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SC18IS600IBS,128

NXP Semiconductors

SC18IS600IBS,128 by NXP Semiconductors

NXP Semiconductors' SC18IS600IBS,128 is a bus controller with 24 terminals and operates at 2.4-3.6V. It has a clock frequency of 18MHz, suitable for industrial applications requiring I2C communication. The chip carrier package style with a low profile makes it ideal for compact designs in harsh environments.

Median Price

$1.198

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 58 parts In-Stock

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$1.198

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Vyrian

USA . 8,188 parts In-Stock

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Digiode

USA . 2,544 parts In-Stock

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Anansix

USA . 716 parts In-Stock

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Distributors (Availability)

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Aranea Global

USA . 1,000 parts In-Stock

1+ parts

$1.174

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$1.127

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1,000

$1.174

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$1.127

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Continental Prestige Electronics

USA . 943 parts In-Stock

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$1.198

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$1.174

943

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Argo Parts USA

USA . 926 parts In-Stock

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$1.198

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926

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Ampacity Inc.

Singapore . 727 parts In-Stock

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$2.000

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Microchip USA

USA . 191 parts In-Stock

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$6.186

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AZTECH Wire

Italy . 216 parts In-Stock

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$10.060

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Semicontronic

India . 359 parts In-Stock

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$21.000

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$20.475

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$20.370

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359

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One Stop Electronics

USA . 1,495 parts In-Stock

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$27.000

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Corohmni

South Africa . 924 parts In-Stock

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$82.881

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UNI Independent Distributors

Spain . 6,051 parts In-Stock

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Corphita

USA . 4,670 parts In-Stock

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Futuretech Components

Singapore . 1,000 parts In-Stock

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Perfect Parts

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Overview

Unlock seamless communication and data transfer with the SC18IS600IBS,128 by NXP Semiconductors. Designed for industrial-grade applications, this bus controller offers reliability and efficiency in a compact package. With a maximum clock frequency of 18 MHz and a wide temperature range, this peripheral IC is perfect for various electronic devices. Experience the quality and innovation of NXP Semiconductors with the SC18IS600IBS,128, providing unmatched value and performance for your engineering needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the internal components of the bus controller.

Surface Mount: YES

Enables easy installation onto circuit boards, saving time and effort during assembly.

Maximum Supply Voltage: 3.6 V

Supports a wide range of power sources, making the bus controller versatile for different applications.

Package Shape: SQUARE

Facilitates efficient use of space on the circuit board.

Power Supplies (V): 2.4/3.6

Offers flexibility in power input options for the bus controller.

No. of Terminals: 24

Provides multiple connection points for interfacing with other components in the system.

Package Style (Meter): CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Allows for different mounting options to suit the specific needs of the application.

Minimum Supply Voltage: 2.4 V

Ensures reliable operation even when power source is at a lower voltage.

Maximum Operating Temperature: 85 °C

Can handle high temperature environments without performance degradation.

Minimum Operating Temperature: -40 °C

Capable of functioning in extreme cold conditions.

Terminal Finish: Nickel/Palladium/Gold (Ni/Pd/Au)

Provides good conductivity and corrosion resistance for the terminal connections.

Terminal Position: QUAD

Facilitates easy soldering and connection of terminals on the circuit board.

Maximum Seated Height: 1 mm

Allows for compact design and integration into tight spaces.

Width: 4 mm

Compact size of the bus controller makes it suitable for applications with space constraints.

Maximum Clock Frequency: 18 MHz

Supports fast data transfer rates, improving the efficiency of the bus controller.

Maximum Time At Peak Reflow Temperature (s): 30

Ensures that the bus controller can withstand high temperature soldering processes during assembly.

Peak Reflow Temperature °C: 260

Withstands high temperature reflow soldering without damage.

Length: 4 mm

Compact length of the bus controller contributes to efficient use of space on the circuit board.

Temperature Grade: INDUSTRIAL

Suitable for industrial environments where temperature fluctuations are common.

Peripheral IC Type: BUS CONTROLLER, I2C

Specifically designed for bus control applications using the I2C protocol.

Technology: CMOS

Utilizes CMOS technology for efficient power consumption and reliable performance.

Terminal Form: NO LEAD

Eliminates the risk of lead contamination and complies with environmental regulations.

Maximum Supply Current: 16 mA

Low power consumption of the bus controller helps in reducing overall energy usage.

Terminal Pitch: 0.5 mm

Fine pitch terminals enable high-density mounting on the circuit board, saving space.

Technical Specifications

Bus Controllers SC18IS600IBS,128 attributes and parameters. Explore more Bus Controllers devices from NXP Semiconductors

Specs

Address Bus Width:

0

Maximum Clock Frequency:

18 MHz

External Data Bus Width:

0

JESD-30 Code:

S-PQCC-N24

JESD-609 Code:

e4

Length:

4 mm

Moisture Sensitivity Level (MSL):

1

No. of Terminals:

24

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP16,.25

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Power Supplies (V):

2.4/3.6

Qualification:

Not Qualified

Maximum Seated Height:

1 mm

Sub-Category:

Bus Controllers

Maximum Supply Current:

16 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

2.4 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

4 mm

Peripheral IC Type:

Trade Compliance

SC18IS600IBS,128 Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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