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SC18IM700IPW-F

NXP Semiconductors

SC18IM700IPW-F by NXP Semiconductors

SC18IM700IPW-F by NXP Semiconductors is a dual-terminal bus controller designed for industrial applications. It operates b/w 2.4V and 3.6V, with a max temp of 85 °C and consumes up to 15mA. Its compact SO thin profile makes it ideal for space-constrained designs.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,730 parts In-Stock

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1,730

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Anansix

USA . 1,411 parts In-Stock

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1,411

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Vyrian

USA . 390 parts In-Stock

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390

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

One Stop Electronics

USA . 1,193 parts In-Stock

1+ parts

$3.000

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1,193

$3.000

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Corohmni

South Africa . 750 parts In-Stock

1+ parts

$16.770

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750

$16.770

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UNI Independent Distributors

Spain . 6,853 parts In-Stock

1+ parts

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6,853

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Corphita

USA . 1,622 parts In-Stock

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1,622

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Overview

Unlock seamless connectivity and unparalleled performance with the SC18IM700IPW-F from NXP Semiconductors. Designed for industrial applications, this bus controller excels in durability and efficiency across various environments. With its compact footprint and low power consumption, it’s perfect for enhancing your devices while ensuring reliability. Trust NXP's legacy of innovation to elevate your projects, offering unmatched quality and value that translate into real-world benefits.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy materials ensures durability and reliability in various environments, making it ideal for long-term applications.

Surface Mount: YES

Surface mount technology enables compact designs and efficient use of board space, allowing for higher density and improved performance in electronic systems.

Package Shape: RECTANGULAR

The rectangular shape contributes to easy alignment on PCB layouts and facilitates automated assembly, speeding up manufacturing processes.

Power Supplies (V): 2.4/3.6

Dual voltage supply options provide flexibility for various applications, allowing the device to be adaptable to different system requirements.

No. of Terminals: 16

A 16-terminal configuration offers a good balance of connectivity and functionality, suitable for a wide range of applications without being overly complex.

Package Style (Meter): SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

This package style allows for reduced footprint on PCBs, ideal for space-constrained designs while maintaining high performance.

Maximum Operating Temperature: 85 °C

With a maximum operating temperature of 85 °C, the product is suitable for industrial applications, ensuring reliable performance even in demanding conditions.

Minimum Operating Temperature: -40 °C

The capability to operate at -40 °C makes this device suitable for harsh environments, expanding its usability in a variety of outdoor and industrial applications.

Terminal Position: DUAL

Dual terminal positioning enhances layout versatility on PCBs, allowing for more efficient routing of signals.

Temperature Grade: INDUSTRIAL

An industrial temperature grade indicates that the product is designed for rigorous application environments, ensuring reliability and longevity.

Terminal Form: GULL WING

Gull wing terminals facilitate easy soldering and better mechanical stability, enhancing reliability in assembly and integration.

Maximum Supply Current: 15 mA

A low maximum supply current of 15 mA provides energy efficiency, making this product a great choice for battery-powered applications.

Terminal Pitch: 0.635 mm

A terminal pitch of 0.635 mm enables compact placements on PCBs, which is advantageous for high-density electronic designs.

Technical Specifications

Bus Controllers SC18IM700IPW-F attributes and parameters. Explore more Bus Controllers devices from NXP Semiconductors

Specs

JESD-30 Code:

R-PDSO-G16

No. of Terminals:

16

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP16,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Power Supplies (V):

2.4/3.6

Qualification:

Not Qualified

Sub-Category:

Bus Controllers

Maximum Supply Current:

15 mA

Surface Mount:

YES

Temperature Grade:

Terminal Form:

Terminal Pitch:

.635 mm

Terminal Position:

DUAL

Trade Compliance

SC18IM700IPW-F Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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