Loading...

CYUSB3017-BZXI

Infineon Technologies

CYUSB3017-BZXI by Infineon Technologies

CYUSB3017-BZXI by Infineon Technologies is a bus controller with a max data transfer rate of 625 MBps. It has a universal serial bus (USB) peripheral IC type and is compatible with I2C, SPI, and USB buses. This device is commonly used in applications requiring high-speed data transfer.

Median Price

$17.700

Lifecycle Status

Suppliers In-Stock

12

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Farnell

UK . 333 parts In-Stock

1+ parts

$15.940

100+ parts

$10.690

1k+ parts

-

10k+ parts

-

333

$15.940

$10.690

-

-

Newark

USA . 329 parts In-Stock

1+ parts

$25.320

100+ parts

$17.650

1k+ parts

$16.710

10k+ parts

-

329

$25.320

$17.650

$16.710

-

Mouser Electronics

USA . 244 parts In-Stock

1+ parts

$27.050

100+ parts

$18.780

1k+ parts

$17.640

10k+ parts

-

244

$27.050

$18.780

$17.640

-

Element14

Singapore . 336 parts In-Stock

1+ parts

$32.230

100+ parts

$28.680

1k+ parts

-

10k+ parts

-

336

$32.230

$28.680

-

-

DigiKey

USA . 445 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$10.570

10k+ parts

-

445

-

-

$10.570

-

Flip Electronics (Authorized)

USA . 445 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

445

-

-

-

-

Rochester

USA . 396 parts In-Stock

1+ parts

-

100+ parts

$14.160

1k+ parts

$12.670

10k+ parts

$11.930

396

-

$14.160

$12.670

$11.930

Verical

USA . 396 parts In-Stock

1+ parts

-

100+ parts

$17.700

1k+ parts

$15.838

10k+ parts

$14.912

396

-

$17.700

$15.838

$14.912

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 290 parts In-Stock

1+ parts

$12.692

100+ parts

-

1k+ parts

-

10k+ parts

-

290

$12.692

-

-

-

Nova Conductors

Japan . 69 parts In-Stock

1+ parts

$23.640

100+ parts

-

1k+ parts

-

10k+ parts

-

69

$23.640

-

-

-

Flip Electronics

USA . 445 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

445

-

-

-

-

Vyrian

USA . 309 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

309

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 233 parts In-Stock

1+ parts

$8.530

100+ parts

-

1k+ parts

-

10k+ parts

-

233

$8.530

-

-

-

Corphita

USA . 828 parts In-Stock

1+ parts

$12.024

100+ parts

-

1k+ parts

-

10k+ parts

-

828

$12.024

-

-

-

Continental Prestige Electronics

USA . 336 parts In-Stock

1+ parts

$23.460

100+ parts

-

1k+ parts

-

10k+ parts

-

336

$23.460

-

-

-

Modulus Dynamics

Lithuania . 2,389 parts In-Stock

1+ parts

$45.279

100+ parts

$43.468

1k+ parts

$41.657

10k+ parts

-

2,389

$45.279

$43.468

$41.657

-

Argo Parts USA

USA . 3,388 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,388

-

-

-

-

Netroflash

USA . 1,000 parts In-Stock

1+ parts

-

100+ parts

$23.167

1k+ parts

$22.458

10k+ parts

$21.985

1,000

-

$23.167

$22.458

$21.985

Overview

Experience seamless and high-speed data transfer with the CYUSB3017-BZXI by Infineon Technologies. As a leading manufacturer in the industry, Infineon Technologies ensures top-notch quality and reliability in their products. The CYUSB3017-BZXI belongs to the category of bus controllers and is designed to deliver exceptional performance. With its advanced features and compatibility with I2C, SPI, and USB, this product offers endless possibilities for various applications. Whether you're working on IoT devices or consumer electronics, the CYUSB3017-BZXI provides unmatched value, benefits, and advantages for all your connectivity needs. Trust in Infineon Technologies and elevate your projects to new heights.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This product's package body material is made of plastic/epoxy, which provides durability and protection for the bus controller, making it a reliable choice.

Surface Mount: YES

With a surface mount option, this bus controller can be easily mounted on a circuit board, simplifying the installation process and enhancing convenience.

Maximum Supply Voltage: 1.25 V

This bus controller can handle a maximum supply voltage of 1.25V, ensuring compatibility with various power sources and allowing for flexible integration into different systems.

Address Bus Width: 2

The 2-bit address bus width enables efficient communication between the bus controller and other components, enhancing overall system performance.

Package Shape: SQUARE

Featuring a square package shape, this bus controller optimizes board space utilization and facilitates a more organized circuit layout.

