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CYUSB2014-BZXC

Infineon Technologies

CYUSB2014-BZXC by Infineon Technologies

CYUSB2014-BZXC by Infineon Technologies is a BUS CONTROLLER with 32-bit External Data Bus Width, operating at up to 19.2 MHz clock frequency. It features a max data transfer rate of 625 MBps and supports various bus compatibility standards like I2C, I2S, SMBUS, SPI, UART, and USB. Ideal for applications requiring high-speed data transfer in commercial temperature environments.

Median Price

$18.540

Lifecycle Status

Suppliers In-Stock

13

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Chip1Stop

Japan . 840 parts In-Stock

1+ parts

$12.800

100+ parts

-

1k+ parts

-

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840

$12.800

-

-

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Arrow

USA . 237 parts In-Stock

1+ parts

$14.460

100+ parts

-

1k+ parts

-

10k+ parts

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237

$14.460

-

-

-

DigiKey

USA . 892 parts In-Stock

1+ parts

$22.620

100+ parts

$17.002

1k+ parts

$14.820

10k+ parts

-

892

$22.620

$17.002

$14.820

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Newark

USA . 5 parts In-Stock

1+ parts

$23.300

100+ parts

$15.880

1k+ parts

$15.470

10k+ parts

-

5

$23.300

$15.880

$15.470

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Mouser Electronics

USA . 967 parts In-Stock

1+ parts

$25.790

100+ parts

$17.900

1k+ parts

$17.220

10k+ parts

-

967

$25.790

$17.900

$17.220

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Flip Electronics (Authorized)

USA . 4,149 parts In-Stock

1+ parts

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4,149

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-

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Verical

USA . 2,408 parts In-Stock

1+ parts

-

100+ parts

$11.536

1k+ parts

-

10k+ parts

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2,408

-

$11.536

-

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 495 parts In-Stock

1+ parts

$8.636

100+ parts

-

1k+ parts

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10k+ parts

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495

$8.636

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-

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Nova Conductors

Japan . 91 parts In-Stock

1+ parts

$17.210

100+ parts

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91

$17.210

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Chip Stock

USA . 20,500 parts In-Stock

1+ parts

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100+ parts

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20,500

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Flip Electronics

USA . 2,419 parts In-Stock

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2,419

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Vyrian

USA . 604 parts In-Stock

1+ parts

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DigiKey Marketplace

USA . 484 parts In-Stock

1+ parts

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484

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 531 parts In-Stock

1+ parts

$8.181

100+ parts

-

1k+ parts

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10k+ parts

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531

$8.181

-

-

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Semicontronic

India . 925 parts In-Stock

1+ parts

$11.260

100+ parts

$10.978

1k+ parts

$10.922

10k+ parts

-

925

$11.260

$10.978

$10.922

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Ampacity Inc.

Singapore . 857 parts In-Stock

1+ parts

$11.260

100+ parts

-

1k+ parts

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857

$11.260

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Netroflash

USA . 100 parts In-Stock

1+ parts

$17.210

100+ parts

-

1k+ parts

$16.349

10k+ parts

$16.005

100

$17.210

-

$16.349

$16.005

Modulus Dynamics

Lithuania . 3,476 parts In-Stock

1+ parts

$41.677

100+ parts

$40.010

1k+ parts

$38.343

10k+ parts

-

3,476

$41.677

$40.010

$38.343

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Advanced Electronics

New Zealand . 1,000 parts In-Stock

1+ parts

$67.159

100+ parts

$63.801

1k+ parts

$63.801

10k+ parts

-

1,000

$67.159

$63.801

$63.801

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Aztec Data Supply Inc.

USA . 4,743 parts In-Stock

1+ parts

$81.471

100+ parts

-

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10k+ parts

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4,743

$81.471

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Corohmni

South Africa . 165 parts In-Stock

1+ parts

$82.720

100+ parts

-

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165

$82.720

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QUARKTWIN TECHNOLOGY LTD

USA . 13,363 parts In-Stock

1+ parts

-

100+ parts

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13,363

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A-Z Elektronik GmbH

Germany . 7,266 parts In-Stock

1+ parts

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7,266

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Futuretech Components

Singapore . 5,000 parts In-Stock

1+ parts

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Alle Elektronik GmbH

Germany . 4,844 parts In-Stock

1+ parts

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4,844

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RC Electronics

USA . 3,600 parts In-Stock

1+ parts

-

100+ parts

$21.620

1k+ parts

$20.380

10k+ parts

$19.970

3,600

-

$21.620

$20.380

$19.970

Authorized Procurement Solutions

USA . 3,000 parts In-Stock

1+ parts

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100+ parts

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3,000

-

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Continental Prestige Electronics

