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FT4222HQ-C-T

FTDI

FT4222HQ-C-T by FTDI

FTDI's FT4222HQ-C-T is a versatile bus controller with 32 terminals, supporting I2C, SPI, and VBUS. It operates b/w -40 to 85°C with a clock frequency of 12 MHz and data transfer rate up to 60 MBps. Ideal for industrial applications requiring high-speed communication in compact designs.

Median Price

$3.000

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 150 parts In-Stock

1+ parts

$1.526

100+ parts

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150

$1.526

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DF Sales Co.

USA . 125 parts In-Stock

1+ parts

$3.000

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125

$3.000

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DF Sales Co.

USA . 125 parts In-Stock

1+ parts

$3.000

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125

$3.000

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Vyrian

USA . 6,041 parts In-Stock

1+ parts

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6,041

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Argo Parts USA

USA . 362 parts In-Stock

1+ parts

$1.526

100+ parts

-

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362

$1.526

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AZTECH Wire

Italy . 216 parts In-Stock

1+ parts

$19.231

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216

$19.231

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Advanced Electronics

New Zealand . 50 parts In-Stock

1+ parts

$45.219

100+ parts

$44.767

1k+ parts

$42.958

10k+ parts

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50

$45.219

$44.767

$42.958

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Aztec Data Supply Inc.

USA . 17,826 parts In-Stock

1+ parts

$75.740

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17,826

$75.740

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Netroflash

USA . 1,000 parts In-Stock

1+ parts

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100+ parts

$1.496

1k+ parts

$1.450

10k+ parts

$1.420

1,000

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$1.496

$1.450

$1.420

Authorized Procurement Solutions

USA . 500 parts In-Stock

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500

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Overview

Experience seamless data transfer and efficient bus control with the FT4222HQ-C-T by FTDI. As a leading manufacturer in the industry, FTDI has crafted a high-quality bus controller that offers unparalleled performance and reliability. Ideal for a wide range of applications, this chip carrier features a compact square package with 32 terminals, making it suitable for industrial use. With a maximum data transfer rate of 60 MBps and compatibility with I2C, SPI, and VBUS, this bus controller provides fast and versatile connectivity. Trust FTDI to deliver cutting-edge technology that meets your needs and exceeds your expectations.

Feature Benefit Bullets

Surface Mount: YES

Allows for easy and convenient placement on circuit boards, saving space and enabling efficient assembly.

Maximum Supply Voltage: 3.63 V

Provides flexibility in power supply options and supports a wide range of applications.

Package Shape: SQUARE

Enables uniform and compact packaging, ideal for modern electronic devices with limited space.

No. of Terminals: 32

Sufficient number of terminals for connecting to various components and peripherals in a system.

Package Style: CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Ensures efficient heat dissipation and overall thermal management, enhancing the product's reliability and performance.

Maximum Operating Temperature: 85 °C

Suitable for industrial environments where higher temperatures may be encountered, ensuring stable operation.

Maximum Data Transfer Rate: 60 MBps

High data transfer rate enables quick and seamless communication between connected devices, enhancing overall system performance.

Minimum Operating Temperature: -40 °C

Ability to operate in extremely low temperatures, making it suitable for various environmental conditions.

Terminal Finish: MATTE TIN

Provides good contact reliability and solderability, ensuring secure connections for stable performance.

Maximum Seated Height: 1 mm

Low profile design allows for compact integration into electronic devices, saving space and enhancing overall aesthetics.

Width: 5 mm

Compact width makes it suitable for applications where space is limited, such as small form factor devices.

Maximum Clock Frequency: 12 MHz

Supports high-speed clocking requirements, facilitating efficient data processing and communication.

Maximum Time At Peak Reflow Temperature (s): 30

Ensures proper solder reflow during manufacturing, contributing to reliable and robust product assembly.

Peak Reflow Temperature °C: 260

High reflow temperature capability for lead-free soldering processes, meeting industry standards and regulations.

Length: 5 mm

Compact length contributes to the overall small footprint of the product, making it suitable for space-constrained applications.

Temperature Grade: INDUSTRIAL

Designed to withstand harsh industrial environments, ensuring reliable operation in demanding conditions.

Peripheral IC Type: BUS CONTROLLER, UNIVERSAL SERIAL BUS

Supports various bus interfaces and protocols, enhancing compatibility and flexibility for integration into different systems.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, contributing to efficient and reliable operation.

Terminal Form: NO LEAD

Lead-free terminal form complies with environmental regulations and ensures better solder joint quality for long-term reliability.

Maximum Supply Current: 80 mA

Low supply current requirement results in energy-efficient operation, suitable for battery-powered devices.

Nominal Supply Voltage: 3.3 V

Standard supply voltage for compatibility with common power sources, simplifying integration into existing systems.

Bus Compatibility: I2C; SPI; VBUS

Supports multiple bus protocols, allowing for versatile connectivity options and interoperability with various devices.

Terminal Pitch: 0.5 mm

Fine pitch spacing enables high-density connections, making it suitable for modern electronic designs with compact layouts.

Moisture Sensitivity Level (MSL): 3

MSL 3 rating indicates moderate sensitivity to moisture, requiring standard precautions during handling and storage.

Technical Specifications

Bus Controllers FT4222HQ-C-T attributes and parameters. Explore more Bus Controllers devices from FTDI

Specs

Additional Features:

ALSO OPERATES AT 5 V TYP

Bus Compatibility:

I2C; SPI; VBUS

Maximum Clock Frequency:

12 MHz

Maximum Data Transfer Rate:

60 MBps

JESD-30 Code:

S-XQCC-N32

JESD-609 Code:

e3

Length:

5 mm

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

32

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

UNSPECIFIED

Package Code:

Package Equivalence Code:

LCC32,.2SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Maximum Seated Height:

1 mm

Maximum Supply Current:

80 mA

Maximum Supply Voltage:

3.63 V

Minimum Supply Voltage:

2.97 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

5 mm

Trade Compliance

FT4222HQ-C-T Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

FTDI

FTDI Chip is a fab-less semiconductor company established in 1992, partnered with the world’s leading foundries. The headquarter is located in Glasgow, UK and is supported with research and development facilities in Glasgow, Singapore and Taipei (Taiwan) plus regional sales and technical support sites in Glasgow, Taipei, Tigard (Oregon, USA) and Shanghai (China). FTDI Chip develops innovative silicon solutions that enhance interaction with the latest in global technology. The major objective from the company is to ‘bridge technologies’ in order to support engineers with highly sophisticated, feature-rich, robust and simple-to-use product platforms. FTDI Chip continues its philosophy of Design Made Easy, where it strives to incorporate device and system features in its chips that enable the designer to quickly and easily create and implement designs. We supplement this strategy, with WW regional support and a “total” solutions mindset to provide reduced development and debug costs and a fast time to market.

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