No. of Terminals: 121

With 121 terminals, this bus controller offers a sufficient number of connections for multiple peripheral devices, providing versatility in system design.

Package Style (Meter): GRID ARRAY, THIN PROFILE, FINE PITCH

The grid array, thin profile, and fine pitch package style enhances the overall compactness and preciseness of the bus controller, making it suitable for space-constrained applications.

Minimum Supply Voltage: 1.15 V

This bus controller can function reliably even at a minimum supply voltage of 1.15V, allowing for efficient power consumption and flexibility in low-power systems.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature of 85 °C, this bus controller can withstand demanding environmental conditions, making it suitable for industrial applications.

Maximum Data Transfer Rate: 625 MBps

The exceptionally high data transfer rate of 625 MBps enables rapid and efficient communication between the bus controller and connected devices, ensuring smooth operation and quick data processing.

Minimum Operating Temperature: -40 °C

Designed to operate reliably in extreme temperatures, this bus controller can function seamlessly even at a low minimum operating temperature of -40 °C, making it suitable for rugged environments.

Terminal Position: BOTTOM

The bottom terminal position facilitates easy connection and integration of the bus controller into the overall system layout, enhancing convenience during installation and maintenance.

Maximum Seated Height: 1.2 mm

With a maximum seated height of 1.2 mm, this bus controller ensures a compact and low-profile design, allowing for improved space utilization and compatibility with various device enclosures.

Width: 10 mm

With a width of 10 mm, this bus controller offers a compact form factor, enabling efficient board space utilization and allowing for miniaturized device designs.

External Data Bus Width: 32

The 32-bit external data bus width allows for high-speed data transmission between the bus controller and external devices, improving overall system performance and data processing capabilities.

Maximum Clock Frequency: 52 MHz

With a maximum clock frequency of 52 MHz, this bus controller can operate at high speeds, enabling fast data transfer rates and ensuring efficient system functioning.

Length: 10 mm

With a length of 10 mm, this bus controller offers a compact size, contributing to efficient board space utilization and facilitating integration into various device designs.

Peripheral IC Type: BUS CONTROLLER, UNIVERSAL SERIAL BUS

As a bus controller for universal serial bus (USB) connectivity, this product allows for seamless communication between a variety of peripheral devices and the host system, enhancing functionality and versatility.

Technology: CMOS

Built using CMOS technology, this bus controller ensures low power consumption, high noise immunity, and reliable performance, making it a suitable choice for a wide range of applications.

Terminal Form: BALL

The ball terminal form simplifies the installation process by allowing for soldering or mounting via ball grid array (BGA) technology, ensuring secure and robust connections.

Maximum Supply Current: 200 mA

With a maximum supply current of 200 mA, this bus controller operates within a reasonable power range, contributing to energy efficiency and compatibility with various power sources.

Nominal Supply Voltage: 1.2 V

The nominal supply voltage of 1.2V ensures stable and reliable operation, providing consistent performance and compatibility with typical voltage levels in electronic systems.

Bus Compatibility: I2C, SPI, USB

This bus controller supports a wide range of bus protocols, including I2C, SPI, and USB, enabling seamless integration with various devices and increasing system versatility.

Terminal Pitch: 0.8 mm

With a terminal pitch of 0.8 mm, this bus controller provides easy access for electrical connections, simplifying the installation process and ensuring reliable signal transmission.

Moisture Sensitivity Level (MSL): 3

The moisture sensitivity level of 3 indicates that this bus controller has a low sensitivity to moisture, making it suitable for use in humid or damp environments.

Technical Specifications

Bus Controllers CYUSB3017-BZXI attributes and parameters. Explore more Bus Controllers devices from Infineon Technologies

Specs

Address Bus Width:

2

Bus Compatibility:

I2C, SPI, USB

Maximum Clock Frequency:

52 MHz

Maximum Data Transfer Rate:

625 MBps

External Data Bus Width:

32

JESD-30 Code:

S-PBGA-B121

Length:

10 mm

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

121

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA121,11X11,32

Package Shape:

Package Style (Meter):

GRID ARRAY, THIN PROFILE, FINE PITCH

Maximum Seated Height:

1.2 mm

Maximum Supply Current:

200 mA

Maximum Supply Voltage:

1.25 V

Minimum Supply Voltage:

1.15 V

Nominal Supply Voltage:

1.2 V

Surface Mount:

YES

Technology:

CMOS

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Width:

10 mm

Trade Compliance

CYUSB3017-BZXI Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

previous next
The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

Category top products 20

Authentic purchasing experiences

Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.

Similar products 20