netroflash

USA . 50 parts In-Stock

1+ parts

$6.830

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-

1k+ parts

$6.488

10k+ parts

$6.352

50

$6.830

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$6.488

$6.352

Modulus Dynamics

Lithuania . 15 parts In-Stock

1+ parts

$7.581

100+ parts

$7.505

1k+ parts

$7.278

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15

$7.581

$7.505

$7.278

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AZTECH Wire

Italy . 415 parts In-Stock

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$16.322

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415

$16.322

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Corohmni

South Africa . 49 parts In-Stock

1+ parts

$42.641

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49

$42.641

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Advanced Electronics

New Zealand . 3,000 parts In-Stock

1+ parts

$53.085

100+ parts

$50.431

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$50.431

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3,000

$53.085

$50.431

$50.431

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Aztec Data Supply Inc.

USA . 32,426 parts In-Stock

1+ parts

$70.200

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32,426

$70.200

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Lucentia Tech

USA . 5,000 parts In-Stock

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$0.050

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$0.050

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$0.050

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$0.050

$0.050

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Argo Parts USA

USA . 1,958 parts In-Stock

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1,958

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Overview

Experience the cutting-edge technology of FTDI with the FT4232HPQ-TRAY, a high-quality bus controller designed to elevate your electronic projects. With a maximum data transfer rate of 60 MBps and compatibility with I2C, UART, and USB buses, this versatile chip carrier provides seamless connectivity for a wide range of applications. From industrial automation to consumer electronics, trust FTDI's expertise in creating reliable and efficient solutions that deliver superior performance. Upgrade your projects today with the FT4232HPQ-TRAY and experience the value and benefits that only FTDI can offer.

Feature Benefit Bullets

Surface Mount: YES

Easy to install and saves space on the PCB.

Maximum Supply Voltage: 1.32 V

Provides a wide operating voltage range for flexibility.

Package Shape: SQUARE

Allows for easy handling and placement on the PCB.

No. of Terminals: 68

Provides ample connectivity options for various peripherals.

Maximum Operating Temperature: 85 °C

Ensures reliability in a range of environmental conditions.

Maximum Data Transfer Rate: 60 MBps

Enables fast and efficient data transfer for connected devices.

Peripheral IC Type: BUS CONTROLLER, UNIVERSAL SERIAL BUS

Supports multiple bus protocols for versatile use.

Technology: CMOS

Provides low power consumption and high noise immunity.

Nominal Supply Voltage: 1.2 V

Optimal voltage level for efficient performance.

Bus Compatibility: I2C; UART; USB

Compatible with popular bus standards for easy integration.

Technical Specifications

Bus Controllers FT4232HPQ-TRAY attributes and parameters. Explore more Bus Controllers devices from FTDI

Specs

Bus Compatibility:

I2C; UART; USB

Maximum Data Transfer Rate:

60 MBps

JESD-30 Code:

S-XQCC-N68

Length:

8 mm

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

68

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Code:

Package Equivalence Code:

LCC68,.32SQ,16

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH

Maximum Seated Height:

.9 mm

Maximum Supply Voltage:

1.32 V

Minimum Supply Voltage:

1.08 V

Nominal Supply Voltage:

1.2 V

Surface Mount:

YES

Technology:

CMOS

Terminal Form:

Terminal Pitch:

.4 mm

Terminal Position:

QUAD

Width:

8 mm

Trade Compliance

FT4232HPQ-TRAY Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

FTDI

FTDI Chip is a fab-less semiconductor company established in 1992, partnered with the world’s leading foundries. The headquarter is located in Glasgow, UK and is supported with research and development facilities in Glasgow, Singapore and Taipei (Taiwan) plus regional sales and technical support sites in Glasgow, Taipei, Tigard (Oregon, USA) and Shanghai (China). FTDI Chip develops innovative silicon solutions that enhance interaction with the latest in global technology. The major objective from the company is to ‘bridge technologies’ in order to support engineers with highly sophisticated, feature-rich, robust and simple-to-use product platforms. FTDI Chip continues its philosophy of Design Made Easy, where it strives to incorporate device and system features in its chips that enable the designer to quickly and easily create and implement designs. We supplement this strategy, with WW regional support and a “total” solutions mindset to provide reduced development and debug costs and a fast time to market.

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