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CY7C65630-56LTXIT

Infineon Technologies

CY7C65630-56LTXIT by Infineon Technologies

CY7C65630-56LTXIT by Infineon Technologies is a 3.3V bus controller with 56 terminals, operating at -40 to 85°C. It features a max clock frequency of 24 MHz and uses CMOS technology. This IC is ideal for industrial applications requiring USB bus control in compact spaces.

Median Price

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Lifecycle Status

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7

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1k+

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Digiode

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Nova Conductors

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Martec Srl

Italy . 37 parts In-Stock

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AZTECH Wire

Italy . 766 parts In-Stock

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Semicontronic

India . 119 parts In-Stock

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$11.000

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$10.725

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$10.670

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Ampacity Inc.

Singapore . 106 parts In-Stock

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Advanced Electronics

New Zealand . 97 parts In-Stock

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Modulus Dynamics

Lithuania . 2,402 parts In-Stock

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Aztec Data Supply Inc.

USA . 323 parts In-Stock

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Overview

Unlock the potential of your electronic devices with the CY7C65630-56LTXIT from Infineon Technologies, a leading manufacturer known for its high-quality products. As a bus controller, this versatile component offers seamless communication between different parts of your system, ensuring smooth operation and enhanced performance. With a wide range of applications, including industrial settings, the CY7C65630-56LTXIT is a reliable solution that provides value and benefits to customers looking for top-notch quality and efficiency in their electronic designs. Trust Infineon Technologies for cutting-edge technology that delivers results.

Feature Benefit Bullets

Surface Mount: YES

Surface Mount technology allows for easy and efficient soldering onto circuit boards, making the product easy to integrate into electronic devices.

Maximum Supply Voltage: 3.45 V

Allows for compatibility with a wide range of power sources, increasing the versatility of the product.

Package Shape: SQUARE

The square package shape helps in optimizing space on the circuit board, making it suitable for compact electronic designs.

Power Supplies (V): 3.3

Standard power supply voltage ensures compatibility and ease of integration with existing electronic systems.

No. of Terminals: 56

Having a high number of terminals allows for increased connectivity options and functionality.

Package Style (Meter): CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

The combination of different package styles provides flexibility in mounting and thermal management, making the product suitable for various applications.

Minimum Supply Voltage: 3.15 V

Ensures reliable operation even when the power supply voltage drops slightly, enhancing the product's stability.

Maximum Operating Temperature: 85 °C

High operating temperature range ensures the product can perform well in demanding environments without overheating.

Minimum Operating Temperature: -40 °C

Wide temperature range allows the product to function in extreme cold conditions, increasing its usability in various settings.

Terminal Finish: NICKEL PALLADIUM GOLD

The terminal finish provides excellent conductivity, corrosion resistance, and durability, ensuring reliable electrical connections.

Terminal Position: QUAD

Quad terminal position facilitates easy and secure connection to the circuit board, enhancing the product's reliability.

Maximum Seated Height: 1 mm

Low seated height allows for a slim profile, making the product suitable for space-constrained electronic designs.

Width: 8 mm

Compact width dimension enables easy integration into circuit board layouts, optimizing space utilization.

Maximum Clock Frequency: 24 MHz

High clock frequency capability allows for fast data processing and communication, enhancing the product's performance.

Maximum Time At Peak Reflow Temperature (s): 30

The short reflow time ensures quick and efficient soldering during manufacturing, reducing production cycle times.

Peak Reflow Temperature °C: 260

High peak reflow temperature tolerance ensures reliable solder joints during the assembly process, improving product quality.

Length: 8 mm

Compact length dimension helps in space-saving integration within electronic devices, enhancing overall design efficiency.

Temperature Grade: INDUSTRIAL

Industrial-grade temperature rating ensures the product can withstand harsh operating environments, making it suitable for industrial applications.

Peripheral IC Type: BUS CONTROLLER, UNIVERSAL SERIAL BUS

Being a universal serial bus (USB) bus controller allows for versatile and standardized communication interfaces, increasing compatibility with various devices.

Technology: CMOS

CMOS technology offers low power consumption, high speed, and reliable performance, making the product efficient and durable.

Terminal Form: NO LEAD

No lead terminal form complies with environmental regulations and RoHS requirements, making the product environmentally friendly.

Maximum Supply Current: 260 mA

High maximum supply current capacity ensures stable and consistent power delivery, enhancing the product's reliability in operation.

Nominal Supply Voltage: 3.3 V

Standard nominal supply voltage ensures compatibility with most electronic systems, simplifying integration and usage.

Terminal Pitch: 0.5 mm

Fine terminal pitch allows for compact layout design on the circuit board, optimizing space usage and increasing connectivity options.

Moisture Sensitivity Level (MSL): 3

Moisture sensitivity level 3 indicates the product can withstand standard moisture exposure during handling and storage, ensuring product reliability.

Technical Specifications

Bus Controllers CY7C65630-56LTXIT attributes and parameters. Explore more Bus Controllers devices from Infineon Technologies

Specs

Maximum Clock Frequency:

24 MHz

JESD-30 Code:

S-XQCC-N56

JESD-609 Code:

e4

Length:

8 mm

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

56

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

UNSPECIFIED

Package Code:

Package Equivalence Code:

LCC56,.31SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Qualification:

Not Qualified

Maximum Seated Height:

1 mm

Sub-Category:

Bus Controllers

Maximum Supply Current:

260 mA

Maximum Supply Voltage:

3.45 V

Minimum Supply Voltage:

3.15 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

8 mm

Trade Compliance

CY7C65630-56LTXIT Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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