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CYUSB3343-BZXI

Infineon Technologies

CYUSB3343-BZXI by Infineon Technologies

CYUSB3343-BZXI by Infineon Technologies is a BUS CONTROLLER IC with 121 terminals, operating at -40 to 85 °C. It supports data transfer rates up to 1.5 MBps and has a supply voltage range of 1.14V to 1.26V. Ideal for industrial applications requiring USB compatibility and CMOS technology in a compact square package design.

Median Price

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Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (In-Stock)

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Flip Electronics

USA . 2,789 parts In-Stock

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Vyrian

USA . 669 parts In-Stock

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669

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Digiode

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Chip Stock

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Nova Conductors

Japan . 44 parts In-Stock

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LWI Electronics Inc

India . 11 parts In-Stock

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Ampacity Inc.

Singapore . 1,347 parts In-Stock

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$1.000

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AZTECH Wire

Italy . 344 parts In-Stock

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$16.520

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Corohmni

South Africa . 1,181 parts In-Stock

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$59.625

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Modulus Dynamics

Lithuania . 3,393 parts In-Stock

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$63.461

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$60.923

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$58.384

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A-Z Elektronik GmbH

Germany . 6,825 parts In-Stock

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Continental Prestige Electronics

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Alle Elektronik GmbH

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Argo Parts USA

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Authorized Procurement Solutions

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Kepictronics

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Corphita

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Microchip USA

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Bastille Electronics

Australia . 10 parts In-Stock

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Overview

Unlock seamless data transfer with the CYUSB3343-BZXI from Infineon Technologies. As a leading manufacturer in the industry, Infineon guarantees top-notch quality and reliability. This versatile bus controller is perfect for a wide range of applications, offering high-speed data transfer rates and compatibility with various bus systems. Experience effortless connectivity and streamlined operations with the CYUSB3343-BZXI, providing unparalleled value and performance to meet all your needs. Elevate your technology solutions today with this exceptional product.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the internal components of the bus controller, ensuring longevity and reliability.

Surface Mount: YES

Allows for easy and secure installation onto circuit boards, saving space and making it suitable for compact designs.

Maximum Supply Voltage: 1.26 V

Can handle a high supply voltage, providing flexibility and compatibility with various power sources.

Package Shape: SQUARE

Square shape helps in easy placement and alignment during manufacturing processes, improving efficiency.

No. of Terminals: 121

High number of terminals allow for versatile connectivity options, making it suitable for complex bus control applications.

Package Style (Meter): GRID ARRAY, THIN PROFILE, FINE PITCH

Grid array design with thin profile and fine pitch enables dense packing of components, optimizing space utilization.

Minimum Supply Voltage: 1.14 V

Supports a low minimum supply voltage, making it energy-efficient and suitable for battery-powered devices.

Maximum Operating Temperature: 85 °C

Can operate effectively in high-temperature environments, ensuring reliable performance under challenging conditions.

Maximum Data Transfer Rate: 1.5 MBps

High data transfer rate allows for fast and efficient communication between devices connected to the bus controller.

Minimum Operating Temperature: -40 °C

Can function in extreme cold conditions, making it suitable for a wide range of environmental settings.

Terminal Position: BOTTOM

Bottom terminal position facilitates easy connection to other components on the circuit board, simplifying assembly processes.

Maximum Seated Height: 1.2 mm

Low seated height reduces the overall profile of the bus controller, making it suitable for slim and compact device designs.

Width: 10 mm

Compact width dimensions allow for space-efficient integration into circuit board layouts.

Length: 10 mm

Compact length dimensions enable the bus controller to fit comfortably within limited space constraints.

Temperature Grade: INDUSTRIAL

Industrial-grade temperature rating ensures reliable operation in harsh industrial environments.

Peripheral IC Type: BUS CONTROLLER, UNIVERSAL SERIAL BUS

Supports universal serial bus communication protocols, making it compatible with a wide range of devices and systems.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, enhancing the efficiency and reliability of the bus controller.

Terminal Form: BALL

Ball terminal form provides secure connections and reliable performance in various operating conditions.

Nominal Supply Voltage: 1.2 V

Stable nominal supply voltage ensures consistent and optimal performance of the bus controller.

Bus Compatibility: I2C; VBUS

Supports I2C and VBUS bus interfaces, allowing for versatile connectivity with a wide range of devices and peripherals.

Terminal Pitch: 0.8 mm

Fine terminal pitch enables high-density mounting of the bus controller on circuit boards, optimizing space usage.

Technical Specifications

Bus Controllers CYUSB3343-BZXI attributes and parameters. Explore more Bus Controllers devices from Infineon Technologies

Specs

Address Bus Width:

0

Bus Compatibility:

I2C; VBUS

Maximum Data Transfer Rate:

1.5 MBps

External Data Bus Width:

0

JESD-30 Code:

S-PBGA-B121

Length:

10 mm

No. of Terminals:

121

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

GRID ARRAY, THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

NOT SPECIFIED

Maximum Seated Height:

1.2 mm

Maximum Supply Voltage:

1.26 V

Minimum Supply Voltage:

1.14 V

Nominal Supply Voltage:

1.2 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

10 mm

Trade Compliance

CYUSB3343-BZXI Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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