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TUSB3200ACPAHR

Texas Instruments

TUSB3200ACPAHR by Texas Instruments

TUSB3200ACPAHR by Texas Instruments is a 52-terminal BUS CONTROLLER IC with CMOS technology. It operates b/w 0-70°C, supports USB interface, and has a supply voltage range of 3-3.6V. Ideal for applications requiring thin profile components in commercial-grade electronics.

Median Price

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Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 5,493 parts In-Stock

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Chip Stock

USA . 4,040 parts In-Stock

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Digiode

USA . 2,135 parts In-Stock

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Nova Conductors

Japan . 50 parts In-Stock

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Connect4Technologies Inc.

Canada . 16 parts In-Stock

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Distributors (Availability)

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AZTECH Wire

Italy . 431 parts In-Stock

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$12.337

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431

$12.337

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Semicontronic

India . 490 parts In-Stock

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$13.000

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$12.675

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$12.610

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490

$13.000

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$12.610

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Parana Technologies

USA . 2,333 parts In-Stock

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$15.907

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$16.260

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$15.907

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$16.260

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Corohmni

South Africa . 50 parts In-Stock

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$17.127

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DigiPath Technology Company

USA . 652 parts In-Stock

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$17.516

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$16.114

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$17.516

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ChromeModa Solutions

Germany . 292 parts In-Stock

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$17.873

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$14.656

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$17.873

$14.656

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IDEA Electronic Components Group

UK . 55 parts In-Stock

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$17.873

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$16.979

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$16.086

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55

$17.873

$16.979

$16.086

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Ampacity Inc.

Singapore . 1,093 parts In-Stock

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$23.000

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One Stop Electronics

USA . 546 parts In-Stock

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$35.000

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QUARKTWIN TECHNOLOGY LTD

USA . 17,506 parts In-Stock

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Lixinc

USA . 16,226 parts In-Stock

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Microchip USA

USA . 4,455 parts In-Stock

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Argo Parts USA

USA . 2,693 parts In-Stock

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Kepictronics

USA . 2,543 parts In-Stock

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Authorized Procurement Solutions

USA . 2,500 parts In-Stock

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Continental Prestige Electronics

USA . 1,363 parts In-Stock

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Corphita

USA . 895 parts In-Stock

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Bastille Electronics

Australia . 40 parts In-Stock

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Overview

Unlock seamless data communication and connectivity with the TUSB3200ACPAHR by Texas Instruments. As a leading manufacturer in the industry, Texas Instruments guarantees top-notch quality and reliability. This bus controller is perfect for a wide range of applications, offering users unparalleled performance and efficiency. Experience the value of faster data transfer speeds, enhanced connectivity, and simplified integration with this innovative product. Elevate your projects to new heights with the TUSB3200ACPAHR.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material makes the package lightweight and durable, ideal for portable bus controller applications.

Surface Mount: YES

Surface mount option makes it easy to integrate this bus controller into compact electronic designs.

Maximum Supply Voltage: 3.6 V

Allows for a wide range of compatible power sources, ensuring flexibility in system design.

No. of Terminals: 52

Ample terminals provide connectivity options for various components in the system, enhancing versatility.

Minimum Operating Temperature: 0 °C

Capable of operating at low temperatures, making it suitable for diverse environmental conditions.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, improving efficiency and reliability.

Nominal Supply Voltage: 3.3 V

Stable supply voltage ensures consistent performance of the bus controller in different operating conditions.

Technical Specifications

Bus Controllers TUSB3200ACPAHR attributes and parameters. Explore more Bus Controllers devices from Texas Instruments

Specs

Additional Features:

ALSO HAVING SECONDARY DIGITAL SUPPLY 5V(TYP).

JESD-30 Code:

S-PQFP-G52

JESD-609 Code:

e4

Length:

10 mm

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

52

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

FLATPACK, THIN PROFILE

Peak Reflow Temperature (C):

260

Qualification:

Not Qualified

Maximum Seated Height:

1.2 mm

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

10 mm

Trade Compliance

TUSB3200ACPAHR Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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