USA . 2,600 parts In-Stock

1+ parts

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2,600

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Argo Parts USA

USA . 2,012 parts In-Stock

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2,012

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Kepictronics

USA . 1,000 parts In-Stock

1+ parts

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100+ parts

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1,000

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Overview

Revolutionize your connectivity with the CYUSB2014-BZXC by Infineon Technologies. As a leading manufacturer in the industry, Infineon delivers top-quality Bus Controllers for seamless integration in a wide range of applications. This versatile product offers unmatched value and benefits, providing customers with high-speed data transfer rates of up to 625 MBps and compatibility with various bus protocols like I2C, SPI, and UART. Upgrade your system with the CYUSB2014-BZXC and experience superior performance and reliability like never before.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/epoxy material provides durability and reliability for the bus controller, ensuring a long lifespan.

Surface Mount: YES

Surface mount capability allows for easy and efficient installation on circuit boards.

Maximum Supply Voltage: 1.25 V

1.25V maximum supply voltage ensures safe operation within specified limits.

Address Bus Width: 2

An address bus width of 2 allows for efficient communication and addressability within the system.

Package Shape: SQUARE

Square package shape provides a compact design for space-constrained applications.

No. of Terminals: 121

121 terminals offer a high level of connectivity for various input/output options.

Package Style (Meter): GRID ARRAY, THIN PROFILE, FINE PITCH

Grid array, thin profile, and fine pitch package style enables high-density mounting and efficient signal routing.

Minimum Supply Voltage: 1.15 V

1.15V minimum supply voltage ensures reliable operation even under low voltage conditions.

Maximum Operating Temperature: 70 °C

Operating temperature up to 70°C allows for use in a wide range of environments.

Maximum Data Transfer Rate: 625 MBps

High data transfer rate of 625 MBps enables fast and efficient data communication within the system.

Minimum Operating Temperature: 0 °C

Operating temperature down to 0°C ensures usability in colder environments.

Terminal Finish: TIN SILVER COPPER

Tin, silver, copper terminal finish provides good conductivity and corrosion resistance for reliable connections.

Terminal Position: BOTTOM

Bottom terminal position allows for easy accessibility during installation and maintenance.

Maximum Seated Height: 1.2 mm

Low seated height of 1.2 mm helps in achieving a slim profile for the overall application.

Width: 10 mm

10mm width offers a compact form factor for space-constrained applications.

External Data Bus Width: 32

External data bus width of 32 provides a high-speed data interface for efficient communication.

Maximum Clock Frequency: 19.2 MHz

High clock frequency of 19.2 MHz allows for fast processing and data transmission.

Length: 10 mm

10mm length offers a compact design for space-efficient integration.

Temperature Grade: COMMERCIAL

Commercial temperature grade ensures compatibility with standard operating conditions.

Peripheral IC Type: BUS CONTROLLER, UNIVERSAL SERIAL BUS

Bus controller with USB compatibility provides versatile connectivity options for various devices.

Technology: CMOS

CMOS technology offers low power consumption and high-speed operation for efficient performance.

Terminal Form: BALL

Ball terminal form facilitates easy soldering and reliable connection with the circuit board.

Maximum Supply Current: 200 mA

Maximum supply current of 200 mA ensures the device operates within safe current limits.

Nominal Supply Voltage: 1.2 V

Nominal supply voltage of 1.2V provides stable power for optimal performance.

Bus Compatibility: I2C, I2S, SMBUS, SPI, UART, USB

Compatibility with various bus protocols allows for flexible integration with different systems and devices.

Terminal Pitch: 0.8 mm

Terminal pitch of 0.8 mm enables high-density mounting and efficient routing of signals.

Moisture Sensitivity Level (MSL): 3

Moisture sensitivity level of 3 ensures the device can withstand moderate exposure to moisture during handling and storage.

Technical Specifications

Bus Controllers CYUSB2014-BZXC attributes and parameters. Explore more Bus Controllers devices from Infineon Technologies

Specs

Address Bus Width:

2

Bus Compatibility:

I2C, I2S, SMBUS, SPI, UART, USB

Maximum Clock Frequency:

19.2 MHz

Maximum Data Transfer Rate:

625 MBps

External Data Bus Width:

32

JESD-30 Code:

S-PBGA-B121

JESD-609 Code:

e1

Length:

10 mm

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

121

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA121,11X11,32

Package Shape:

Package Style (Meter):

GRID ARRAY, THIN PROFILE, FINE PITCH

Maximum Seated Height:

1.2 mm

Maximum Supply Current:

200 mA

Maximum Supply Voltage:

1.25 V

Minimum Supply Voltage:

1.15 V

Nominal Supply Voltage:

1.2 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Width:

10 mm

Trade Compliance

CYUSB2014-BZXC Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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